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TMP75BIDR Equivalent & Substitute Parts
Part Overview
The TMP75BIDR is a digital temperature sensor manufactured by Texas Instruments, designed for local temperature measurement across the range of -55°C to 125°C. This 8-SOIC surface mount device operates on a supply voltage of 1.4V to 3.6V and communicates via SMBus protocol with 11-bit resolution. The device is currently in active production status with 37,700 units in stock.
Substitute parts are identified when equivalent electrical and mechanical parameters align with the main part specifications, enabling direct replacement in applications where the TMP75BIDR may be unavailable or when alternative packaging formats are required.
Substiute Parts
Key Parameters
| Parameter | TMP75BIDR |
|---|---|
| Manufacturer | Texas Instruments |
| Sensor Type | Digital, Local |
| Sensing Temperature Range | -55°C ~ 125°C |
| Output Type | SMBus |
| Supply Voltage | 1.4V ~ 3.6V |
| Resolution | 11 bits |
| Accuracy | ±2°C (-20°C ~ 85°C) / ±3°C (-55°C ~ 125°C) |
| Package Type | 8-SOIC (0.154", 3.90mm Width) |
| Mounting Type | Surface Mount |
| Operating Temperature | -55°C ~ 125°C |
| RoHS Status | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) |
Substitute Part Grouping Explanation
Substitute parts for the TMP75BIDR are qualified based on the following electrical and mechanical parameters:
Critical Matching Parameters:
- Sensor Type: Digital, Local
- Sensing Temperature Range: -55°C ~ 125°C
- Package Type: 8-SOIC (0.154", 3.90mm Width)
- Mounting Type: Surface Mount
- Resolution: 11 bits
- Operating Temperature: -55°C ~ 125°C
Compatible Communication Protocols: The TMP75BIDR uses SMBus protocol. Substitute parts using I2C/SMBus are compatible, as SMBus is a subset of I2C and maintains backward compatibility for temperature sensor applications.
Voltage Supply Compatibility: The TMP75BIDR operates at 1.4V ~ 3.6V. Substitute parts with supply voltage ranges of 1.7V ~ 5.5V are compatible, as they encompass the original operating range.
Accuracy Considerations: Substitute parts with accuracy specifications of ±1°C to ±3°C are functionally equivalent for applications requiring the TMP75BIDR's accuracy class.
The following Microchip Technology parts meet these substitution criteria: AT30TS74-SS8M-B, AT30TS74-SS8M-T, AT30TS750A-SS8M-B, AT30TS75A-SS8M-T, AT30TSE752A-SS8M-B, AT30TSE752A-SS8M-T, AT30TSE754A-SS8M-B, AT30TSE758A-SS8M-B, and MCP9844T-BE/MNY.
Parameter Comparison
| Parameter | TMP75BIDR | AT30TS74-SS8M-B | AT30TS74-SS8M-T | AT30TS750A-SS8M-B | AT30TS75A-SS8M-T | AT30TSE752A-SS8M-B | AT30TSE752A-SS8M-T | AT30TSE754A-SS8M-B | AT30TSE758A-SS8M-B | MCP9844T-BE/MNY |
|---|---|---|---|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Sensor Type | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Digital, Local | Internal |
| Sensing Temperature Range | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -40°C ~ 125°C |
| Output Type | SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | I2C/SMBus | 2-Wire Serial, I2C |
| Supply Voltage | 1.4V ~ 3.6V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 5.5V | 1.7V ~ 3.6V |
| Resolution | 11 bits | 11 bits | 11 bits | 11 bits | 11 bits | 11 bits | 11 bits | 11 bits | 11 bits | Not specified |
| Accuracy | ±2°C / ±3°C | ±2°C / ±3°C | ±2°C / ±3°C | ±1°C / ±3°C | ±1°C / ±3°C | ±1°C / ±3°C | ±1°C / ±3°C | ±1°C / ±3°C | ±1°C / ±3°C | ±3°C |
| Package Type | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-SOIC | 8-TDFN |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -40°C ~ 125°C |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| MSL Rating | 1 (Unlimited) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) | 1 (Unlimited) | 1 (Unlimited) | 3 (168 Hours) | 1 (Unlimited) | 3 (168 Hours) | 1 (Unlimited) |
| Packaging Format | Cut Tape (CT) & Digi-Reel® | Tube | Cut Tape (CT) & Digi-Reel® | Tube | Tape & Reel (TR) | Tube | Tape & Reel (TR) | Tube | Tube | Cut Tape (CT) & Digi-Reel® |
| Inventory Status | 37,700 Pcs | 1,340 Pcs | 1,148 Pcs | 1,570 Pcs | 9,386 Pcs | 1,475 Pcs | 17,632 Pcs | 1,252 Pcs | 1,000,399 Pcs | 6,561 Pcs |
Engineering Selection Recommendations
Primary Substitutes (8-SOIC Package, Identical Footprint):
The AT30TS74-SS8M-T, AT30TS75A-SS8M-T, AT30TSE752A-SS8M-T, and AT30TSE758A-SS8M-B are direct mechanical and electrical substitutes for the TMP75BIDR. All maintain the 8-SOIC package format, support I2C/SMBus communication, and operate across the -55°C to 125°C temperature range. These parts are ROHS3 compliant and suitable for applications requiring the original device's thermal measurement capabilities.
