TPPM0110DWP Equivalent & Substitute Parts

Part Overview

The TPPM0110DWP is a linear voltage regulator IC from Texas Instruments designed for positive fixed dual-output applications. This device delivers 1.5A and 300mA outputs at fixed voltages of 3.3V and 1.8V respectively, housed in a 20-SOIC package with exposed pad. The part is classified as Last Time Buy, indicating end-of-life status and limited availability. Identifying qualified substitute components is essential for design continuity and long-term supply chain planning.

Substiute Parts

TPPM0110DWP

Texas InstrumentsIn Stock: 1697TPPM0110DWP Datasheet

Current PartRFQ

TPS7A8901RTJR

Texas InstrumentsIn Stock: 5477TPS7A8901RTJR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

The TPS7A8901RTJR qualifies as a functional substitute based on the following alignment criteria:

Matching Parameters:

• Manufacturer: Texas Instruments (same source)
• Category: Power Management (PMIC)
• Output Configuration: Positive
• Number of Regulators: 2
• Protection Features: Over Current, Over Temperature (plus additional Reverse Polarity protection)
• RoHS Status: ROHS3 Compliant
• Mounting Type: Surface Mount

Substitution Logic: The TPS7A8901RTJR provides dual-output positive regulation with enhanced capabilities. While the main part features fixed outputs, the substitute offers adjustable outputs with a minimum of 0.8V and maximum of 5.2V, accommodating the original 3.3V and 1.8V requirements within its adjustment range. Current delivery increases to 2A per output, exceeding the original 1.5A and 300mA specifications. The substitute operates across an extended temperature range (-40°C ~ 125°C) and includes additional control features (Enable, Power Good, Soft Start) and protection mechanisms.

Parameter Comparison

Engineering Selection Recommendations

The TPS7A8901RTJR is an active product from Texas Instruments with full ROHS3 compliance and unlimited moisture sensitivity rating (MSL 1), providing superior long-term supply availability compared to the TPPM0110DWP Last Time Buy status. Both devices maintain REACH Unaffected and EAR99 ECCN classifications.

Selection of the TPS7A8901RTJR requires accommodation of package change from 20-SOIC to 20-WFQFN (4x4) format. The adjustable output architecture necessitates external resistor networks for voltage setting to achieve the original 3.3V and 1.8V outputs. The extended operating temperature range (-40°C ~ 125°C) and increased current capacity (2A per output) provide design margin beyond original specifications. Additional control features (Enable, Power Good, Soft Start) and reverse polarity protection offer enhanced system integration capabilities.

Frequently Asked Questions (FAQ)

Q: Can the TPS7A8901RTJR directly replace the TPPM0110DWP without circuit modifications?

A: No. The TPS7A8901RTJR requires external resistor networks to set output voltages to 3.3V and 1.8V, whereas the TPPM0110DWP provides fixed outputs. PCB layout changes are necessary due to package format transition from 20-SOIC to 20-WFQFN (4x4).

Q: What are the key electrical advantages of the substitute part?

A: The TPS7A8901RTJR delivers higher current capacity (2A per output versus 1.5A and 300mA), operates across a wider temperature range (-40°C ~ 125°C versus 0°C ~ 55°C), includes reverse polarity protection, and provides control features such as Enable, Power Good, and Soft Start functionality.

Q: Are both parts compliant with the same regulatory standards?

A: Yes. Both the TPPM0110DWP and TPS7A8901RTJR are ROHS3 compliant, REACH Unaffected, and classified under EAR99 ECCN.

Q: What is the primary reason to consider substitution?

A: The TPPM0110DWP is designated Last Time Buy with limited inventory. The TPS7A8901RTJR is an active product with established supply chain availability, making it suitable for new designs and long-term production requirements.

Q: How does the package change affect board design?

A: The transition from 20-SOIC (0.295" width) to 20-WFQFN (4x4mm) reduces footprint size and improves thermal performance through the exposed pad design. PCB layout and thermal management strategies must be re-evaluated accordingly.