TMS320VC5503ZHH Equivalent & Substitute Parts

Part Overview

The TMS320VC5503ZHH is a fixed-point digital signal processor (DSP) from Texas Instruments' TMS320C55x series, housed in a 179-LFBGA package. This embedded integrated circuit operates at 200MHz with integrated ROM (64kB) and on-chip RAM (64kB), designed for applications requiring real-time signal processing capabilities. The part is currently classified as obsolete, making identification of compatible substitute components essential for ongoing system support and new design implementations.

Substiute Parts

TMS320VC5503ZHH

Texas InstrumentsIn Stock: 1999TMS320VC5503ZHH Datasheet

Current PartRFQ

TMS320VC5503ZAY

Texas InstrumentsIn Stock: 1011TMS320VC5503ZAY Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TMS320VC5503ZHH is determined by strict alignment across the following critical parameters:

• Processor Series & Type: Must belong to TMS320C55x series and maintain fixed-point DSP architecture
• Clock Frequency: Must operate at 200MHz
• Memory Configuration: ROM (64kB) and on-chip RAM (64kB) specifications must match
• Package Specification: 179-LFBGA or equivalent 179-pin BGA footprint (12x12mm)
• Voltage Requirements: Core voltage 1.60V and I/O voltage 3.00V/3.30V compatibility
• Operating Temperature Range: -40°C to 85°C (TC)
• Interface Protocols: Host Interface, I2C, and McBSP support required
• Compliance Standards: ROHS3 compliance and MSL 3 rating

The TMS320VC5503ZAY qualifies as a direct substitute based on full alignment with all specified parameters.

Parameter Comparison

Engineering Selection Recommendations

The TMS320VC5503ZAY is a qualified direct substitute for the obsolete TMS320VC5503ZHH. Both components maintain identical electrical specifications, memory configurations, and interface protocols. The primary distinction is product status: the TMS320VC5503ZAY is currently active in production, whereas the TMS320VC5503ZHH is obsolete.

Both parts carry ROHS3 compliance and identical MSL 3 ratings, ensuring equivalent environmental and handling requirements. The 179-pin BGA package variants (LFBGA vs. NFBGA) are mechanically and electrically compatible within the specified 12x12mm footprint.

For applications currently using the TMS320VC5503ZHH, transition to the TMS320VC5503ZAY is supported by full parameter alignment and active manufacturing availability.

Frequently Asked Questions (FAQ)

Q: Can the TMS320VC5503ZAY directly replace the TMS320VC5503ZHH on existing PCBs?

A: Yes. Both components use 179-pin BGA packages with identical 12x12mm footprints. Electrical specifications, voltage requirements, memory configuration, and interface protocols are fully compatible. PCB layout and reflow profiles remain unchanged.

Q: What is the difference between 179-LFBGA and 179-NFBGA packages?

A: Both designations refer to 179-pin fine-pitch ball grid array packages in 12x12mm form factor. The variants represent different manufacturing processes from Texas Instruments but maintain identical electrical and mechanical compatibility for this product line.

Q: Why is the TMS320VC5503ZHH classified as obsolete?

A: Product obsolescence reflects Texas Instruments' manufacturing lifecycle decisions. The TMS320VC5503ZAY remains in active production with identical specifications, providing continuity for system designs and component sourcing.

Q: Are there any compliance or certification differences between these parts?

A: No. Both components carry ROHS3 compliance, identical MSL 3 ratings (168 hours), and matching REACH and ECCN classifications. Environmental and regulatory requirements are equivalent.

Q: What is the inventory status for these parts?

A: The TMS320VC5503ZHH has 1900 pieces available as new original stock. The TMS320VC5503ZAY has 920 pieces available as new original stock in tray packaging.