TS507ID Equivalent & Substitute Parts

Part Overview

The TS507ID is a general-purpose operational amplifier manufactured by STMicroelectronics, housed in an 8-SOIC surface-mount package. This device features rail-to-rail output capability and is designed for linear amplification applications requiring single-circuit configurations. The TS507ID is classified as obsolete, making identification of active equivalent and substitute parts essential for ongoing design support and procurement continuity. Substitute parts must maintain functional compatibility across critical electrical parameters including supply voltage range, output type, package configuration, and operating temperature specifications.

Key Parameters

Parameter	TS507ID Value	Unit
Amplifier Type	General Purpose	—
Number of Circuits	1	—
Output Type	Rail-to-Rail	—
Package / Case	8-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—
Voltage - Supply Span (Min)	2.7	V
Voltage - Supply Span (Max)	5.5	V
Operating Temperature	-40°C ~ 125°C	—
Slew Rate	0.6	V/µs
Gain Bandwidth Product	1.9	MHz
Current - Input Bias	8	nA
Voltage - Input Offset	25	µV
Current - Supply	850	µA
Current - Output / Channel	128	mA
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitute parts for the TS507ID are grouped based on strict adherence to the following critical parameters:

Package Compatibility: All substitute parts must use the 8-SOIC (0.154", 3.90mm Width) surface-mount package to ensure direct PCB footprint compatibility.

Output Configuration: All substitutes must feature rail-to-rail output capability to maintain signal swing characteristics within the specified supply voltage range.

Supply Voltage Range: Substitute parts must support the minimum supply voltage of 2.7 V and maximum of 5.5 V. Parts with narrower or incompatible ranges are excluded from direct substitution.

Operating Temperature Range: The TS507ID operates from -40°C to 125°C. Substitute parts operating within this range or an extended range are acceptable. Parts with narrower temperature ranges (such as 0°C to 70°C) are identified as limited-temperature alternatives.

Single-Circuit Configuration: All substitutes must contain exactly one operational amplifier circuit per package.

Compliance Status: All substitute parts must maintain ROHS3 compliance and MSL 1 rating to ensure regulatory and environmental compatibility.

Substitutes are further differentiated by performance characteristics including slew rate, gain bandwidth product, input bias current, and output current capability. These parameters determine suitability for specific application requirements while maintaining basic functional equivalence.

Parameter Comparison

Parameter	TS507ID	LMP2011MA/NOPB	LMV2011MA/NOPB	LMV2011MAX/NOPB	MCP6041-E/SN	MCP6041T-E/SN	MCP6051-E/SN	MCP6061-E/SN
Manufacturer	STMicroelectronics	Texas Instruments	National Semiconductor	Texas Instruments	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Product Status	Obsolete	Active	Active	Active	Active	Active	Active	Active
Package / Case	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-SOIC
Output Type	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail	Rail-to-Rail
Number of Circuits	1	1	1	1	1	1	1	1
Voltage - Supply Span (Min)	2.7 V	2.7 V	2.7 V	2.7 V	1.4 V	1.4 V	1.8 V	1.8 V
Voltage - Supply Span (Max)	5.5 V	5.25 V	5.25 V	5.25 V	6 V	6 V	6 V	6 V
Operating Temperature	-40°C ~ 125°C	-40°C ~ 125°C	0°C ~ 70°C	0°C ~ 70°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C	-40°C ~ 125°C
Slew Rate	0.6 V/µs	4 V/µs	4 V/µs	4 V/µs	0.003 V/µs	0.003 V/µs	0.15 V/µs	0.25 V/µs
Gain Bandwidth Product	1.9 MHz	3 MHz	3 MHz	3 MHz	14 kHz	14 kHz	385 kHz	730 kHz
Current - Input Bias	8 nA	3 pA	3 pA	3 pA	1 pA	1 pA	1 pA	1 pA
Voltage - Input Offset	25 µV	0.12 µV	0.12 µV	0.12 µV	3 mV	3 mV	150 µV	150 µV
Current - Supply	850 µA	930 µA	930 µA	930 µA	600 nA	600 nA	30 µA	60 µA
Current - Output / Channel	128 mA	17 mA	17 mA	17 mA	20 mA	20 mA	—	—
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	—	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	—	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

Primary Substitutes for Full Compatibility:

The LMP2011MA/NOPB (Texas Instruments) and MCP6041T-E/SN (Microchip Technology) are the preferred substitutes for the TS507ID. Both parts are active products with ROHS3 compliance and MSL 1 rating. The LMP2011MA/NOPB maintains the complete operating temperature range of -40°C to 125°C and supports the full supply voltage span of 2.7 V to 5.5 V. The MCP6041T-E/SN also covers the -40°C to 125°C temperature range and operates within the required supply voltage window.

Temperature-Limited Alternatives:

The LMV2011MA/NOPB and LMV2011MAX/NOPB (National Semiconductor and Texas Instruments, respectively) are active substitutes with identical electrical characteristics to the LMP2011MA/NOPB. However, these parts operate only within the 0°C to 70°C temperature range, making them unsuitable for applications requiring the full -40°C to 125°C operating window of the TS507ID.

