TSI381-66ILV Equivalent & Substitute Parts

Part Overview

The TSI381-66ILV is a PCI-to-PCI Bridge Interface IC manufactured by Renesas Electronics Corporation in a 144-CABGA (13x13) package. This specialized interface component facilitates PCI protocol bridging applications with a 1.2V supply voltage requirement. The product is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing system support and new design implementations where PCI bridging functionality is required.

Substiute Parts

TSI381-66ILV

Renesas Electronics CorporationIn Stock: 1160TSI381-66ILV Datasheet

Current PartRFQ

PM8562B-F3EI

Microchip TechnologyIn Stock: 2307PM8562B-F3EI Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TSI381-66ILV is determined by the following critical parameters:

• Interface Protocol Compatibility: The substitute must support PCI or PCI Express bridging functionality to maintain system-level protocol compatibility
• Package Type & Mounting: Surface mount technology with compatible pin count and footprint dimensions
• Voltage Supply Requirements: Operating voltage specifications must align with system power delivery architecture
• Regulatory Compliance: RoHS3 and REACH compliance status ensures environmental and regulatory alignment
• Product Availability: Active product status with documented inventory availability

The PM8562B-F3EI from Microchip Technology meets these substitution criteria as an active, compliant interface component. However, this substitute operates within the PCI Express protocol domain rather than legacy PCI, representing a functional evolution suitable for systems capable of supporting PCIe bridging architecture.

Parameter Comparison

Engineering Selection Recommendations

For TSI381-66ILV Replacement:

The PM8562B-F3EI is the manufacturer-recommended substitute. Selection of this component is appropriate when:

• System architecture supports PCI Express protocol implementation
• Active product availability and long-term supply continuity are required
• Compliance with ROHS3 and REACH regulations is mandatory
• Surface mount assembly processes are in place

Considerations for Implementation:

The transition from PCI to PCI Express represents a protocol generation advancement. The PM8562B-F3EI operates as a Fanout PCIe Switch, providing enhanced bandwidth and protocol features compared to legacy PCI bridging. Moisture sensitivity level increases from MSL 3 to MSL 4, requiring adjusted handling procedures during manufacturing (72-hour floor life versus 168-hour floor life).

Frequently Asked Questions (FAQ)

Q: Can the PM8562B-F3EI directly replace the TSI381-66ILV in existing designs?

A: Direct pin-for-pin replacement is not applicable. The PM8562B-F3EI operates on PCI Express protocol while the TSI381-66ILV operates on legacy PCI protocol. System-level integration changes are required, including firmware updates and protocol stack modifications.

Q: What is the primary reason for seeking a substitute for the TSI381-66ILV?

A: The TSI381-66ILV is classified as obsolete. Manufacturer discontinuation necessitates identification of alternative components for ongoing production support and new system designs.

Q: Are there packaging compatibility concerns between these components?

A: Both components utilize surface mount technology. However, package footprints differ. The TSI381-66ILV uses 144-CABGA (13x13) while the PM8562B-F3EI uses a Module package type. PCB layout redesign is required.

Q: Do both components meet current environmental compliance standards?

A: Yes. Both the TSI381-66ILV and PM8562B-F3EI are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the significance of the different MSL ratings?

A: The TSI381-66ILV has MSL 3 (168-hour floor life) while the PM8562B-F3EI has MSL 4 (72-hour floor life). This affects component handling procedures during manufacturing. MSL 4 components require more frequent baking cycles and shorter exposure times to prevent moisture absorption.