TSM-105-02-L-DV-A-P Equivalent & Substitute Parts

Part Overview

The TSM-105-02-L-DV-A-P is a rectangular connector header manufactured by Samtec Inc., designed for surface mount applications with 10 positions arranged in 2 rows at 0.100" (2.54mm) pitch. This connector is classified as a board-to-board or cable connector with male pin contacts and unshrouded design. The part is currently in active production status with 859 units in stock.

Substitute parts are identified when equivalent electrical and mechanical parameters align with the main part specifications, enabling direct replacement in applications where the connector serves the same functional role.

Substiute Parts

TSM-105-02-L-DV-A-P

Samtec Inc.In Stock: 911TSM-105-02-L-DV-A-P Datasheet

Current PartRFQ

146131-4

TE Connectivity AMP ConnectorsIn Stock: 4422146131-4 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TSM-105-02-L-DV-A-P is determined by alignment of the following critical parameters:

• Connector pitch: 0.100" (2.54mm)
• Number of positions: 10
• Number of rows: 2
• Row spacing: 0.100" (2.54mm)
• Contact type: Male pin
• Mounting type: Surface mount
• Termination method: Solder
• Fastening type: Push-Pull
• Insulation material: Liquid Crystal Polymer (LCP)
• Contact finish (mating): Gold
• Operating temperature range compatibility
• Flammability rating: UL94 V-0

The substitute part 146131-4 (TE Connectivity AMP Connectors) meets these core electrical and mechanical criteria, enabling functional equivalence in applications requiring a 10-position, 2-row, 2.54mm pitch surface mount header connector.

Parameter Comparison

Engineering Selection Recommendations

The TSM-105-02-L-DV-A-P is the preferred selection for new designs due to its active product status and ROHS3 compliance. This part is currently manufactured and supported by Samtec Inc.

The 146131-4 substitute is classified as obsolete and should be considered only for legacy system maintenance or repair applications where existing inventory exists. While this part meets the core electrical and mechanical substitution criteria, its obsolete status and REACH Affected classification present considerations for long-term supply chain planning. The substitute part carries a higher gold plating thickness (30.0µin versus 10.0µin) and a lower insulation height (0.090" versus 0.100"), which may affect mechanical fit in applications with tight tolerance requirements.

Frequently Asked Questions (FAQ)

Q: Can 146131-4 be used as a direct replacement for TSM-105-02-L-DV-A-P in new designs?

A: Both parts share identical pitch (0.100"), position count (10), row configuration (2 rows), contact type (male pin), mounting method (surface mount), and termination (solder). However, the TSM-105-02-L-DV-A-P is active production while 146131-4 is obsolete. New designs should specify the active part.

Q: What is the difference in insulation height between these parts?

A: The TSM-105-02-L-DV-A-P has an insulation height of 0.100" (2.54mm), while the 146131-4 measures 0.090" (2.29mm). This 0.010" difference may affect mechanical clearance in applications with constrained board spacing.

Q: Are there compliance differences between these parts?

A: The TSM-105-02-L-DV-A-P is ROHS3 Compliant and REACH Unaffected. The 146131-4 is RoHS Compliant and REACH Affected. Both meet UL94 V-0 flammability requirements.

Q: What is the difference in contact finish thickness?

A: The TSM-105-02-L-DV-A-P has 10.0µin (0.25µm) gold plating on mating contacts, while 146131-4 has 30.0µin (0.76µm). The thicker plating on the substitute may provide enhanced wear resistance in high-cycle mating applications.

Q: How do the connector types differ?

A: The TSM-105-02-L-DV-A-P is classified as cuttable, while 146131-4 is breakaway. Both allow position reduction, but the mechanical method differs between manufacturers.

Q: What packaging differences exist?

A: The TSM-105-02-L-DV-A-P is supplied in tube packaging, while 146131-4 is supplied in bulk packaging. This affects handling, storage, and automated assembly considerations.