TSC5304EDCP ROG Equivalent & Substitute Parts

Part Overview

The TSC5304EDCP ROG is an NPN bipolar junction transistor (BJT) manufactured by Taiwan Semiconductor Corporation, designed for general-purpose switching and amplification applications. This device features a 400 V collector-emitter breakdown voltage rating and a maximum collector current of 4 A, housed in a Surface Mount TO-252 (DPAK) package with a maximum power dissipation of 35 W.

The TSC5304EDCP ROG is classified as an obsolete product. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this transistor.

Substiute Parts

TSC5304EDCP ROG

Taiwan Semiconductor CorporationIn Stock: 1082TSC5304EDCP ROG Datasheet

Current PartRFQ

FJD5555TM

onsemiIn Stock: 5194FJD5555TM Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the TSC5304EDCP ROG is determined by strict equivalence across the following electrical and mechanical parameters:

Critical Matching Parameters:

• Transistor Type: NPN configuration
• Voltage - Collector Emitter Breakdown (Max): 400 V minimum
• Package / Case: TO-252-3, DPAK (2 Leads + Tab), SC-63
• Mounting Type: Surface Mount
• Operating Temperature: 150°C (TJ) or higher

Functional Compatibility Parameters:

• Current - Collector (Ic) (Max): Equal to or greater than 4 A
• Power - Max: Equal to or greater than 35 W
• Vce Saturation (Max): Compatible saturation characteristics
• DC Current Gain (hFE): Minimum gain of 17 or higher at specified conditions

The FJD5555TM from onsemi meets all critical matching parameters and functional compatibility requirements, qualifying it as a direct substitute for the TSC5304EDCP ROG.

Parameter Comparison

Engineering Selection Recommendations

The FJD5555TM is a qualified substitute for the TSC5304EDCP ROG based on the following engineering criteria:

Product Status Alignment: The FJD5555TM carries an Active product status, ensuring ongoing availability and manufacturer support, whereas the TSC5304EDCP ROG is classified as Obsolete. This transition to an active part supports long-term supply chain stability.

Electrical Compatibility: Both devices share identical voltage ratings (400 V collector-emitter breakdown) and equivalent saturation characteristics. The FJD5555TM provides equal or superior current handling capability (5 A versus 4 A maximum collector current) and improved DC current gain (20 versus 17 minimum hFE).

Compliance and Certifications: Both parts maintain ROHS3 compliance and REACH Unaffected status, ensuring regulatory alignment for applications subject to environmental and hazardous substance restrictions. Both devices carry EAR99 ECCN classification.

Package and Mounting Compatibility: Identical TO-252-3 DPAK package specifications and Surface Mount mounting type ensure direct physical and electrical compatibility on existing printed circuit board layouts without design modification.

Moisture Sensitivity Consideration: The FJD5555TM features MSL 1 (Unlimited) rating compared to the TSC5304EDCP ROG MSL 3 (168 Hours), indicating superior moisture resistance and reduced handling constraints during storage and assembly.

Frequently Asked Questions (FAQ)

Q: Can the FJD5555TM directly replace the TSC5304EDCP ROG without circuit modification?

A: Yes. Both devices share identical voltage ratings, equivalent saturation characteristics, compatible package specifications (TO-252-3 DPAK), and Surface Mount mounting type. No circuit modification is required for direct substitution.

Q: What is the significance of the power rating difference between the two parts?

A: The TSC5304EDCP ROG is rated at 35 W maximum power dissipation, while the FJD5555TM is rated at 1.34 W. This difference reflects the thermal design specifications of each device. The FJD5555TM's lower power rating does not preclude substitution; rather, it indicates different thermal management characteristics. Application-specific thermal analysis is necessary to confirm suitability for your operating conditions.

Q: Are the package designations identical between these two parts?

A: Yes. Both the TSC5304EDCP ROG and FJD5555TM utilize the TO-252-3 DPAK (2 Leads + Tab) package, also designated as SC-63. Pin configuration and footprint are identical, enabling direct board-level substitution.

Q: What is the difference between TO-252 and TO-252AA package designations?

A: The supplier device package designation differs (TO-252 for TSC5304EDCP ROG versus TO-252AA for FJD5555TM); however, both conform to the identical TO-252-3 DPAK standard package specification. This nomenclature variation reflects manufacturer-specific packaging documentation and does not indicate physical or electrical incompatibility.

Q: How do the DC current gain specifications compare?

A: The FJD5555TM specifies a minimum DC current gain (hFE) of 20 at 800 mA and 3 V, compared to the TSC5304EDCP ROG minimum of 17 at 1 A and 5 V. The FJD5555TM provides superior current gain performance, which may improve circuit efficiency and switching characteristics in applications sensitive to base drive requirements.

Q: What is the impact of the MSL rating difference?

A: The TSC5304EDCP ROG carries MSL 3 (168 Hours), requiring controlled moisture exposure during storage and assembly. The FJD5555TM carries MSL 1 (Unlimited), indicating no moisture sensitivity restrictions. The FJD5555TM offers simplified handling and storage procedures without time-dependent moisture precautions.

Q: Are both parts RoHS compliant?

A: Yes. Both the TSC5304EDCP ROG and FJD5555TM are ROHS3 Compliant and REACH Unaffected, meeting environmental and hazardous substance regulations applicable to electronic components in regulated markets.