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Equivalent & Substitute Parts for TML-130-03-G-D
Part Overview
The TML-130-03-G-D is a shrouded rectangular connector header manufactured by Samtec Inc., designed for through-hole board-to-board applications. This 60-position connector operates at 0.050" (1.27mm) pitch with dual rows spaced 0.100" (2.54mm) apart. The component features a 4-wall shrouded design with gold-plated phosphor bronze contacts and is currently in active production status with ROHS3 compliance. Alternative equivalent parts may be required due to inventory constraints, packaging preferences, or specific application requirements.
Substiute Parts
Key Parameters
| Parameter | Value | Criticality for Substitution |
|---|---|---|
| Connector Type | Header | Critical |
| Contact Type | Male Pin | Critical |
| Pitch - Mating | 0.050" (1.27mm) | Critical |
| Number of Positions | 60 | Critical |
| Number of Rows | 2 | Critical |
| Row Spacing - Mating | 0.100" (2.54mm) | Critical |
| Mounting Type | Through Hole | Critical |
| Termination | Solder | Critical |
| Style | Board to Board | Critical |
| Shrouding | Shrouded | Important |
| Contact Finish - Mating | Gold | Important |
| Insulation Material | LCP / Thermoplastic | Important |
| Operating Temperature Range | -55°C ~ 125°C | Important |
| RoHS Status | ROHS3 Compliant | Important |
Substitute Part Grouping Explanation
Substitution eligibility for the TML-130-03-G-D is determined by strict alignment of critical electrical and mechanical parameters. The following parameters must match exactly:
- Connector Type: Header configuration
- Contact Type: Male Pin
- Pitch - Mating: 0.050" (1.27mm)
- Number of Positions: 60
- Number of Rows: 2
- Row Spacing - Mating: 0.100" (2.54mm)
- Mounting Type: Through Hole
- Termination: Solder
- Style: Board to Board or Board to Board/Cable compatible
The substitute parts identified (104068-6 and 5-104068-6) from TE Connectivity AMP Connectors meet all critical parameters. Both parts are members of the AMPMODU System 50 series and maintain full mechanical and electrical compatibility with the TML-130-03-G-D for standard board-to-board interconnection applications.
Parameter Comparison
| Parameter | TML-130-03-G-D (Samtec) | 104068-6 (TE Connectivity) | 5-104068-6 (TE Connectivity) |
|---|---|---|---|
| Manufacturer | Samtec Inc. | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors |
| Series | TML | AMPMODU System 50 | AMPMODU System 50 |
| Connector Type | Header | Header | Header |
| Contact Type | Male Pin | Male Pin | Male Pin |
| Pitch - Mating | 0.050" (1.27mm) | 0.050" (1.27mm) | 0.050" (1.27mm) |
| Number of Positions | 60 | 60 | 60 |
| Number of Rows | 2 | 2 | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Termination | Solder | Solder | Solder |
| Style | Board to Board | Board to Board or Cable | Board to Board or Cable |
| Shrouding | Shrouded - 4 Wall | Shrouded - 2 Wall | Shrouded - 2 Wall |
| Contact Shape | Square | Circular | Circular |
| Contact Finish - Mating | Gold | Gold | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | 30.0µin (0.76µm) | 30.0µin (0.76µm) |
| Contact Material | Phosphor Bronze | Copper Alloy | Copper Alloy |
| Insulation Material | Liquid Crystal Polymer (LCP) | Thermoplastic | Thermoplastic |
| Operating Temperature | -55°C ~ 125°C | -65°C ~ 105°C | -65°C ~ 105°C |
| Voltage Rating | Not specified | 30VAC | 30VAC |
| Contact Finish - Post | Gold | Tin-Lead | Tin |
| RoHS Status | ROHS3 Compliant | Not applicable | ROHS3 Compliant |
| Packaging | Bulk | Tube | Tube |
| Product Status | Active | Active | Active |
Engineering Selection Recommendations
Primary Substitute: 5-104068-6
The 5-104068-6 is the preferred equivalent substitute for the TML-130-03-G-D. Both parts maintain identical critical mating parameters (pitch, position count, row configuration, and mounting method). The 5-104068-6 carries ROHS3 compliance matching the original part specification and is currently in active production status. This part is supplied in tube packaging rather than bulk.
Secondary Substitute: 104068-6
The 104068-6 provides functional equivalence for all critical interconnection parameters. This variant differs in RoHS compliance status (not applicable versus ROHS3 compliant) and post contact finish (Tin-Lead versus Tin). Selection of this part requires verification that RoHS compliance is not mandated by the end application or regulatory environment.
Compatibility Considerations
Both substitute parts feature 2-wall shrouding compared to the 4-wall shrouding of the TML-130-03-G-D. Both employ circular contact geometry versus the square contacts of the original part. These design differences do not affect electrical or mechanical mating compatibility for standard board-to-board applications. The substitute parts support both board-to-board and cable-to-board configurations, providing additional application flexibility.
The operating temperature range of the substitute parts (-65°C ~ 105°C) is narrower than the TML-130-03-G-D (-55°C ~ 125°C). Applications requiring operation above 105°C or below -65°C must retain the original Samtec part.
Frequently Asked Questions (FAQ)
Q: Can the 104068-6 or 5-104068-6 be directly substituted for the TML-130-03-G-D in existing PCB designs?
A: Yes, for standard board-to-board applications. Both substitute parts maintain identical mating pitch (0.050"), position count (60), row spacing (0.100"), and through-hole solder termination. PCB footprints designed for the TML-130-03-G-D will accept either substitute part without modification.
Q: What is the difference between the two TE Connectivity substitute parts?
A: The 104068-6 and 5-104068-6 are functionally identical for mating purposes. The primary differences are RoHS compliance status (104068-6 is not applicable; 5-104068-6 is ROHS3 compliant) and post contact finish (Tin-Lead versus Tin). For new designs or applications with RoHS requirements, the 5-104068-6 is the appropriate selection.
Q: Why do the substitute parts have different shrouding configurations?
A: The TML-130-03-G-D features 4-wall shrouding while the TE Connectivity parts feature 2-wall shrouding. Both configurations provide adequate keying and mechanical guidance for mating operations. The 2-wall design of the substitute parts is standard for the AMPMODU System 50 series and does not compromise electrical or mechanical performance in board-to-board applications.
Q: Are there temperature limitations when using the substitute parts?
A: The substitute parts operate within -65°C to 105°C, which is narrower than the TML-130-03-G-D range of -55°C to 125°C. Applications requiring sustained operation above 105°C or below -65°C must use the original Samtec part.
Q: What is the difference in contact finish thickness?
A: The TML-130-03-G-D has 10.0µin (0.25µm) gold plating on mating contacts, while the substitute parts have 30.0µin (0.76µm). The thicker gold plating on the substitute parts provides enhanced wear resistance and contact durability, representing an improvement over the original specification.
Q: Can these parts be used in cable-to-board applications?
A: The substitute parts (104068-6 and 5-104068-6) support both board-to-board and cable-to-board configurations. The original TML-130-03-G-D is specified for board-to-board style only. If cable-to-board functionality is required, the TE Connectivity substitutes provide this additional capability.
Q: What packaging differences exist between these parts?
A: The TML-130-03-G-D is supplied in bulk packaging, while both substitute parts are supplied in tube packaging. Tube packaging may require different handling procedures in automated assembly environments. Verify compatibility with existing component handling and placement equipment.
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