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TML-105-01-G-D-RA Equivalent & Substitute Parts
Part Overview
The TML-105-01-G-D-RA is a shrouded rectangular connector header manufactured by Samtec Inc., designed for through-hole, right-angle board-to-board applications. This 10-position connector operates across a wide temperature range of -55°C to 125°C and features a 0.050" (1.27mm) pitch with 0.100" (2.54mm) row spacing. The part is currently in active production status with 998 pieces available in stock. Equivalent and substitute parts are identified to provide design flexibility, support supply chain continuity, and accommodate specific application requirements such as alternative shrouding configurations, contact materials, or mechanical mounting preferences.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Connector Type | Header |
| Contact Type | Male Pin |
| Pitch - Mating | 0.050" (1.27mm) |
| Number of Positions | 10 |
| Number of Rows | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) |
| Mounting Type | Through Hole, Right Angle |
| Termination | Solder |
| Style | Board to Board |
| Contact Finish - Mating | Gold |
| Insulation Material | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C ~ 125°C |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
Substitution of the TML-105-01-G-D-RA with the TE Connectivity part number 5-104069-4 is based on the following critical parameters that must align for functional equivalence:
Core Matching Parameters:
- Pitch - Mating: 0.050" (1.27mm) — identical spacing requirement
- Number of Positions: 10 — same contact count
- Number of Rows: 2 — identical row configuration
- Row Spacing - Mating: 0.100" (2.54mm) — same inter-row distance
- Connector Type: Header — same functional classification
- Contact Type: Male Pin — same contact gender
- Mounting Type: Through Hole, Right Angle — same PCB mounting orientation
- Termination: Solder — same connection method
- Style: Board to Board or Cable — compatible application scope
Allowable Variations: The substitute part 5-104069-4 differs in shrouding configuration (2-wall versus 4-wall), contact shape (circular versus square), insulation material (thermoplastic versus LCP), and operating temperature range (-65°C ~ 105°C versus -55°C ~ 125°C). These variations are acceptable within the substitute relationship because they do not affect the fundamental mating interface, pitch alignment, or solder termination compatibility. The substitute part maintains electrical and mechanical interchangeability for standard board-to-board interconnection applications.
Parameter Comparison
| Parameter | TML-105-01-G-D-RA (Samtec) | 5-104069-4 (TE Connectivity) |
|---|---|---|
| Manufacturer | Samtec Inc. | TE Connectivity AMP Connectors |
| Series | TML | AMPMODU System 50 |
| Connector Type | Header | Header |
| Contact Type | Male Pin | Male Pin |
| Pitch - Mating | 0.050" (1.27mm) | 0.050" (1.27mm) |
| Number of Positions | 10 | 10 |
| Number of Rows | 2 | 2 |
| Row Spacing - Mating | 0.100" (2.54mm) | 0.100" (2.54mm) |
| Mounting Type | Through Hole, Right Angle | Through Hole, Right Angle |
| Termination | Solder | Solder |
| Style | Board to Board | Board to Board or Cable |
| Shrouding | Shrouded - 4 Wall | Shrouded - 2 Wall |
| Contact Length - Mating | 0.120" (3.05mm) | 0.125" (3.18mm) |
| Contact Length - Post | 0.120" (3.05mm) | 0.100" (2.54mm) |
| Insulation Height | 0.370" (9.40mm) | 0.290" (7.37mm) |
| Contact Shape | Square | Circular |
| Contact Finish - Mating | Gold | Gold |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | 30.0µin (0.76µm) |
| Contact Material | Phosphor Bronze | Copper Alloy |
| Insulation Material | Liquid Crystal Polymer (LCP) | Thermoplastic |
| Operating Temperature | -55°C ~ 125°C | -65°C ~ 105°C |
| Contact Finish - Post | Gold | Tin |
| RoHS Status | ROHS3 Compliant | RoHS Compliant |
| Product Status | Active | Active |
| ECCN | EAR99 | EAR99 |
| HTSUS | 8536.69.4040 | 8536.69.4040 |
Engineering Selection Recommendations
Both the TML-105-01-G-D-RA and 5-104069-4 are active production parts with current inventory availability. Selection between these parts should be based on the following provided specifications:
