TMBYV10-40FILM Equivalent & Substitute Parts

Part Overview

The TMBYV10-40FILM is a Schottky rectifier diode manufactured by STMicroelectronics, rated for 40 V DC reverse voltage and 1 A average rectified current in a Surface Mount MELF package. This component is classified as Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to component availability, supply chain considerations, or specific application requirements within the defined parameter ranges.

Substiute Parts

TMBYV10-40FILM
STMicroelectronicsIn Stock: 26405TMBYV10-40FILM Datasheet
TMBYV10-40FILM
Current Part
BAT165E6327HTSA1
Infineon TechnologiesIn Stock: 71911BAT165E6327HTSA1 Datasheet
BAT165E6327HTSA1
Similar
CDLL5819
Microchip TechnologyIn Stock: 2367CDLL5819 Datasheet
CDLL5819
Similar

Key Parameters

Parameter Value Unit
Technology Schottky
Voltage - DC Reverse (Vr) (Max) 40 V
Current - Average Rectified (Io) 1 A
Voltage - Forward (Vf) (Max) @ If 550 mV @ 1 A mV
Speed Fast Recovery ≤ 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 500 µA @ 40 V µA
Mounting Type Surface Mount
Package / Case DO-213AB, MELF
Operating Temperature - Junction -65 to 125 °C
RoHS Status RoHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the TMBYV10-40FILM is determined by the following critical parameters:

Mandatory Matching Criteria:

  • Technology classification: Schottky diode
  • Voltage - DC Reverse (Vr) (Max): 40 V minimum
  • Current - Average Rectified (Io): 1 A minimum
  • Speed classification: Fast Recovery ≤ 500ns, > 200mA (Io)
  • Mounting Type: Surface Mount
  • Operating Temperature Range: -65°C to 125°C minimum

Package Compatibility: Substitutes must accommodate the DO-213AB MELF package form factor or equivalent surface mount package with compatible PCB footprint dimensions.

Compliance Requirements: Substitutes must maintain RoHS3 compliance status for direct replacement in regulated applications.

The identified substitute parts meet these criteria with electrical parameters within acceptable operating ranges for this diode category.

Parameter Comparison

Parameter TMBYV10-40FILM (STMicroelectronics) CDLL5819 (Microchip Technology) BAT165E6327HTSA1 (Infineon Technologies)
Technology Schottky Schottky Schottky
Voltage - DC Reverse (Vr) (Max) 40 V 45 V 40 V
Current - Average Rectified (Io) 1 A 1 A 750 mA
Voltage - Forward (Vf) (Max) @ If 550 mV @ 1 A 490 mV @ 1 A 740 mV @ 750 mA
Speed Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io) Fast Recovery ≤ 500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr 500 µA @ 40 V 50 µA @ 45 V 50 µA @ 40 V
Mounting Type Surface Mount Surface Mount Surface Mount
Package / Case DO-213AB, MELF DO-213AB, MELF SC-76, SOD-323
Operating Temperature - Junction -65 to 125°C -65 to 125°C 150°C (Max)
RoHS Status RoHS3 Compliant RoHS non-compliant RoHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

CDLL5819 (Microchip Technology): This substitute provides identical current rating (1 A) and matching operating temperature range (-65°C to 125°C). The package form factor is identical (DO-213AB MELF). Forward voltage is lower at 490 mV versus 550 mV, and reverse leakage is significantly reduced at 50 µA. However, this part carries RoHS non-compliant status, which restricts its use in applications requiring RoHS3 certification. Selection of this substitute is limited to non-regulated applications where RoHS compliance is not a requirement.

BAT165E6327HTSA1 (Infineon Technologies): This substitute maintains RoHS3 compliance and identical reverse voltage rating (40 V). However, the current rating is reduced to 750 mA, which is below the 1 A specification of the main part. The package form factor differs (SOD-323 versus MELF), requiring PCB layout modification. Forward voltage is higher at 740 mV. This substitute is suitable only for applications where current demand does not exceed 750 mA and package footprint modification is acceptable.

Primary Recommendation: For direct replacement with maintained compliance and electrical equivalence, the TMBYV10-40FILM remains the optimal selection. Substitute parts introduce trade-offs in compliance status, current rating, or package compatibility that require application-specific evaluation.

Frequently Asked Questions (FAQ)

Q: Can the CDLL5819 be used as a direct replacement for the TMBYV10-40FILM?

A: The CDLL5819 provides equivalent electrical performance in voltage, current, and speed classifications with identical package form factor. However, it carries RoHS non-compliant status. Direct replacement is limited to applications where RoHS3 compliance is not mandated.

Q: What is the primary limitation of the BAT165E6327HTSA1 as a substitute?

A: The BAT165E6327HTSA1 has a reduced current rating of 750 mA compared to the 1 A specification of the TMBYV10-40FILM. Additionally, the package form factor is SOD-323 rather than MELF, requiring PCB footprint redesign.

Q: Are all substitute parts rated for the same operating temperature range?

A: No. The TMBYV10-40FILM and CDLL5819 share an operating temperature range of -65°C to 125°C. The BAT165E6327HTSA1 has a maximum junction temperature of 150°C, which is higher but does not extend the minimum temperature specification.

Q: What does RoHS3 compliance mean for component selection?

A: RoHS3 compliance indicates the component meets Restriction of Hazardous Substances regulations. For applications subject to RoHS requirements, only RoHS3 compliant parts (TMBYV10-40FILM and BAT165E6327HTSA1) are acceptable.

Q: Can package form factor differences affect circuit performance?

A: Package form factor differences (MELF versus SOD-323) require different PCB footprints and land patterns. While electrical performance may be equivalent, physical layout modifications are necessary. Parasitic inductance and capacitance characteristics may differ slightly between package types.

Q: What is the significance of reverse leakage current differences between these parts?

A: Reverse leakage current affects power dissipation and circuit performance in high-impedance applications. The TMBYV10-40FILM has 500 µA leakage, while CDLL5819 and BAT165E6327HTSA1 have 50 µA. Lower leakage reduces standby power consumption and heat generation.

Q: Is forward voltage difference significant for this application category?

A: Forward voltage differences (490 mV to 740 mV) affect power dissipation and voltage drop across the diode during conduction. Applications with tight voltage budgets or high current density may be sensitive to these variations.

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