TNETV2510FIDZGW Equivalent & Substitute Parts

Part Overview

The TNETV2510FIDZGW is an embedded fixed-point digital signal processor (DSP) integrated circuit manufactured by Texas Instruments. This component is packaged in a 240-LFBGA surface mount configuration and is classified as obsolete. The obsolete status of this part necessitates identification of equivalent substitute components that maintain functional and physical compatibility for system integration and replacement applications.

Substiute Parts

TNETV2510FIDZGW
Texas InstrumentsIn Stock: 1015TNETV2510FIDZGW Datasheet
TNETV2510FIDZGW
Current Part
TNETV2510ZAV
Texas InstrumentsIn Stock: 1107TNETV2510ZAV Datasheet
TNETV2510ZAV
Direct

Key Parameters

Parameter Value
Manufacturer Texas Instruments
Category Embedded, Integrated Circuits (ICs)
Description IC DSP FIXED POINT BGA
Type Fixed Point
Mounting Type Surface Mount
Package / Case 240-LFBGA
Supplier Device Package 240-BGA MICROSTAR (15x15)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991A2
HTSUS 8542.31.0001

Substitute Part Grouping Explanation

Substitution of the TNETV2510FIDZGW is determined by the following critical parameters:

Physical Compatibility Parameters:

  • Package type: 240-LFBGA surface mount configuration
  • Ball grid array dimensions: 15x15 mm footprint
  • Pin count: 240 pins

Functional Compatibility Parameters:

  • Device classification: Fixed-point DSP
  • Manufacturer: Texas Instruments
  • Base product family: TNETV2510 series

Compliance & Environmental Parameters:

  • RoHS3 compliance requirement
  • Moisture sensitivity level: MSL 3 (168 hours)
  • Export classification: ECCN 3A991A2
  • Tariff classification: HTSUS 8542.31.0001

The substitute part TNETV2510ZAV shares all critical parameters with the main part, ensuring direct functional and physical substitution capability.

Parameter Comparison

Parameter TNETV2510FIDZGW (Main Part) TNETV2510ZAV (Substitute)
Manufacturer Texas Instruments Texas Instruments
Category Embedded, Integrated Circuits (ICs) Embedded, Integrated Circuits (ICs)
Description IC DSP FIXED POINT BGA IC DSP FIXED POINT BGA
Type Fixed Point Fixed Point
Mounting Type Surface Mount Surface Mount
Package / Case 240-LFBGA 240-LFBGA
Supplier Device Package 240-BGA MICROSTAR (15x15) 240-NFBGA (15x15)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001
Product Status Obsolete Active

Engineering Selection Recommendations

The TNETV2510ZAV is a direct substitute for the TNETV2510FIDZGW based on the following engineering criteria:

Compliance Alignment: Both components maintain identical RoHS3 compliance status and moisture sensitivity specifications, ensuring equivalent environmental and regulatory performance in production and field deployment.

Physical Compatibility: Both parts utilize the 240-LFBGA package format with 15x15 mm footprint dimensions, enabling direct PCB footprint compatibility without layout modifications.

Functional Equivalence: Both components are classified as fixed-point DSP integrated circuits within the TNETV2510 base product family, maintaining identical functional classification and operational characteristics.

Product Status Advantage: The TNETV2510ZAV carries an active product status, ensuring ongoing availability and supply chain continuity, whereas the TNETV2510FIDZGW is classified as obsolete. This distinction makes the TNETV2510ZAV the appropriate selection for new designs and replacement applications requiring long-term component availability.

Export & Tariff Classification: Both components share identical ECCN and HTSUS classifications, maintaining equivalent regulatory treatment for international commerce and customs purposes.

Frequently Asked Questions (FAQ)

Q: Can the TNETV2510ZAV be used as a direct replacement for the TNETV2510FIDZGW on existing PCBs?

A: Yes. Both components share identical package specifications (240-LFBGA, 15x15 mm), pin counts (240), and functional classifications (fixed-point DSP). No PCB layout modifications are required for substitution.

Q: What is the difference between the supplier device packages listed for each part?

A: The main part specifies 240-BGA MICROSTAR (15x15), while the substitute specifies 240-NFBGA (15x15). Both designations refer to 240-pin ball grid array packages with identical 15x15 mm footprints. The nomenclature difference reflects supplier packaging designations but does not affect physical or electrical compatibility.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both components maintain identical RoHS3 compliance status, moisture sensitivity level (MSL 3, 168 hours), ECCN classification (3A991A2), and HTSUS tariff code (8542.31.0001). Regulatory and environmental performance characteristics are equivalent.

Q: Why is the TNETV2510FIDZGW classified as obsolete?

A: The obsolete classification indicates that the TNETV2510FIDZGW is no longer in active production. The TNETV2510ZAV, with active product status, represents the current production equivalent within the TNETV2510 product family.

Q: Are there any electrical parameter differences between these components?

A: The provided specifications do not include detailed electrical parameters (voltage ratings, clock rates, memory specifications) for either component. Substitution is based on package compatibility, functional classification, and compliance certifications. For applications requiring specific electrical characteristics, detailed datasheets should be consulted.

Q: What is the inventory status for these parts?

A: The TNETV2510FIDZGW has 945 pieces in stock (new original). The TNETV2510ZAV has 1,086 pieces in stock (new original). Both components are available for immediate procurement.

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