TMS320VC5506GHH Equivalent & Substitute Parts

Part Overview

The TMS320VC5506GHH is a fixed-point digital signal processor (DSP) from Texas Instruments' TMS320C55x series, housed in a 179-LFBGA package. This embedded integrated circuit operates at 108MHz with 128kB on-chip RAM and supports Host Interface, I2C, and McBSP communication protocols. The part is currently classified as obsolete, making identification of active equivalent models essential for ongoing system support and new design implementations.

Substiute Parts

TMS320VC5506GHH

Texas InstrumentsIn Stock: 2280TMS320VC5506GHH Datasheet

Current PartRFQ

TMS320VC5506GBB

Texas InstrumentsIn Stock: 1029TMS320VC5506GBB Datasheet

DirectRFQ

TMS320VC5506ZAY

Texas InstrumentsIn Stock: 945TMS320VC5506ZAY Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TMS320VC5506GHH is determined by strict equivalence across the following critical parameters:

• Manufacturer and series (Texas Instruments TMS320C55x)
• Fixed-point DSP architecture and type
• Clock rate (108MHz)
• On-chip RAM capacity (128kB)
• Communication interfaces (Host Interface, I2C, McBSP)
• Core voltage (1.20V) and I/O voltage range (3.00V, 3.30V)
• Operating temperature range (-40°C ~ 85°C TC)
• Package type (179-LFBGA) and mounting method (Surface Mount)
• Moisture sensitivity level (MSL 3)

Both identified substitute parts—TMS320VC5506GBB and TMS320VC5506ZAY—meet all electrical and mechanical compatibility requirements with the main part number.

Parameter Comparison

Engineering Selection Recommendations

Both TMS320VC5506GBB and TMS320VC5506ZAY are electrically and mechanically equivalent to the obsolete TMS320VC5506GHH across all functional parameters. Selection between these two active alternatives depends on regulatory and compliance requirements:

TMS320VC5506GBB is suitable for applications where REACH compliance is required. This part maintains active product status and is available in tray packaging.

TMS320VC5506ZAY is the preferred choice for new designs requiring RoHS3 compliance. This part carries ROHS3 Compliant certification and REACH Unaffected status, making it optimal for applications subject to environmental and hazardous substance restrictions.

Both parts are available in production quantities and support identical electrical interfaces, memory configurations, and thermal operating ranges as the original TMS320VC5506GHH.

Frequently Asked Questions (FAQ)

Q: Can TMS320VC5506GBB and TMS320VC5506ZAY be used interchangeably with TMS320VC5506GHH?

A: Yes. Both substitute parts are electrically and mechanically equivalent. They share identical clock rates (108MHz), on-chip RAM (128kB), voltage specifications (1.20V core, 3.0V/3.3V I/O), operating temperature range (-40°C ~ 85°C TC), and 179-LFBGA package configuration. Pin-for-pin compatibility is maintained across all communication interfaces.

Q: What is the difference between TMS320VC5506GBB and TMS320VC5506ZAY?

A: The primary differences are regulatory compliance certifications. TMS320VC5506ZAY is ROHS3 Compliant and REACH Unaffected, while TMS320VC5506GBB is RoHS non-compliant but REACH Affected. Both are functionally identical in electrical and mechanical specifications.

Q: Why is the TMS320VC5506GHH classified as obsolete?

A: Product obsolescence is determined by manufacturer lifecycle status. Active alternatives (TMS320VC5506GBB and TMS320VC5506ZAY) are available for new designs and ongoing system support.

Q: Are there packaging differences between these parts?

A: All three parts use the 179-LFBGA package with surface mount configuration. The main part number specifies 179-BGA MicroStar (12x12), while substitute parts specify 179-NFBGA (12x12). Both package designations refer to the same 179-ball fine-pitch ball grid array footprint and are mechanically compatible.

Q: What is the Moisture Sensitivity Level (MSL) for these parts?

A: All three parts carry MSL 3 rating with a 168-hour floor life. This indicates standard moisture sensitivity requiring controlled storage and handling conditions during assembly.