Packaging Considerations:
The TMP75BIDR is supplied in Cut Tape (CT) & Digi-Reel® format. Substitute parts are available in multiple packaging formats: Tube, Cut Tape (CT) & Digi-Reel®, and Tape & Reel (TR). Selection should align with assembly line requirements and inventory management practices.
Moisture Sensitivity Level (MSL):
The TMP75BIDR carries MSL 1 (Unlimited) rating. Substitute parts with MSL 3 (168 Hours) require controlled storage conditions and have a 168-hour floor life after moisture exposure. For applications with extended storage or high-humidity environments, MSL 1 rated substitutes (AT30TS75A-SS8M-T, AT30TSE752A-SS8M-B, AT30TSE754A-SS8M-B) are preferred.
Alternative Package Option:
The MCP9844T-BE/MNY offers an alternative in 8-TDFN package format with I2C communication. This part operates at -40°C to 125°C (narrower low-temperature range than the TMP75BIDR) and is suitable for applications where package size reduction is beneficial and the -40°C minimum temperature is acceptable.
Compliance and Regulatory Status:
All substitute parts maintain ROHS3 compliance and REACH unaffected status, matching the regulatory profile of the TMP75BIDR. All parts carry EAR99 ECCN classification and HTSUS code 8542.39.0001.
Frequently Asked Questions (FAQ)
Q: Can AT30TS74-SS8M-T directly replace TMP75BIDR in existing PCB designs?
A: Yes. Both devices use the 8-SOIC package with identical 0.154" width and 3.90mm dimensions. Pin-to-pin compatibility is maintained for temperature measurement, SMBus/I2C communication, and power supply connections. No PCB layout modifications are required.
Q: What is the difference between I2C and SMBus output types?
A: SMBus is a subset of I2C protocol. Devices with I2C/SMBus output support both communication standards. The TMP75BIDR uses SMBus; substitute parts with I2C/SMBus output are fully compatible and can operate in SMBus mode.
Q: Are there accuracy differences between substitute parts?
A: The TMP75BIDR specifies ±2°C accuracy across -20°C to 85°C and ±3°C across -55°C to 125°C. Several substitutes (AT30TS750A-SS8M-B, AT30TS75A-SS8M-T, AT30TSE752A-SS8M-B, AT30TSE752A-SS8M-T, AT30TSE754A-SS8M-B, AT30TSE758A-SS8M-B) offer improved accuracy of ±1°C across 0°C to 85°C. AT30TS74-SS8M-B and AT30TS74-SS8M-T maintain the same ±2°C/±3°C accuracy specification.
Q: What does MSL 3 (168 Hours) mean for component handling?
A: MSL 3 rated components have a 168-hour floor life after exposure to moisture. After this period, the component must be baked before reflow soldering. MSL 1 rated components have unlimited floor life and do not require baking. For high-volume production or extended storage, MSL 1 parts reduce handling complexity.
Q: Why does MCP9844T-BE/MNY have a different package type?
A: The MCP9844T-BE/MNY uses 8-TDFN (2x3) package instead of 8-SOIC. This package is smaller and suitable for space-constrained applications. However, it requires different PCB footprint design and cannot be used as a direct drop-in replacement without layout modifications.
Q: What is the minimum operating temperature difference between TMP75BIDR and MCP9844T-BE/MNY?
A: The TMP75BIDR operates from -55°C; the MCP9844T-BE/MNY operates from -40°C. For applications requiring measurement below -40°C, the MCP9844T-BE/MNY is not suitable. For applications operating above -40°C, both devices are functionally equivalent.
Q: Are all substitute parts currently in active production?
A: Yes. All listed substitute parts carry Active product status, indicating current manufacturing availability and long-term supply continuity.
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