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TPS75005RGWR Equivalent & Substitute Parts
Part Overview
The TPS75005RGWR is a dual-output low-dropout (LDO) linear voltage regulator manufactured by Texas Instruments, designed for microcontroller and power management applications. Packaged in a 20-VQFN surface-mount configuration, this device delivers 500mA output current with a supply voltage range of 3.75V to 6.5V and operates across the industrial temperature range of -40°C to 125°C.
This part carries a "Not For New Designs" product status, indicating that Texas Instruments has discontinued active development and support for this device. Organizations requiring equivalent functionality for new designs or seeking alternatives for existing inventory must evaluate substitute components that maintain electrical and mechanical compatibility within the specified parameter constraints.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | TPS75005RGWR |
| Manufacturer | Texas Instruments |
| Category | Power Management (PMIC) |
| Package / Case | 20-VQFN (5x5) Exposed Pad |
| Mounting Type | Surface Mount |
| Current - Supply | 175µA |
| Voltage - Supply | 3.75V ~ 6.5V |
| Output Current | 500mA |
| Operating Temperature | -40°C ~ 125°C |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) |
| Product Status | Not For New Designs |
Substitute Part Grouping Explanation
Substitute components for the TPS75005RGWR must satisfy the following electrical and mechanical criteria:
Electrical Compatibility Parameters:
- Supply voltage range must encompass or exceed 3.75V ~ 6.5V
- Output current capability must meet or exceed 500mA per channel
- Operating temperature range must cover -40°C ~ 125°C
- Quiescent current (supply current) must remain within acceptable limits for low-power applications
- Regulatory compliance: ROHS3 and REACH status must match or exceed the original specification
Mechanical Compatibility Parameters:
- Surface-mount packaging only
- Pin count and footprint must be compatible with existing PCB designs or allow straightforward layout adaptation
- Moisture sensitivity level must not exceed MSL 2
Functional Requirements:
- Dual-output linear voltage regulator topology
- LDO (low-dropout) operation capability
- Suitable for microcontroller power supply applications
The TPS767D301PWPR qualifies as a manufacturer-recommended substitute based on shared Texas Instruments design heritage, identical operating temperature range, matching RoHS3 compliance, and equivalent MSL rating. However, this substitute operates in a different package format (28-HTSSOP versus 20-VQFN) and delivers higher output current (1A versus 500mA), requiring PCB layout re-evaluation.
Parameter Comparison
| Parameter | TPS75005RGWR (Main Part) | TPS767D301PWPR (Substitute) |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Category | Power Management (PMIC) | Power Management (PMIC) |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 20-VQFN (5x5) | 28-HTSSOP (0.173", 4.40mm Width) |
| Current - Supply | 175µA | 125µA |
| Voltage - Supply (Input) | 3.75V ~ 6.5V | Up to 10V |
| Output Current | 500mA | 1A |
| Operating Temperature | -40°C ~ 125°C | -40°C ~ 125°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 2 (1 Year) | 2 (1 Year) |
| Product Status | Not For New Designs | Active |
Engineering Selection Recommendations
The TPS767D301PWPR is designated as the manufacturer-recommended substitute and carries an Active product status, making it suitable for new design implementations. Both components maintain identical operating temperature ranges (-40°C to 125°C) and share equivalent RoHS3 and REACH compliance certifications, ensuring regulatory alignment across supply chain transitions.
The primary engineering consideration involves package format transition from 20-VQFN to 28-HTSSOP, which necessitates PCB layout modification. The substitute's increased output current capability (1A versus 500mA) and extended input voltage tolerance (up to 10V versus 6.5V maximum) provide enhanced design margin for applications requiring higher current delivery or wider input voltage accommodation.
The substitute's lower quiescent current (125µA versus 175µA) offers improved efficiency in battery-powered or low-power standby applications. Selection of the TPS767D301PWPR should be based on PCB redesign feasibility and whether the enhanced electrical specifications align with system requirements.
Frequently Asked Questions (FAQ)
Q: Can the TPS767D301PWPR be used as a direct pin-for-pin replacement for the TPS75005RGWR?
A: No. The TPS75005RGWR uses a 20-pin VQFN package, while the TPS767D301PWPR uses a 28-pin HTSSOP package. PCB layout redesign is required. Pin assignments and functional configurations differ between the two devices.
Q: What are the key electrical differences between these two parts?
A: The TPS767D301PWPR delivers 1A output current compared to the TPS75005RGWR's 500mA, accepts input voltages up to 10V versus 6.5V maximum, and operates with lower quiescent current (125µA versus 175µA). Both maintain identical operating temperature ranges and regulatory compliance.
Q: Why is the TPS75005RGWR marked "Not For New Designs"?
A: This designation indicates that Texas Instruments has concluded active development and support for this product line. New designs should transition to active alternatives such as the TPS767D301PWPR to ensure long-term supply availability and manufacturer support.
Q: Are there any compliance or certification concerns when substituting these parts?
A: Both components maintain ROHS3 compliance, REACH unaffected status, and identical MSL ratings (2, 1 Year). No compliance degradation occurs with this substitution. Verify that your specific application requirements align with the substitute's electrical specifications.
Q: What PCB considerations apply when transitioning from TPS75005RGWR to TPS767D301PWPR?
A: The package change from 20-VQFN to 28-HTSSOP requires complete PCB layout redesign. The HTSSOP package has different thermal characteristics and pin spacing. Thermal management, decoupling capacitor placement, and trace routing must be re-evaluated for the new package footprint.
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