TMS320DM335DZCE216 Equivalent & Substitute Parts

Part Overview

The TMS320DM335DZCE216 is a Digital Media System-on-Chip (DMSoC) from Texas Instruments' DaVinci™ series, designed for embedded multimedia applications. This device integrates a 216MHz processor with comprehensive media processing capabilities, including ASP, EBI/EMI, I2C, SPI, UART, and USB interfaces. The part is currently in Last Time Buy status, indicating end-of-life transition. Identifying qualified substitute components is essential for design continuity and long-term supply chain planning.

Substiute Parts

TMS320DM335DZCE216
Texas InstrumentsIn Stock: 888TMS320DM335DZCE216 Datasheet
TMS320DM335DZCE216
Current Part
TMS320DM355DZCE216
Texas InstrumentsIn Stock: 1987TMS320DM355DZCE216 Datasheet
TMS320DM355DZCE216
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Texas Instruments
Series TMS320DM3x, DaVinci™
Type Digital Media System-on-Chip (DMSoC)
Clock Rate 216MHz
Package / Case 337-LFBGA (13x13)
Voltage - Core 1.30V
Voltage - I/O 1.8V, 3.3V
On-Chip RAM 56kB
Non-Volatile Memory ROM (8kB)
Operating Temperature 0°C ~ 85°C (TC)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the TMS320DM335DZCE216 is determined by strict alignment of the following critical parameters:

  • Package / Case: 337-LFBGA (13x13) form factor
  • Clock Rate: 216MHz processor speed
  • Core Voltage: 1.30V supply requirement
  • I/O Voltage: 1.8V and 3.3V compatibility
  • Memory Configuration: 56kB on-chip RAM and 8kB ROM
  • Operating Temperature Range: 0°C ~ 85°C
  • Mounting Type: Surface Mount BGA technology
  • Compliance: ROHS3 and REACH standards

The TMS320DM355DZCE216 qualifies as a manufacturer-recommended substitute based on identical electrical specifications, memory architecture, thermal characteristics, and package geometry. Interface differences (absence of EBI/EMI in the substitute) do not preclude substitution when those interfaces are not required in the application.

Parameter Comparison

Parameter TMS320DM335DZCE216 TMS320DM355DZCE216 Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Series TMS320DM3x, DaVinci™ TMS320DM3x, DaVinci™ Identical
Type Digital Media System-on-Chip (DMSoC) Digital Media System-on-Chip (DMSoC) Identical
Clock Rate 216MHz 216MHz Identical
Package / Case 337-LFBGA (13x13) 337-LFBGA (13x13) Identical
Voltage - Core 1.30V 1.30V Identical
Voltage - I/O 1.8V, 3.3V 1.8V, 3.3V Identical
On-Chip RAM 56kB 56kB Identical
Non-Volatile Memory ROM (8kB) ROM (8kB) Identical
Operating Temperature 0°C ~ 85°C (TC) 0°C ~ 85°C (TC) Identical
Mounting Type Surface Mount Surface Mount Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
MSL Rating 3 (168 Hours) 3 (168 Hours) Identical
Product Status Last Time Buy Not For New Designs Both End-of-Life

Engineering Selection Recommendations

The TMS320DM335DZCE216 and TMS320DM355DZCE216 are electrically and mechanically equivalent within the scope of their shared specifications. Both devices maintain ROHS3 compliance and REACH unaffected status, satisfying regulatory requirements for industrial and commercial applications.

Selection between these parts should be based on:

  • Supply Availability: The TMS320DM355DZCE216 currently maintains higher inventory (1,900 units) compared to the TMS320DM335DZCE216 (854 units), providing improved procurement flexibility.
  • Product Lifecycle Status: Both parts are in end-of-life phases. The TMS320DM335DZCE216 is designated Last Time Buy, while the TMS320DM355DZCE216 is marked Not For New Designs. For new product development, neither part is recommended; alternative current-generation DaVinci™ processors should be evaluated.
  • Interface Requirements: Verify that the absence of EBI/EMI interface in the TMS320DM355DZCE216 does not impact application requirements before substitution.
  • Packaging Format: The TMS320DM335DZCE216 is supplied in Tray packaging, while the TMS320DM355DZCE216 is supplied in Tube packaging. Confirm compatibility with receiving and assembly processes.

Frequently Asked Questions (FAQ)

Q: Are the TMS320DM335DZCE216 and TMS320DM355DZCE216 pin-compatible?

A: Both devices use the 337-LFBGA (13x13) package with identical pinout geometry. Pin-level compatibility is confirmed for all shared interfaces (ASP, I2C, SPI, UART, USB). The TMS320DM335DZCE216 includes EBI/EMI interfaces not present on the TMS320DM355DZCE216; verify these are not required in your application before substitution.

Q: Can I substitute the TMS320DM355DZCE216 for the TMS320DM335DZCE216 in existing designs?

A: Substitution is permissible when EBI/EMI interfaces are not utilized. All other electrical parameters, memory configuration, thermal characteristics, and voltage requirements are identical. PCB layout and firmware compatibility should be verified before implementation.

Q: What is the difference in packaging between these parts?

A: The TMS320DM335DZCE216 is supplied in Tray packaging, while the TMS320DM355DZCE216 is supplied in Tube packaging. Both formats are standard for surface-mount BGA components. Confirm your assembly process accommodates the supplied packaging format.

Q: Are both parts suitable for new product designs?

A: No. The TMS320DM335DZCE216 is in Last Time Buy status, and the TMS320DM355DZCE216 is marked Not For New Designs. Both parts are end-of-life. For new product development, evaluate current-generation Texas Instruments DaVinci™ series processors or alternative embedded media processing solutions.

Q: Do these parts meet current compliance standards?

A: Both the TMS320DM335DZCE216 and TMS320DM355DZCE216 are ROHS3 compliant and REACH unaffected, satisfying current environmental and regulatory requirements for industrial applications.

Q: What is the moisture sensitivity level for these components?

A: Both parts carry MSL Rating 3 (168 Hours), indicating standard moisture sensitivity. Standard handling and storage procedures for BGA components apply.

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