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TNETV2510ENGGW Equivalent & Substitute Parts
Part Overview
The TNETV2510ENGGW is a fixed-point Digital Signal Processor (DSP) integrated circuit manufactured by Texas Instruments, housed in a 240-LFBGA package. This component is classified as an embedded IC and is currently listed with obsolete product status. The device is surface-mounted and designed for applications requiring fixed-point DSP functionality.
Due to its obsolete status, identifying equivalent and substitute parts is necessary for system redesign, production continuation, and long-term supply chain management. Active alternatives with compatible electrical and mechanical specifications are available to support ongoing manufacturing requirements.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Category | Embedded, Integrated Circuits (ICs) |
| Description | IC DSP FIXED POINT BGA |
| Type | Fixed Point |
| Mounting Type | Surface Mount |
| Package / Case | 240-LFBGA |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| ECCN | 3A991A2 |
| HTSUS | 8542.31.0001 |
Substitute Part Grouping Explanation
Substitution of the TNETV2510ENGGW is determined by the following critical parameters:
Electrical Compatibility:
- Fixed-point DSP architecture classification
- Identical ECCN and HTSUS codes confirming regulatory equivalence
Mechanical Compatibility:
- 240-LFBGA package type
- Surface mount mounting technology
- 15x15 footprint dimensions (maintained across variants)
- Moisture Sensitivity Level 3 (168 Hours) specification
Functional Equivalence:
- Base product number alignment (TNETV2510 series)
- Embedded IC category classification
The substitute part TNETV2510ZAV shares all critical parameters with the main part, with the primary distinction being active product status and enhanced compliance certifications.
Parameter Comparison
| Parameter | TNETV2510ENGGW | TNETV2510ZAV |
|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments |
| Category | Embedded, Integrated Circuits (ICs) | Embedded, Integrated Circuits (ICs) |
| Description | IC DSP FIXED POINT BGA | IC DSP FIXED POINT BGA |
| Type | Fixed Point | Fixed Point |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 240-LFBGA | 240-LFBGA |
| Supplier Device Package | 240-BGA MICROSTAR (15x15) | 240-NFBGA (15x15) |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| ECCN | 3A991A2 | 3A991A2 |
| HTSUS | 8542.31.0001 | 8542.31.0001 |
| Product Status | Obsolete | Active |
| RoHS Status | RoHS non-compliant | ROHS3 Compliant |
| REACH Status | Not specified | REACH Unaffected |
Engineering Selection Recommendations
TNETV2510ZAV is the direct substitute for TNETV2510ENGGW based on the following engineering criteria:
Product Status Alignment: The TNETV2510ZAV maintains active product status, ensuring continued availability and manufacturer support. The TNETV2510ENGGW is obsolete, making the active variant the appropriate selection for new designs and production continuity.
Compliance and Certification: The TNETV2510ZAV is ROHS3 compliant and REACH unaffected, providing enhanced environmental and regulatory compliance compared to the non-compliant TNETV2510ENGGW. Both parts share identical ECCN and HTSUS classifications, confirming regulatory equivalence for export and trade purposes.
Mechanical and Electrical Equivalence: Both parts are housed in 240-LFBGA packages with identical footprint dimensions (15x15), surface-mount technology, and MSL 3 specifications. The fixed-point DSP architecture and embedded IC classification are preserved across both variants.
Supply Chain Considerations: The TNETV2510ZAV has higher inventory availability (1086 Pcs) compared to the TNETV2510ENGGW (837 Pcs), supporting production requirements and reducing lead-time risk.
Frequently Asked Questions (FAQ)
Q: Can TNETV2510ZAV be used as a direct replacement for TNETV2510ENGGW?
A: Yes. Both parts share identical package specifications (240-LFBGA, 15x15 footprint), mounting technology (surface mount), and functional classification (fixed-point DSP). The electrical and mechanical interfaces are equivalent, supporting direct substitution at the PCB level.
Q: What is the difference between the supplier device packages listed?
A: The TNETV2510ENGGW uses a 240-BGA MICROSTAR package variant, while the TNETV2510ZAV uses a 240-NFBGA variant. Both maintain the same 15x15 footprint dimensions and 240-ball BGA configuration, ensuring PCB compatibility without layout modifications.
Q: Why is RoHS compliance different between the two parts?
A: The TNETV2510ENGGW predates RoHS3 requirements and is listed as non-compliant. The TNETV2510ZAV is manufactured to current ROHS3 standards. For applications subject to RoHS regulations or customer requirements, the TNETV2510ZAV is the appropriate selection.
Q: Are there any thermal or electrical performance differences?
A: No thermal or electrical performance parameters are provided in the component specifications. Both parts are classified identically as fixed-point DSP ICs within the TNETV2510 base product family.
Q: What is the significance of the identical ECCN and HTSUS codes?
A: Identical ECCN (3A991A2) and HTSUS (8542.31.0001) codes confirm that both parts fall under the same export control and tariff classifications. This ensures regulatory equivalence for international trade and procurement purposes.
Q: Is the MSL 3 specification the same for both parts?
A: Yes. Both parts carry MSL 3 (168 Hours) moisture sensitivity specifications, indicating identical handling, storage, and reflow requirements during assembly and manufacturing processes.
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