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TLZ33D-GS08 Equivalent & Substitute Parts
Part Overview
The TLZ33D-GS08 is an active Zener diode manufactured by Vishay General Semiconductor - Diodes Division. This component is a 33 V, 500 mW surface mount device in SOD-80 MiniMELF packaging, designed for voltage regulation and protection applications in electronic circuits. The part is ROHS3 compliant and carries MSL Level 1 (Unlimited) moisture sensitivity rating. Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or design flexibility needs.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - Zener (Nom) | 33 | V |
| Power - Max | 500 | mW |
| Impedance (Max) | 65 | Ohms |
| Current - Reverse Leakage @ Vr | 40 nA @ 29.9 V | nA |
| Voltage - Forward (Max) @ If | 1.5 V @ 200 mA | V |
| Operating Temperature Range | -65°C to 175°C | °C |
| Mounting Type | Surface Mount | — |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | — |
| RoHS Status | ROHS3 Compliant | — |
| Moisture Sensitivity Level | 1 (Unlimited) | — |
Substitute Part Grouping Explanation
Substitution of the TLZ33D-GS08 is based on the following critical electrical and mechanical parameters:
Electrical Equivalence Criteria:
- Zener voltage (Nom): 33 V
- Maximum power dissipation: 500 mW
- Surface mount technology compatibility
- Operating temperature range: minimum -65°C to 175°C
Mechanical Compatibility Criteria:
- Package type: SOD-80 MiniMELF (DO-213AC)
- Mounting configuration: Surface Mount
Compliance Requirements:
- RoHS3 compliance
- MSL Level 1 or equivalent
The BZV55-B33,115 from NXP Semiconductors meets all substitution criteria through matching nominal Zener voltage, power rating, package type, and compliance certifications. Impedance and leakage current variations remain within acceptable operational tolerances for typical voltage regulation applications.
Parameter Comparison
| Parameter | TLZ33D-GS08 (Vishay) | BZV55-B33,115 (NXP) | Compatibility |
|---|---|---|---|
| Voltage - Zener (Nom) | 33 V | 33 V | Equivalent |
| Tolerance | — | ±2% | NXP specified |
| Power - Max | 500 mW | 500 mW | Equivalent |
| Impedance (Max) | 65 Ohms | 80 Ohms | Compatible |
| Current - Reverse Leakage @ Vr | 40 nA @ 29.9 V | 50 nA @ 23.1 V | Compatible |
| Voltage - Forward (Max) @ If | 1.5 V @ 200 mA | 900 mV @ 10 mA | Different test conditions |
| Operating Temperature Range | -65°C to 175°C | -65°C to 200°C | NXP range exceeds requirement |
| Mounting Type | Surface Mount | Surface Mount | Equivalent |
| Package / Case | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 | Equivalent |
| Moisture Sensitivity Level | 1 (Unlimited) | 1 (Unlimited) | Equivalent |
| RoHS Status | ROHS3 Compliant | Not specified in data | Vishay specified |
Engineering Selection Recommendations
Primary Part: TLZ33D-GS08 (Vishay)
The TLZ33D-GS08 is the specified component for this application. It is active in production, ROHS3 compliant, and carries explicit RoHS certification documentation. This part is recommended for new designs and production builds where Vishay supply chain availability is confirmed.
Substitute Part: BZV55-B33,115 (NXP)
The BZV55-B33,115 is a direct functional substitute when TLZ33D-GS08 availability is constrained. Both components share identical nominal Zener voltage (33 V), maximum power dissipation (500 mW), package type (SOD-80 MiniMELF), and mounting configuration (Surface Mount). The NXP device provides an extended operating temperature range (-65°C to 200°C versus -65°C to 175°C), which offers additional thermal margin in high-temperature environments. Impedance and reverse leakage current specifications are within acceptable operational tolerances for voltage regulation circuits.
Selection between these parts is determined by:
- Supply chain availability
- Inventory status (42,600 pcs Vishay vs. 208,405 pcs NXP)
- Design temperature requirements
- Procurement lead time constraints
Frequently Asked Questions (FAQ)
Q: Can BZV55-B33,115 be used as a direct replacement for TLZ33D-GS08 in existing designs?
A: Yes. Both devices share identical nominal Zener voltage (33 V), maximum power rating (500 mW), and SOD-80 MiniMELF package configuration. Electrical performance in voltage regulation applications is equivalent. No circuit redesign is required.
Q: What are the differences in impedance between these parts?
A: The TLZ33D-GS08 specifies maximum impedance of 65 Ohms, while the BZV55-B33,115 specifies 80 Ohms. This 15 Ohm difference has minimal impact on typical voltage regulation circuits and remains within acceptable tolerance for most applications.
Q: Are there temperature range considerations when substituting?
A: The BZV55-B33,115 operates across -65°C to 200°C, exceeding the TLZ33D-GS08 range of -65°C to 175°C. For applications operating above 175°C, the NXP device provides additional thermal headroom. For standard temperature ranges, both parts are equivalent.
Q: Do both parts meet RoHS compliance requirements?
A: The TLZ33D-GS08 is explicitly ROHS3 compliant. RoHS status for the BZV55-B33,115 is not specified in the provided data. Verification of NXP compliance documentation is required for applications with mandatory RoHS requirements.
Q: Are the moisture sensitivity levels equivalent?
A: Yes. Both the TLZ33D-GS08 and BZV55-B33,115 carry MSL Level 1 (Unlimited) ratings, indicating no moisture sensitivity restrictions for storage, handling, or reflow processes.
Q: What is the significance of the ±2% tolerance specification on the NXP part?
A: The BZV55-B33,115 specifies ±2% Zener voltage tolerance, providing defined accuracy for the 33 V nominal rating. The TLZ33D-GS08 tolerance specification is not provided in the available data. For precision voltage regulation applications requiring tight tolerance control, the NXP specification provides explicit performance definition.
Q: Can these parts be used interchangeably in PCB assembly?
A: Yes. Both components use identical SOD-80 MiniMELF packaging and surface mount configuration. PCB footprints, reflow profiles, and assembly processes are compatible without modification.
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