TMA166B-L Equivalent & Substitute Parts

Part Overview

The TMA166B-L is a standard TRIAC rated for 600V off-state voltage and 16A on-state current, manufactured by Sanken Electric USA Inc. in a TO-3PF through-hole package. This component is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. Substitute parts must maintain electrical performance across voltage, current, and thermal specifications while accommodating package variations.

Substiute Parts

TMA166B-L

Sanken Electric USA Inc.In Stock: 1332TMA166B-L Datasheet

Current PartRFQ

BCR16RM-12LB#B00

Renesas Electronics CorporationIn Stock: 959BCR16RM-12LB#B00 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TMA166B-L is determined by the following critical parameters:

• Voltage Rating (Off State): Must equal 600V
• Current Rating (On State): Must equal or exceed 16A RMS
• Gate Trigger Specifications: Vgt (Max) ≤ 1.5V and Igt (Max) ≤ 30mA
• Configuration: Single TRIAC configuration required
• Mounting Type: Through-hole mounting required
• Package Compatibility: TO-3P family packages acceptable with mechanical verification

The BCR16RM-12LB#B00 meets these substitution criteria across all electrical parameters while maintaining through-hole mounting and single-configuration architecture.

Parameter Comparison

Engineering Selection Recommendations

The BCR16RM-12LB#B00 is the qualified substitute for the obsolete TMA166B-L based on the following factors:

• Electrical Equivalence: All critical electrical parameters match or exceed the original specification (600V, 16A, 1.5V gate trigger, 30mA gate current).
• Product Status: The substitute is active and currently available, addressing the obsolescence of the original part.
• Compliance: Both parts maintain RoHS compliance; the substitute achieves ROHS3 status and is REACH Affected, meeting current regulatory requirements.
• Thermal Performance: The substitute offers an extended operating temperature range (-40 to 150°C vs. -40 to 125°C), providing additional thermal margin.
• Package Consideration: The substitute uses TO-220-3 packaging instead of TO-3P-3. Physical footprint and mounting hole spacing must be verified for PCB compatibility before implementation.

Frequently Asked Questions (FAQ)

Q: Can the BCR16RM-12LB#B00 directly replace the TMA166B-L without circuit modification?

A: Electrical parameters are equivalent. However, the package transition from TO-3P-3 to TO-220-3 requires PCB layout verification. Mounting hole spacing, lead positioning, and thermal dissipation characteristics differ between packages and must be assessed for your specific application.

Q: What is the significance of the extended temperature range in the BCR16RM-12LB#B00?

A: The substitute operates to 150°C junction temperature versus 125°C for the original. This provides additional thermal headroom in applications approaching maximum rated temperature but does not alter the electrical switching characteristics at equivalent operating points.

Q: Are there compliance differences between the two parts?

A: Both parts are RoHS compliant. The substitute achieves ROHS3 status and carries REACH Affected designation, reflecting current EU regulatory frameworks. The original TMA166B-L lists only RoHS Compliant status without REACH notation.

Q: What does the non-repetitive surge current specification indicate?

A: The TMA166B-L specifies 180A (50Hz) and 190A (60Hz) non-repetitive surge current. The BCR16RM-12LB#B00 specifies 160A @ 60Hz. Both values represent transient overcurrent capability during fault conditions and are within acceptable ranges for standard TRIAC applications. Verify your circuit's surge protection design against these ratings.

Q: Is packaging the only mechanical difference between these parts?

A: Yes. Both are through-hole mounted single TRIACs. The primary mechanical difference is the package footprint (TO-3P-3 vs. TO-220-3). Lead diameter, spacing, and thermal pad configuration differ and require PCB redesign verification.