TNETV2510ENGGW Equivalent & Substitute Parts

Part Overview

The TNETV2510ENGGW is a fixed-point Digital Signal Processor (DSP) integrated circuit manufactured by Texas Instruments, housed in a 240-LFBGA package. This component is classified as an embedded IC and is currently listed with obsolete product status. The device is surface-mounted and designed for applications requiring fixed-point DSP functionality.

Due to its obsolete status, identifying equivalent and substitute parts is necessary for system redesign, production continuation, and long-term supply chain management. Active alternatives with compatible electrical and mechanical specifications are available to support ongoing manufacturing requirements.

Substiute Parts

TNETV2510ENGGW
Texas InstrumentsIn Stock: 860TNETV2510ENGGW Datasheet
TNETV2510ENGGW
Current Part
TNETV2510ZAV
Texas InstrumentsIn Stock: 1107TNETV2510ZAV Datasheet
TNETV2510ZAV
Direct

Key Parameters

Parameter Value
Manufacturer Texas Instruments
Category Embedded, Integrated Circuits (ICs)
Description IC DSP FIXED POINT BGA
Type Fixed Point
Mounting Type Surface Mount
Package / Case 240-LFBGA
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN 3A991A2
HTSUS 8542.31.0001

Substitute Part Grouping Explanation

Substitution of the TNETV2510ENGGW is determined by the following critical parameters:

Electrical Compatibility:

  • Fixed-point DSP architecture classification
  • Identical ECCN and HTSUS codes confirming regulatory equivalence

Mechanical Compatibility:

  • 240-LFBGA package type
  • Surface mount mounting technology
  • 15x15 footprint dimensions (maintained across variants)
  • Moisture Sensitivity Level 3 (168 Hours) specification

Functional Equivalence:

  • Base product number alignment (TNETV2510 series)
  • Embedded IC category classification

The substitute part TNETV2510ZAV shares all critical parameters with the main part, with the primary distinction being active product status and enhanced compliance certifications.

Parameter Comparison

Parameter TNETV2510ENGGW TNETV2510ZAV
Manufacturer Texas Instruments Texas Instruments
Category Embedded, Integrated Circuits (ICs) Embedded, Integrated Circuits (ICs)
Description IC DSP FIXED POINT BGA IC DSP FIXED POINT BGA
Type Fixed Point Fixed Point
Mounting Type Surface Mount Surface Mount
Package / Case 240-LFBGA 240-LFBGA
Supplier Device Package 240-BGA MICROSTAR (15x15) 240-NFBGA (15x15)
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant
REACH Status Not specified REACH Unaffected

Engineering Selection Recommendations

TNETV2510ZAV is the direct substitute for TNETV2510ENGGW based on the following engineering criteria:

Product Status Alignment: The TNETV2510ZAV maintains active product status, ensuring continued availability and manufacturer support. The TNETV2510ENGGW is obsolete, making the active variant the appropriate selection for new designs and production continuity.

Compliance and Certification: The TNETV2510ZAV is ROHS3 compliant and REACH unaffected, providing enhanced environmental and regulatory compliance compared to the non-compliant TNETV2510ENGGW. Both parts share identical ECCN and HTSUS classifications, confirming regulatory equivalence for export and trade purposes.

Mechanical and Electrical Equivalence: Both parts are housed in 240-LFBGA packages with identical footprint dimensions (15x15), surface-mount technology, and MSL 3 specifications. The fixed-point DSP architecture and embedded IC classification are preserved across both variants.

Supply Chain Considerations: The TNETV2510ZAV has higher inventory availability (1086 Pcs) compared to the TNETV2510ENGGW (837 Pcs), supporting production requirements and reducing lead-time risk.

Frequently Asked Questions (FAQ)

Q: Can TNETV2510ZAV be used as a direct replacement for TNETV2510ENGGW?

A: Yes. Both parts share identical package specifications (240-LFBGA, 15x15 footprint), mounting technology (surface mount), and functional classification (fixed-point DSP). The electrical and mechanical interfaces are equivalent, supporting direct substitution at the PCB level.

Q: What is the difference between the supplier device packages listed?

A: The TNETV2510ENGGW uses a 240-BGA MICROSTAR package variant, while the TNETV2510ZAV uses a 240-NFBGA variant. Both maintain the same 15x15 footprint dimensions and 240-ball BGA configuration, ensuring PCB compatibility without layout modifications.

Q: Why is RoHS compliance different between the two parts?

A: The TNETV2510ENGGW predates RoHS3 requirements and is listed as non-compliant. The TNETV2510ZAV is manufactured to current ROHS3 standards. For applications subject to RoHS regulations or customer requirements, the TNETV2510ZAV is the appropriate selection.

Q: Are there any thermal or electrical performance differences?

A: No thermal or electrical performance parameters are provided in the component specifications. Both parts are classified identically as fixed-point DSP ICs within the TNETV2510 base product family.

Q: What is the significance of the identical ECCN and HTSUS codes?

A: Identical ECCN (3A991A2) and HTSUS (8542.31.0001) codes confirm that both parts fall under the same export control and tariff classifications. This ensures regulatory equivalence for international trade and procurement purposes.

Q: Is the MSL 3 specification the same for both parts?

A: Yes. Both parts carry MSL 3 (168 Hours) moisture sensitivity specifications, indicating identical handling, storage, and reflow requirements during assembly and manufacturing processes.

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