TS5MP645NYFPR Equivalent & Substitute Parts

Part Overview

The TS5MP645NYFPR is a 10-circuit SPDT IC switch manufactured by Texas Instruments, designed for high-speed signal routing applications. This device features a 2:1 multiplexer/demultiplexer configuration with 6.5Ohm on-state resistance and operates across a supply voltage range of 1.65V to 5.5V. The part is classified as "Not For New Designs," indicating that Texas Instruments has discontinued active development support. Finding equivalent or substitute parts is necessary for applications requiring continued component availability, design flexibility, or performance optimization within compatible electrical and mechanical parameters.

Substiute Parts

TS5MP645NYFPR

Texas InstrumentsIn Stock: 1957TS5MP645NYFPR Datasheet

Current PartRFQ

TMUX646NZECR

Texas InstrumentsIn Stock: 5366TMUX646NZECR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TS5MP645NYFPR is determined by strict alignment of the following electrical and mechanical parameters:

Critical Substitution Criteria:

• Switch circuit type: SPDT
• Multiplexer/demultiplexer configuration: 2:1
• Number of circuits: 10
• Supply voltage compatibility: Overlapping or extended voltage range
• Operating temperature range: -40°C ~ 85°C
• Mounting type: Surface Mount
• Package family: BGA-based (DSBGA, NFBGA, UFBGA)

Performance Parameters Considered:

• On-state resistance: Must be within acceptable limits for the application
• Channel-to-channel matching: Ensures uniform signal routing
• Bandwidth: Determines maximum signal frequency capability
• Leakage current: Affects signal integrity in high-impedance circuits

The TMUX646NZECR meets these substitution criteria as a 10-circuit SPDT 2:1 multiplexer/demultiplexer with compatible electrical specifications and surface-mount BGA packaging.

Parameter Comparison

Engineering Selection Recommendations

For Continued Support of Existing Designs: The TMUX646NZECR is the manufacturer-recommended substitute for the TS5MP645NYFPR. Both parts are manufactured by Texas Instruments and share identical switch circuit topology (SPDT), multiplexer configuration (2:1), and circuit count (10). The substitute maintains compatibility across the critical operating temperature range (-40°C ~ 85°C) and supply voltage specifications.

Key Considerations:

1. Product Status: The TS5MP645NYFPR is classified as "Not For New Designs," whereas the TMUX646NZECR carries "Active" status. This distinction indicates that the substitute receives ongoing manufacturer support and is recommended for new development efforts.

2. RoHS Compliance: The original part is ROHS3 compliant. The substitute's RoHS status is listed as "Not applicable." Verify compliance requirements for your specific application and regulatory jurisdiction.

3. Moisture Sensitivity: The original part has MSL 1 (Unlimited), while the substitute has MSL 2 (1 Year). This affects storage and handling procedures. MSL 2 components require controlled storage conditions and have a one-year shelf life from the date of manufacture.

4. On-State Resistance: The substitute exhibits higher on-state resistance (9Ohm to 10Ohm) compared to the original (6.5Ohm). Evaluate whether this increase is acceptable for your signal routing application, particularly in low-impedance circuits or high-frequency applications.

5. Bandwidth Performance: The TMUX646NZECR provides superior -3dB bandwidth (6GHz versus 1.5GHz), offering enhanced performance for high-speed signal applications.

6. Package Compatibility: Both parts use 36-pin BGA packages, but the specific variants differ (36-DSBGA versus 36-NFBGA). Confirm that the physical footprint, ball pitch, and pin assignment are compatible with your PCB layout before proceeding with substitution.

Frequently Asked Questions (FAQ)

Q: Can the TMUX646NZECR be used as a direct replacement for the TS5MP645NYFPR?

A: The TMUX646NZECR is electrically compatible as a substitute based on switch circuit type, multiplexer configuration, circuit count, and operating temperature range. However, physical compatibility depends on PCB footprint design. The 36-DSBGA and 36-NFBGA packages differ in ball pitch and placement. Verify that your PCB layout accommodates the 36-NFBGA (2.45x2.45) package before implementing the substitution.

Q: What is the impact of the higher on-state resistance in the TMUX646NZECR?

A: The substitute's on-state resistance of 9Ohm to 10Ohm is higher than the original's 6.5Ohm. This affects signal attenuation and power dissipation in the switch. For applications with strict impedance matching requirements or high-current signal routing, this difference may be significant. Perform circuit simulation or testing to confirm acceptable performance in your specific application.

Q: Does the difference in moisture sensitivity level affect usability?

A: Yes. The original part (MSL 1) has unlimited shelf life under standard conditions, while the substitute (MSL 2) has a one-year shelf life from manufacture. MSL 2 components require controlled storage at specified temperature and humidity levels. Ensure your supply chain and storage procedures comply with MSL 2 requirements to prevent component degradation.

Q: Why does the substitute have a higher bandwidth specification?

A: The TMUX646NZECR's 6GHz bandwidth exceeds the original's 1.5GHz specification. This represents an enhancement in the substitute's design and does not create compatibility issues. The higher bandwidth supports a wider range of signal frequencies and provides additional performance margin for high-speed applications.

Q: Are there any regulatory or compliance differences between these parts?

A: The original part is ROHS3 compliant, while the substitute's RoHS status is listed as "Not applicable." Verify the substitute's compliance status with your regulatory requirements and procurement standards before finalizing the substitution decision.

Q: What should I verify before implementing this substitution in production?

A: Confirm the following before production implementation: (1) PCB footprint compatibility with the 36-NFBGA package; (2) acceptable performance with the higher on-state resistance; (3) compliance with your RoHS and environmental requirements; (4) proper handling and storage procedures for MSL 2 components; (5) functional testing in your specific circuit application.