TML-105-01-G-D-RA (Samtec Inc.) is appropriate when:
- Extended high-temperature operation up to 125°C is required
- Four-wall shrouding is necessary for enhanced EMI shielding or mechanical protection
- Liquid Crystal Polymer insulation material is specified for the application
- Square contact geometry is preferred for specific mating interface requirements
- Phosphor Bronze contact material is required
5-104069-4 (TE Connectivity AMP Connectors) is appropriate when:
- Operating temperature range of -65°C to 105°C is sufficient
- Two-wall shrouding meets mechanical and environmental requirements
- Thermoplastic insulation material is acceptable
- Circular contact geometry is compatible with the mating connector
- Copper Alloy contact material is acceptable
- Higher gold plating thickness (30.0µin versus 10.0µin) provides enhanced contact durability
Both parts are ROHS compliant and classified under identical ECCN and HTSUS codes, confirming regulatory equivalence. The substitute relationship is valid for standard board-to-board interconnection applications where the core mating interface parameters (pitch, position count, row spacing, and mounting orientation) are the primary selection criteria.
Frequently Asked Questions (FAQ)
Q: Can the 5-104069-4 directly replace the TML-105-01-G-D-RA in existing designs?
A: The 5-104069-4 is mechanically and electrically compatible for board-to-board mating applications due to identical pitch (0.050"), position count (10), row spacing (0.100"), and through-hole right-angle mounting. However, physical envelope differences exist: the TML-105-01-G-D-RA has an insulation height of 0.370" compared to 0.290" for the 5-104069-4, and shrouding configuration differs (4-wall versus 2-wall). PCB layout and clearance verification is required before substitution.
Q: What are the key differences in contact specifications?
A: The TML-105-01-G-D-RA features square contacts with 10.0µin gold plating on phosphor bronze material. The 5-104069-4 features circular contacts with 30.0µin gold plating on copper alloy material. Both contacts are gold-finished for mating surfaces. The higher plating thickness on the substitute part provides increased contact durability. Contact shape difference (square versus circular) does not affect mating compatibility with standard receptacle connectors.
Q: Are there temperature rating implications for substitution?
A: The TML-105-01-G-D-RA operates from -55°C to 125°C, while the 5-104069-4 operates from -65°C to 105°C. If the application requires sustained operation above 105°C, the TML-105-01-G-D-RA is required. For applications within the -55°C to 105°C range, both parts are functionally equivalent. The substitute part offers lower temperature capability (-65°C versus -55°C).
Q: What is the significance of the shrouding difference?
A: The TML-105-01-G-D-RA provides 4-wall shrouding, offering enhanced mechanical protection and EMI shielding. The 5-104069-4 provides 2-wall shrouding, reducing overall profile height and material mass. For applications requiring maximum EMI containment or mechanical robustness, the 4-wall configuration is preferred. For space-constrained designs, the 2-wall configuration may be advantageous.
Q: Are both parts RoHS compliant?
A: Yes. The TML-105-01-G-D-RA is ROHS3 Compliant, and the 5-104069-4 is RoHS Compliant. Both parts meet RoHS requirements and are suitable for applications with RoHS compliance mandates.
Q: What is the difference in insulation material?
A: The TML-105-01-G-D-RA uses Liquid Crystal Polymer (LCP) insulation, which provides superior thermal stability and dimensional consistency at elevated temperatures. The 5-104069-4 uses thermoplastic insulation, which is cost-effective and suitable for standard operating conditions. LCP is preferred for high-reliability or high-temperature applications.
Q: Can these parts be used interchangeably in cable-to-board applications?
A: The TML-105-01-G-D-RA is specified for board-to-board style applications. The 5-104069-4 is specified for board-to-board or cable applications, providing greater application flexibility. For cable-to-board interconnection, the 5-104069-4 is the appropriate choice.
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