Low-Power Alternatives:

The MCP6041-E/SN, MCP6041-I/SN, MCP6041T-I/SN, MCP6051-E/SN, MCP6051T-E/SN, and MCP6061-E/SN (all Microchip Technology) are active substitutes featuring significantly reduced supply current consumption. These parts are suitable for power-constrained applications. The MCP6041 series operates at 600 nA supply current, the MCP6051 series at 30 µA, and the MCP6061 series at 60 µA, compared to the TS507ID's 850 µA. All Microchip alternatives maintain ROHS3 compliance, MSL 1 rating, and the required 8-SOIC package.

Output Current Considerations:

The TS507ID provides 128 mA output current per channel. The LMP2011MA/NOPB and LMV2011 variants provide 17 mA output current, while the MCP6041 series provides 20 mA. Applications requiring the full 128 mA output current capability cannot use these substitutes without additional output buffering stages.

Supply Voltage Range Considerations:

The MCP6041, MCP6051, and MCP6061 series support extended minimum supply voltage down to 1.4 V or 1.8 V, providing greater flexibility for low-voltage applications. However, the maximum supply voltage for these parts is 6 V, which exceeds the TS507ID's 5.5 V maximum by 0.5 V. Applications operating at the upper limit of the TS507ID's supply range remain compatible with these substitutes.

Frequently Asked Questions (FAQ)

Q: Can the LMP2011MA/NOPB directly replace the TS507ID in all applications?

A: The LMP2011MA/NOPB is a direct functional substitute for the TS507ID in terms of package, output type, and operating temperature range. Both parts use the 8-SOIC package, feature rail-to-rail output, and operate from -40°C to 125°C. However, the LMP2011MA/NOPB provides only 17 mA output current compared to the TS507ID's 128 mA. Applications requiring high output current must evaluate whether this reduction is acceptable or if output buffering is necessary.

Q: Why are the LMV2011MA/NOPB and LMV2011MAX/NOPB listed as substitutes if they have a narrower temperature range?

A: These parts are listed as substitutes because they maintain electrical compatibility with the TS507ID across all other critical parameters, including package, output type, and supply voltage range. However, their operating temperature range is limited to 0°C to 70°C. These parts are suitable only for applications that do not require operation below 0°C or above 70°C.

Q: What is the primary advantage of the MCP6041 series over the TS507ID?

A: The MCP6041 series offers dramatically reduced supply current consumption at 600 nA, compared to the TS507ID's 850 µA. This makes the MCP6041 series suitable for battery-powered and energy-constrained applications. The trade-off is significantly reduced slew rate (0.003 V/µs versus 0.6 V/µs) and gain bandwidth product (14 kHz versus 1.9 MHz), limiting use to low-frequency applications.

Q: Are all substitute parts ROHS3 compliant?

A: All substitute parts listed in this document are ROHS3 compliant. The TS507ID is also ROHS3 compliant. This ensures regulatory compatibility across all substitutes for applications subject to ROHS3 requirements.

Q: Can the MCP6051-E/SN or MCP6061-E/SN be used in high-speed applications?

A: The MCP6051-E/SN and MCP6061-E/SN have significantly lower gain bandwidth products (385 kHz and 730 kHz, respectively) compared to the TS507ID (1.9 MHz). These parts are suitable for applications with bandwidth requirements up to their respective gain bandwidth product limits. Applications requiring the full 1.9 MHz bandwidth of the TS507ID should use the LMP2011MA/NOPB or MCP6041T-E/SN instead.

Q: What is the difference between MCP6041-E/SN and MCP6041T-E/SN?

A: Both parts are identical in electrical specifications and package configuration. The primary difference is packaging format: MCP6041-E/SN is supplied in Tube packaging, while MCP6041T-E/SN is supplied in Cut Tape (CT) & Digi-Reel format. Selection between these variants depends on procurement and assembly requirements rather than electrical compatibility.

Q: Is the TS507ID still available for purchase?

A: The TS507ID is classified as obsolete. Active substitutes must be used for new designs and ongoing procurement. The LMP2011MA/NOPB and MCP6041T-E/SN are recommended as primary alternatives with confirmed active product status and available inventory.

Q: Do all substitute parts maintain the same input bias current as the TS507ID?

A: No. The TS507ID has an input bias current of 8 nA. The LMP2011MA/NOPB and LMV2011 variants reduce this to 3 pA, while the MCP6041, MCP6051, and MCP6061 series further reduce it to 1 pA. Lower input bias current reduces input offset current errors and is generally advantageous for precision applications.

Q: What packaging options are available for substitute parts?

A: Substitute parts are available in multiple packaging formats including Tube, Bulk, Tape & Reel (TR), and Cut Tape (CT) & Digi-Reel. All variants maintain the same 8-SOIC package footprint. Selection of packaging format depends on assembly process requirements and procurement volume.

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