TLV3702CD Equivalent & Substitute Parts

Part Overview

The TLV3702CD is a general-purpose dual comparator IC manufactured by Texas Instruments, featuring CMOS push-pull rail-to-rail output architecture in an 8-SOIC surface-mount package. This device operates across a supply voltage range of 2.5V to 16V (single supply) or ±1.25V to ±8V (dual supply), with an input offset voltage of 5mV at 15V and quiescent current of 1µA maximum.

The TLV3702CD is classified as obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure component availability, and support ongoing production requirements. Substitute parts must maintain functional compatibility while meeting the electrical and mechanical constraints of the original application.

Key Parameters

Parameter	TLV3702CD Value
Number of Elements	2
Output Type	CMOS, Push-Pull, Rail-to-Rail
Voltage - Supply, Single/Dual (±)	2.5V ~ 16V, ±1.25V ~ 8V
Voltage - Input Offset (Max)	5mV @ 15V
Current - Input Bias (Max)	250pA @ 15V
Current - Output (Typ)	10mA
Current - Quiescent (Max)	1µA
CMRR, PSRR (Typ)	88dB CMRR, 105dB PSRR
Operating Temperature	0°C ~ 70°C
Package / Case	8-SOIC (0.154", 3.90mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the TLV3702CD is determined by the following critical parameters:

Electrical Compatibility Criteria:

Number of elements (dual comparator function)
Output type (CMOS push-pull rail-to-rail capability)
Supply voltage range (minimum 2.5V single supply or ±1.25V dual supply)
Input offset voltage (5mV maximum at 15V)
Input bias current (250pA maximum at 15V)
Output current capability (10mA typical)
Quiescent current (1µA maximum)
Common-mode rejection ratio and power supply rejection ratio (88dB CMRR, 105dB PSRR)

Mechanical Compatibility Criteria:

Package type (8-SOIC surface mount preferred for direct replacement; 8-DIP through-hole and alternative surface-mount packages acceptable with board redesign)
Mounting type (surface mount or through-hole)

Compliance Criteria:

RoHS3 compliance
Moisture sensitivity level (MSL 1 - Unlimited)

Substitute parts are grouped into two categories: direct replacements (same package, same electrical performance) and functional equivalents (different package or slightly different electrical characteristics within acceptable tolerance).

Parameter Comparison

Parameter	TLV3702CD	TLV3702IDR	ALD2302ASAL	ALD2332ASAL	LTC6702CDC#TRPBF
Manufacturer	Texas Instruments	Texas Instruments	Advanced Linear Devices Inc.	Advanced Linear Devices Inc.	Analog Devices Inc.
Number of Elements	2	2	2	2	2
Output Type	CMOS, Push-Pull, Rail-to-Rail	CMOS, Push-Pull, Rail-to-Rail	CMOS, NMOS, Push-Pull, TTL	CMOS, NMOS, Push-Pull, TTL	CMOS, Push-Pull, Rail-to-Rail, TTL
Voltage - Supply, Single/Dual (±)	2.5V ~ 16V, ±1.25V ~ 8V	2.7V ~ 16V, ±1.35V ~ 8V	4V ~ 10V, ±2V ~ 5V	4V ~ 10V, ±2V ~ 5V	1.7V ~ 5.5V
Voltage - Input Offset (Max)	5mV @ 15V	5mV @ 15V	1mV @ 5V	0.5mV @ 5V	4.6mV @ 3V
Current - Input Bias (Max)	250pA @ 15V	250pA @ 15V	0.001µA @ 5V	20pA @ 5V	-
Current - Output (Typ)	10mA	10mA	60mA	50mA @ 5V	-
Current - Quiescent (Max)	1µA	1µA	500µA	500µA	32µA
CMRR, PSRR (Typ)	88dB CMRR, 105dB PSRR	88dB CMRR, 105dB PSRR	-	80dB CMRR, 75dB PSRR	70dB CMRR, 65dB PSRR
Operating Temperature	0°C ~ 70°C	-40°C ~ 125°C	0°C ~ 70°C	0°C ~ 70°C	0°C ~ 70°C
Package / Case	8-SOIC	8-SOIC	8-SOIC	8-SOIC	8-WFDFN Exposed Pad
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
Product Status	Obsolete	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant

