TMS-105-59-L-S Equivalent & Substitute Parts

Part Overview

The TMS-105-59-L-S is a 0.050" (1.27mm) pitch micro header connector manufactured by Samtec Inc. This through-hole rectangular connector features 5 positions in a single row configuration with male pin contacts, designed for board-to-board applications. The part is currently active in production with 815 units in stock. Equivalent and substitute parts are identified to support design flexibility, inventory management, and supply chain continuity for applications requiring compatible 0.050" pitch header connectors with identical electrical and mechanical specifications.

Substiute Parts

TMS-105-59-L-S
Samtec Inc.In Stock: 863TMS-105-59-L-S Datasheet
TMS-105-59-L-S
Current Part
HTMS-105-59-L-S
Samtec Inc.In Stock: 877HTMS-105-59-L-S Datasheet
HTMS-105-59-L-S
Similar

Key Parameters

Parameter Specification
Pitch - Mating 0.050" (1.27mm)
Number of Positions 5
Number of Rows 1
Connector Type Header
Contact Type Male Pin
Mounting Type Through Hole
Termination Solder
Contact Length - Mating 0.535" (14.69mm)
Contact Length - Post 0.120" (3.05mm)
Overall Contact Length 0.755" (19.18mm)
Insulation Height 0.100" (2.54mm)
Contact Material Phosphor Bronze
Contact Finish - Mating Gold (10.0µin / 0.25µm)
Contact Finish - Post Tin
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C ~ 125°C
Current Rating 5A per Contact
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the TMS-105-59-L-S is determined by strict equivalence across the following critical parameters:

  • Pitch - Mating: 0.050" (1.27mm)
  • Number of Positions: 5
  • Number of Rows: 1
  • Connector Type: Header
  • Contact Type: Male Pin
  • Mounting Type: Through Hole
  • Termination: Solder
  • Contact dimensions (Mating, Post, Overall)
  • Insulation Height: 0.100" (2.54mm)
  • Contact Material: Phosphor Bronze
  • Contact Finish specifications (Mating and Post)
  • Insulation Material: Liquid Crystal Polymer (LCP)
  • Operating Temperature range: -55°C ~ 125°C
  • Current Rating: 5A per Contact
  • Material Flammability Rating: UL94 V-0
  • RoHS Compliance: ROHS3 Compliant

The HTMS-105-59-L-S meets all substitution criteria and is classified as a direct equivalent part.

Parameter Comparison

Parameter TMS-105-59-L-S HTMS-105-59-L-S Match
Manufacturer Samtec Inc. Samtec Inc.
Category Rectangular Connectors Rectangular Connectors
Connector Type Header Header
Contact Type Male Pin Male Pin
Pitch - Mating 0.050" (1.27mm) 0.050" (1.27mm)
Number of Positions 5 5
Number of Rows 1 1
Mounting Type Through Hole Through Hole
Termination Solder Solder
Contact Length - Mating 0.535" (14.69mm) 0.535" (14.69mm)
Contact Length - Post 0.120" (3.05mm) 0.120" (3.05mm)
Overall Contact Length 0.755" (19.18mm) 0.755" (19.18mm)
Insulation Height 0.100" (2.54mm) 0.100" (2.54mm)
Contact Shape Square Square
Contact Finish - Mating Gold Gold
Contact Finish Thickness - Mating 10.0µin (0.25µm) 10.0µin (0.25µm)
Contact Finish - Post Tin Tin
Contact Material Phosphor Bronze Phosphor Bronze
Insulation Material Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP)
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C
Current Rating (Amps) 5A per Contact 5A per Contact
Material Flammability Rating UL94 V-0 UL94 V-0
Insulation Color Black Black
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) Not specified
Product Status Active Active

Engineering Selection Recommendations

The HTMS-105-59-L-S is a direct equivalent substitute for the TMS-105-59-L-S. Both parts are manufactured by Samtec Inc., carry active product status, and maintain identical electrical and mechanical specifications across all critical parameters. Both parts are ROHS3 compliant and carry UL94 V-0 flammability certification, meeting regulatory requirements for industrial and commercial applications.

Selection between these parts may be based on inventory availability. The TMS-105-59-L-S currently has 815 units in stock, while the HTMS-105-59-L-S has 826 units available. Both parts are suitable for immediate deployment in applications requiring 0.050" pitch, 5-position through-hole header connectors with 5A per contact current capacity and -55°C to 125°C operating temperature range.

Frequently Asked Questions (FAQ)

Q: Can HTMS-105-59-L-S be used as a direct replacement for TMS-105-59-L-S?

A: Yes. The HTMS-105-59-L-S is a direct equivalent. All electrical and mechanical parameters, including pitch, contact dimensions, materials, finishes, current rating, temperature range, and compliance certifications are identical.

Q: What are the key parameters that determine substitution eligibility?

A: Substitution eligibility is determined by matching: 0.050" (1.27mm) pitch, 5 positions in 1 row, male pin contacts, through-hole solder termination, identical contact dimensions (0.535" mating length, 0.120" post length), phosphor bronze material with gold-plated mating contacts and tin-plated posts, LCP insulation, 5A per contact current rating, -55°C to 125°C operating temperature, and UL94 V-0 flammability rating.

Q: Are there any differences in packaging or handling between these parts?

A: Both parts are supplied in bulk packaging with identical moisture sensitivity level classification (MSL 1 - Unlimited), indicating no special storage or handling requirements beyond standard component care.

Q: What is the difference between the TMS and HTMS series designations?

A: The TMS-105 and HTMS-105 represent different series within Samtec's micro header product line. The HTMS designation indicates a through-hole variant within the HTMS series, while TMS represents the standard TMS series. Despite the series designation difference, the TMS-105-59-L-S and HTMS-105-59-L-S maintain complete parameter equivalence for substitution purposes.

Q: Are both parts suitable for the same PCB footprint?

A: Yes. Identical contact dimensions, pitch, insulation height, and mounting type ensure both parts are compatible with the same PCB footprint and assembly process.

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