TPS2813P Equivalent & Substitute Parts

Part Overview

The TPS2813P is a low-side gate driver IC manufactured by Texas Instruments, designed for driving N-channel MOSFETs in synchronous configurations. This 8-pin DIP through-hole component operates across a 4V to 14V supply range and delivers 2A peak output current for both source and sink operations. The TPS2813P is currently in Last Time Buy status, indicating end-of-life production. Identifying equivalent substitute parts is necessary to ensure design continuity and maintain component availability for new production runs and long-term system support.

Substiute Parts

TPS2813P

Texas InstrumentsIn Stock: 1912TPS2813P Datasheet

Current PartRFQ

TPS2813PWR

Texas InstrumentsIn Stock: 817TPS2813PWR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TPS2813P is determined by strict equivalence across the following electrical and mechanical parameters:

• Functional equivalence: Identical driven configuration (low-side), channel type (synchronous), and number of drivers (2)
• Electrical compatibility: Matching supply voltage range (4V ~ 14V), logic voltage thresholds (VIL 1V, VIH 4V), peak output current (2A source/sink), and input types (inverting and non-inverting)
• Thermal performance: Identical operating temperature range (-40°C ~ 125°C)
• Regulatory compliance: Both parts maintain ROHS3 compliance and REACH unaffected status
• Base product equivalence: Both parts share the TPS2813 base product number, confirming functional interchangeability

The TPS2813PWR qualifies as a direct substitute based on these criteria, with the primary difference being packaging format (surface mount TSSOP versus through-hole DIP).

Parameter Comparison

Engineering Selection Recommendations

The TPS2813PWR is the direct electrical equivalent to the TPS2813P. Selection between these parts should be based on the following factors:

For through-hole applications: The TPS2813P remains suitable for existing designs with DIP socket footprints, though availability is limited due to Last Time Buy status.

For new designs or production transitions: The TPS2813PWR is the recommended choice. It maintains full electrical equivalence while offering Active product status, ensuring long-term availability and supply chain stability. The surface-mount TSSOP package provides improved thermal characteristics and reduced board space requirements compared to the through-hole DIP variant.

Compliance considerations: Both parts maintain identical ROHS3 compliance and REACH unaffected status, ensuring regulatory equivalence for applications subject to these requirements.

Frequently Asked Questions (FAQ)

Q: Can TPS2813PWR be used as a direct replacement for TPS2813P?

A: Yes. Both parts share identical electrical specifications including supply voltage range, output current, logic thresholds, and timing characteristics. The primary difference is packaging format: TPS2813P uses through-hole DIP mounting, while TPS2813PWR uses surface-mount TSSOP. PCB layout modifications are required to accommodate the different package footprint.

Q: What are the key parameters that determine substitution eligibility?

A: Substitution is determined by equivalence in driven configuration (low-side), number of drivers (2), gate type (N-channel MOSFET), supply voltage range (4V ~ 14V), peak output current (2A source/sink), logic voltage thresholds (1V/4V), and operating temperature range (-40°C ~ 125°C). All these parameters are identical between the TPS2813P and TPS2813PWR.

Q: Why is the TPS2813P listed as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part number. Existing inventory may be available, but no new production runs are planned. The TPS2813PWR (surface-mount variant) remains in Active status and is the recommended path for future designs.

Q: Are there any thermal or reliability differences between the DIP and TSSOP packages?

A: Both packages are rated for the same operating temperature range (-40°C ~ 125°C). The TSSOP package has a smaller footprint and typically offers improved thermal performance due to reduced lead inductance, but electrical performance and reliability are equivalent.

Q: Do both parts require the same PCB layout considerations?

A: While electrical requirements are identical, PCB layout differs due to package format. Through-hole DIP (TPS2813P) uses traditional pin-through-hole mounting, while surface-mount TSSOP (TPS2813PWR) requires SMD soldering techniques. Decoupling capacitor placement and trace routing may differ based on package geometry.