TS5MP645YFPR Equivalent & Substitute Parts

Part Overview

The TS5MP645YFPR is a 10-circuit SPDT IC switch manufactured by Texas Instruments, designed for high-frequency signal routing applications. This device features a 2:1 multiplexer/demultiplexer configuration with 6.5Ohm on-state resistance and operates across a 1.65V to 5.5V supply range. The part is classified as "Not For New Designs," indicating it has reached end-of-life status. Identifying equivalent and substitute parts is necessary for ongoing system support, legacy product maintenance, and design continuity where this component is currently deployed.

Substiute Parts

TS5MP645YFPR
Texas InstrumentsIn Stock: 2301TS5MP645YFPR Datasheet
TS5MP645YFPR
Current Part
TMUX646ZECR
Texas InstrumentsIn Stock: 17843TMUX646ZECR Datasheet
TMUX646ZECR
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number TS5MP645YFPR
Manufacturer Texas Instruments
Category Interface
Switch Circuit Type SPDT
Multiplexer/Demultiplexer Configuration 2:1
Number of Circuits 10
On-State Resistance (Max) 6.5Ohm
Channel-to-Channel Matching (ΔRon) 100mOhm
Voltage - Supply, Single (V+) 1.65V ~ 5.5V
-3dB Bandwidth 1.5GHz
Channel Capacitance (CS(off), CD(off)) 1.5pF
Current - Leakage (IS(off)) (Max) 500nA
Crosstalk -40dB @ 1.25GHz
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 36-XFBGA, DSBGA
Supplier Device Package 36-DSBGA
Product Status Not For New Designs
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the TS5MP645YFPR is determined by the following core parameters:

  • Switch Configuration: SPDT topology with 2:1 multiplexer/demultiplexer function
  • Circuit Count: 10 independent circuits
  • On-State Resistance: Maximum 6.5Ohm (primary electrical constraint)
  • Supply Voltage Range: 1.65V to 5.5V single supply operation
  • Frequency Performance: -3dB bandwidth of 1.5GHz minimum
  • Package Compatibility: 36-pin BGA footprint (DSBGA or equivalent)
  • Operating Temperature: -40°C to 85°C range
  • Surface Mount Configuration: Standard SMD assembly compatibility

The TMUX646ZECR meets the core functional requirements of SPDT 2:1 multiplexing with 10 channels and operates within the specified temperature range. However, this substitute exhibits performance characteristics that differ in specific electrical parameters, requiring engineering evaluation for application-specific compatibility.

Parameter Comparison

Parameter TS5MP645YFPR TMUX646ZECR Compatibility Notes
Manufacturer Texas Instruments Texas Instruments Same manufacturer
Switch Circuit Type SPDT SPDT Identical topology
Multiplexer/Demultiplexer Configuration 2:1 2:1 Identical configuration
Number of Circuits/Channels 10 10 Identical channel count
On-State Resistance (Max) 6.5Ohm 9Ohm, 10Ohm Substitute has higher resistance; verify signal integrity requirements
Voltage - Supply, Single (V+) 1.65V ~ 5.5V 1.5V ~ 5.5V Substitute supports lower minimum voltage (1.5V vs 1.65V)
-3dB Bandwidth 1.5GHz 6GHz Substitute provides superior bandwidth performance
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C (TA) Identical operating range
Mounting Type Surface Mount Surface Mount Identical mounting method
Package / Case 36-XFBGA, DSBGA 36-UFBGA Different BGA variant; footprint compatibility requires verification
Product Status Not For New Designs Active Substitute is in active production
RoHS Status ROHS3 Compliant Not applicable Compliance status differs
Moisture Sensitivity Level (MSL) 1 (Unlimited) 2 (1 Year) Substitute has more stringent moisture handling requirements

Engineering Selection Recommendations

The TMUX646ZECR is the manufacturer-recommended substitute for the TS5MP645YFPR. Selection between these parts should be based on the following engineering criteria:

Product Status Consideration: The TS5MP645YFPR is designated "Not For New Designs," while the TMUX646ZECR maintains "Active" status. For ongoing production and new system implementations, the TMUX646ZECR is the appropriate choice.

