TSD1G Equivalent & Substitute Parts

Part Overview

The TSD1G is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 400 V DC reverse voltage and 1 A average rectified current in a surface mount DO-214AC (SMA) package. This component is classified as Active product status and is RoHS3 compliant with unlimited moisture sensitivity level (MSL 1). The TSD1G operates across a junction temperature range of -55°C to 175°C and features standard recovery characteristics with reverse recovery time exceeding 500 ns at currents greater than 200 mA.

Equivalent and substitute parts are identified to provide design flexibility, accommodate supply chain variations, and support component sourcing alternatives while maintaining electrical and mechanical compatibility within specified parameter tolerances.

Substiute Parts

TSD1G

Taiwan Semiconductor CorporationIn Stock: 1652TSD1G Datasheet

Current PartRFQ

ES1G

Good-Ark SemiconductorIn Stock: 415377ES1G Datasheet

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US1GHE3_A/H

Vishay General Semiconductor - Diodes DivisionIn Stock: 59196US1GHE3_A/H Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TSD1G are qualified based on the following critical parameters:

Electrical Compatibility:

• Voltage - DC Reverse (Vr) (Max): 400 V minimum
• Current - Average Rectified (Io): 1 A minimum
• Package / Case: DO-214AC (SMA) surface mount configuration

Environmental & Compliance Compatibility:

• RoHS3 Compliant status
• Moisture Sensitivity Level (MSL): 1 (Unlimited)
• Operating Temperature - Junction: Minimum -55°C to maximum 175°C overlap required

Mechanical Compatibility:

• Surface mount technology
• DO-214AC (SMA) package footprint and pinout

The substitute parts ES1G (Good-Ark Semiconductor) and US1GHE3_A/H (Vishay General Semiconductor - Diodes Division) meet all core electrical and mechanical requirements. Both alternatives are rated for 400 V reverse voltage and 1 A average rectified current in the same DO-214AC (SMA) package. Both are RoHS3 compliant with MSL 1 rating and active product status.

Parameter Comparison

Engineering Selection Recommendations

TSD1G (Taiwan Semiconductor Corporation): The TSD1G is suitable for general-purpose rectification applications requiring standard recovery characteristics. This part offers the highest maximum junction temperature rating at 175°C and the lowest reverse leakage current at 1 µA @ 400 V. Selection is appropriate for applications where thermal headroom and leakage minimization are design priorities. RoHS3 compliance and MSL 1 rating support lead-free assembly processes without moisture sensitivity constraints.

ES1G (Good-Ark Semiconductor): The ES1G provides fast recovery characteristics (≤500 ns) with reduced capacitance (8 pF @ 4V, 1MHz) compared to the TSD1G. This substitute is suitable for applications where switching speed and lower parasitic capacitance are beneficial. The maximum junction temperature is limited to 125°C, which constrains use in high-temperature environments. RoHS3 compliance and MSL 1 rating are maintained. This part is available in Cut Tape (CT) and Digi-Reel® packaging options.

US1GHE3_A/H (Vishay General Semiconductor - Diodes Division): The US1GHE3_A/H is qualified to automotive grade with AEC-Q101 certification, making it suitable for automotive and mission-critical applications requiring enhanced reliability qualification. Fast recovery characteristics (≤500 ns) and a maximum junction temperature of 150°C provide balanced thermal performance. Reverse leakage current is 10 µA @ 400 V. RoHS3 compliance and MSL 1 rating are maintained. This part is supplied in Tape & Reel (TR) packaging.

All three parts are Active product status with identical voltage and current ratings, identical package configuration (DO-214AC, SMA), and identical compliance certifications (RoHS3, MSL 1). Selection between these alternatives depends on specific application requirements for recovery speed, temperature range, leakage characteristics, and automotive qualification.

Frequently Asked Questions (FAQ)

Q: Can the ES1G or US1GHE3_A/H be used as direct replacements for the TSD1G?

A: Yes. Both substitute parts meet the core electrical requirements: 400 V DC reverse voltage rating, 1 A average rectified current, and DO-214AC (SMA) surface mount package. All three parts are RoHS3 compliant with MSL 1 rating and Active product status. Substitution is electrically and mechanically valid. Design considerations for recovery speed, maximum junction temperature, and reverse leakage current differences apply based on application requirements.

Q: What are the key differences between the TSD1G and its substitutes?

A: The TSD1G features standard recovery characteristics (>500 ns) with the highest maximum junction temperature (175°C) and lowest reverse leakage current (1 µA @ 400 V). The ES1G and US1GHE3_A/H both feature fast recovery characteristics (≤500 ns), lower maximum junction temperatures (125°C and 150°C respectively), and higher reverse leakage currents (5 µA and 10 µA respectively). The US1GHE3_A/H includes automotive grade qualification with AEC-Q101 certification.

Q: Are there packaging differences between these parts?

A: The TSD1G and US1GHE3_A/H are supplied in Tape & Reel (TR) packaging. The ES1G is supplied in Cut Tape (CT) and Digi-Reel® packaging options. All three parts use the identical DO-214AC (SMA) package configuration with the same footprint and pinout for surface mount assembly.

Q: Which substitute should be selected for high-temperature applications?

A: The TSD1G supports the highest maximum junction temperature at 175°C. If the TSD1G is unavailable, the US1GHE3_A/H with a 150°C maximum junction temperature is the next option. The ES1G is limited to 125°C maximum junction temperature and is not suitable for high-temperature applications exceeding this limit.

Q: Is the US1GHE3_A/H suitable for automotive applications?

A: Yes. The US1GHE3_A/H is qualified to automotive grade with AEC-Q101 certification. This qualification is not present on the TSD1G or ES1G. Selection of the US1GHE3_A/H is required for automotive and mission-critical applications where AEC-Q101 qualification is specified.

Q: What is the impact of reverse leakage current differences on circuit design?

A: The TSD1G exhibits 1 µA reverse leakage at 400 V, while the ES1G exhibits 5 µA and the US1GHE3_A/H exhibits 10 µA. In applications where reverse leakage current is a critical design parameter (such as precision analog circuits or high-impedance applications), the TSD1G provides superior performance. For general-purpose rectification, these leakage differences are typically not significant.

Q: Are all three parts compliant with RoHS3 and REACH regulations?

A: Yes. The TSD1G, ES1G, and US1GHE3_A/H are all RoHS3 compliant and REACH unaffected. All three parts carry MSL 1 (Unlimited) moisture sensitivity level rating, supporting lead-free assembly processes without moisture sensitivity constraints.