TSC5303DCP ROG Equivalent & Substitute Parts

Part Overview

The TSC5303DCP ROG is an NPN bipolar junction transistor (BJT) manufactured by Taiwan Semiconductor Corporation, designed for general-purpose switching and amplification applications. This device features a 400 V collector-emitter breakdown voltage rating with a maximum collector current of 3 A and 30 W power dissipation capability in a surface mount TO-252 (DPAK) package.

The TSC5303DCP ROG is classified as obsolete. Locating equivalent substitute parts is necessary to support ongoing production requirements, maintenance operations, and system redesigns where this component is specified in existing designs.

Substiute Parts

TSC5303DCP ROG

Taiwan Semiconductor CorporationIn Stock: 962TSC5303DCP ROG Datasheet

Current PartRFQ

FJD5553TM

onsemiIn Stock: 15326FJD5553TM Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution of the TSC5303DCP ROG is determined by strict equivalence across the following critical electrical and mechanical parameters:

Electrical Equivalence Criteria:

• Transistor type must be NPN
• Voltage - Collector Emitter Breakdown (Max) must equal or exceed 400 V
• Current - Collector (Ic) (Max) must equal or exceed 3 A
• Package / Case must be TO-252-3, DPAK (2 Leads + Tab), SC-63
• Mounting type must be Surface Mount

Compliance Criteria:

• RoHS3 Compliance required
• REACH Unaffected status required

The FJD5553TM manufactured by onsemi meets all electrical and mechanical substitution criteria. This part maintains identical voltage and current ratings, operates within the required temperature range, and is housed in the same TO-252 package configuration. The FJD5553TM is classified as an active product with current manufacturing support and improved moisture sensitivity characteristics.

Parameter Comparison

Engineering Selection Recommendations

The FJD5553TM is the qualified substitute for the obsolete TSC5303DCP ROG based on the following engineering factors:

Product Status and Supply Continuity: The FJD5553TM is classified as an active product with current manufacturing support and substantial inventory availability (15,224 pcs in stock). The TSC5303DCP ROG is obsolete with limited remaining inventory (937 pcs). Selection of the FJD5553TM ensures long-term supply chain continuity and access to future production quantities.

Electrical Compatibility: Both devices share identical maximum ratings for collector-emitter breakdown voltage (400 V) and collector current (3 A). The FJD5553TM exhibits improved saturation voltage characteristics (500 mV versus 700 mV) and higher DC current gain (30 versus 15), which provide enhanced switching performance in typical applications.

Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying current environmental and regulatory requirements for electronic component procurement.

Packaging and Thermal Considerations: Both devices utilize identical TO-252-3 DPAK surface mount packaging, enabling direct physical substitution on existing printed circuit boards without layout modifications. The FJD5553TM features improved moisture sensitivity characteristics (MSL 1 versus MSL 3), reducing handling and storage requirements during manufacturing operations.

Frequently Asked Questions (FAQ)

Q: Can the FJD5553TM be used as a direct replacement for the TSC5303DCP ROG in existing designs?

A: Yes. The FJD5553TM is electrically and mechanically compatible with the TSC5303DCP ROG. Both devices are NPN transistors with 400 V breakdown voltage, 3 A maximum collector current, and identical TO-252 DPAK packaging. No circuit modifications or board redesign are required for substitution.

Q: What are the key differences between these two parts?

A: The primary differences are manufacturer origin, product status, and specific electrical characteristics. The FJD5553TM is an active product from onsemi with improved saturation voltage (500 mV versus 700 mV), higher current gain (30 versus 15), and superior moisture sensitivity rating (MSL 1 versus MSL 3). The TSC5303DCP ROG is obsolete and has higher maximum power dissipation rating (30 W versus 1.25 W).

Q: Are there any thermal or power dissipation concerns when substituting the FJD5553TM for the TSC5303DCP ROG?

A: The FJD5553TM has a lower maximum power dissipation rating (1.25 W versus 30 W). Applications requiring sustained power dissipation above 1.25 W must be evaluated to confirm the FJD5553TM operates within its thermal limits. For typical switching applications with brief current pulses, this difference is not limiting.

Q: What is the moisture sensitivity level difference, and does it affect component handling?

A: The TSC5303DCP ROG has MSL 3 (168-hour floor life), while the FJD5553TM has MSL 1 (unlimited floor life). The FJD5553TM requires less stringent moisture control during storage and handling, reducing the risk of moisture-induced failures and simplifying manufacturing logistics.

Q: Are both parts RoHS compliant?

A: Yes. Both the TSC5303DCP ROG and FJD5553TM are ROHS3 compliant and REACH unaffected, meeting current environmental regulations for electronic component procurement and use.

Q: What is the operating temperature range for each part?

A: The TSC5303DCP ROG operates from −55°C to +150°C. The FJD5553TM operates up to +150°C. For applications requiring operation below 0°C, the TSC5303DCP ROG specifications must be confirmed; however, the FJD5553TM is suitable for standard industrial and commercial temperature ranges.