Compliance and Certification: The TS5MP645YFPR carries ROHS3 compliance certification. The TMUX646ZECR compliance status is listed as "Not applicable." Verify compliance requirements for your specific application and regulatory jurisdiction before selection.

Electrical Performance Trade-offs: The TMUX646ZECR exhibits higher on-state resistance (9Ohm to 10Ohm versus 6.5Ohm) but delivers superior -3dB bandwidth (6GHz versus 1.5GHz). Applications requiring low insertion loss or impedance-critical signal paths may require detailed analysis of the resistance increase. Applications operating at higher frequencies benefit from the increased bandwidth.

Package and Assembly Considerations: The TS5MP645YFPR uses 36-DSBGA packaging, while the TMUX646ZECR uses 36-NFBGA (2.45x2.45). Although both are 36-pin BGA packages, the specific ball grid array variant differs. PCB footprint compatibility must be verified before implementation.

Moisture Handling: The TS5MP645YFPR has MSL 1 (unlimited moisture sensitivity), while the TMUX646ZECR has MSL 2 (1-year shelf life limit). Storage and handling procedures must be adjusted accordingly for the substitute part.

Frequently Asked Questions (FAQ)

Q: Can the TMUX646ZECR directly replace the TS5MP645YFPR in existing designs?

A: Functional substitution is possible due to identical SPDT 2:1 topology and 10-channel configuration. However, three factors require engineering verification: (1) PCB footprint compatibility between 36-DSBGA and 36-NFBGA packages, (2) signal integrity impact from increased on-state resistance (9-10Ohm versus 6.5Ohm), and (3) compliance certification alignment with your application requirements.

Q: What is the significance of the on-state resistance difference?

A: The TMUX646ZECR exhibits 38-54% higher on-state resistance compared to the TS5MP645YFPR. In high-impedance signal paths or applications with tight insertion loss budgets, this increase may affect signal attenuation, noise figure, or power dissipation. Low-impedance applications or those with signal conditioning stages may tolerate this difference without performance degradation.

Q: Are the BGA packages physically compatible?

A: Both parts use 36-pin BGA packaging, but the TS5MP645YFPR uses DSBGA (36-XFBGA) while the TMUX646ZECR uses NFBGA (2.45x2.45). Ball pitch, array layout, and solder pad dimensions may differ. PCB footprint verification against manufacturer datasheets is mandatory before assembly.

Q: What does "Not For New Designs" mean for the TS5MP645YFPR?

A: This designation indicates the part has reached end-of-life status and Texas Instruments no longer recommends it for new product development. Existing inventory may be available for legacy system support, but long-term availability is not guaranteed. The TMUX646ZECR, with "Active" status, is the recommended path forward for sustained production.

Q: How do the supply voltage ranges compare?

A: The TS5MP645YFPR operates from 1.65V to 5.5V, while the TMUX646ZECR operates from 1.5V to 5.5V. The substitute supports a slightly lower minimum voltage, providing broader compatibility with low-voltage applications. Both support standard 3.3V and 5V logic levels.

Q: What is the impact of the bandwidth difference?

A: The TMUX646ZECR provides 6GHz -3dB bandwidth compared to 1.5GHz for the TS5MP645YFPR. This 4x bandwidth advantage enables the substitute to handle higher-frequency signals with reduced attenuation. Applications operating below 1.5GHz experience no practical bandwidth limitation from either part.

Q: How does moisture sensitivity affect component handling?

A: The TS5MP645YFPR (MSL 1) has unlimited shelf life under standard conditions. The TMUX646ZECR (MSL 2) requires controlled humidity storage and has a 1-year maximum shelf life from the date of manufacture. Moisture-sensitive handling procedures, including desiccant packaging and bake-out protocols before reflow, apply to the substitute part.

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