Engineering Selection Recommendations

Primary Recommendation: TLV3702IDR

TLV3702IDR is the manufacturer-recommended direct replacement for TLV3702CD. Both devices are manufactured by Texas Instruments and share identical electrical specifications: 2-element dual comparator, CMOS push-pull rail-to-rail output, 88dB CMRR, and 105dB PSRR. The primary difference is product status: TLV3702IDR is active with extended operating temperature range (-40°C to 125°C) compared to the obsolete TLV3702CD (0°C to 70°C). Both are packaged in 8-SOIC surface-mount format and are ROHS3 compliant. TLV3702IDR is available in higher inventory (19,084 pieces) and is supplied in Cut Tape and Digi-Reel packaging.

Secondary Recommendation: ALD2332ASAL

ALD2332ASAL (Advanced Linear Devices Inc.) is a functional equivalent in 8-SOIC surface-mount package. This device features superior input offset voltage (0.5mV @ 5V versus 5mV @ 15V) and lower input bias current (20pA @ 5V versus 250pA @ 15V). However, the supply voltage range is narrower (4V ~ 10V single supply versus 2.5V ~ 16V), and quiescent current is higher (500µA versus 1µA). ALD2332ASAL is part of the EPAD® series and is active with ROHS3 compliance. This substitute is suitable for applications operating within the 4V to 10V supply range where lower input offset voltage is beneficial.

Tertiary Recommendation: LTC6702CDC#TRPBF

LTC6702CDC#TRPBF (Analog Devices Inc.) is a functional equivalent in 8-WFDFN surface-mount package. This device operates across a narrower supply voltage range (1.7V ~ 5.5V) and features lower quiescent current (32µA versus 1µA). The package differs from the original 8-SOIC, requiring PCB layout modification. LTC6702CDC#TRPBF includes propagation delay specification (450ns) and hysteresis (7.2mV), which are not specified for TLV3702CD. This substitute is suitable for low-voltage applications and space-constrained designs.

All recommended substitutes maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with standard manufacturing and storage practices.

Frequently Asked Questions (FAQ)

Q: Can TLV3702IDR be used as a direct replacement for TLV3702CD without PCB modification?

A: Yes. TLV3702IDR is the manufacturer-recommended replacement and shares identical electrical specifications and 8-SOIC package footprint with TLV3702CD. No PCB modification is required. The extended operating temperature range (-40°C to 125°C) of TLV3702IDR provides additional margin beyond the original specification (0°C to 70°C).

Q: What are the key differences between TLV3702IDR and ALD2332ASAL?

A: Both devices are dual comparators in 8-SOIC packages. TLV3702IDR (Texas Instruments) maintains the original supply voltage range (2.5V ~ 16V) and quiescent current specification (1µA). ALD2332ASAL (Advanced Linear Devices Inc.) operates within a narrower supply range (4V ~ 10V) but offers superior input offset voltage (0.5mV @ 5V) and lower input bias current (20pA @ 5V). Selection depends on application supply voltage requirements and offset voltage sensitivity.

Q: Is LTC6702CDC#TRPBF compatible with existing PCB layouts designed for TLV3702CD?

A: No. LTC6702CDC#TRPBF uses an 8-WFDFN package (2x2mm with exposed pad) instead of the 8-SOIC package of TLV3702CD. PCB layout and footprint modification is required. This substitute is suitable for new designs or redesigned boards where the smaller package footprint provides space savings.

Q: What is the impact of the narrower supply voltage range in ALD2302ASAL compared to TLV3702CD?

A: ALD2302ASAL operates within 4V ~ 10V (single supply) or ±2V ~ 5V (dual supply), compared to TLV3702CD's 2.5V ~ 16V range. This substitute is suitable only for applications operating within the 4V to 10V window. Applications requiring operation below 4V or above 10V must use TLV3702IDR or other substitutes with wider supply ranges.

Q: Are all recommended substitutes RoHS3 compliant?

A: Yes. TLV3702IDR, ALD2332ASAL, ALD2302ASAL, and LTC6702CDC#TRPBF are all ROHS3 compliant with MSL 1 (Unlimited) moisture sensitivity rating, meeting standard environmental and regulatory requirements.

Q: What is the significance of the EPAD® designation in ALD2332 series parts?

A: EPAD® (Enhanced Pad) is an Advanced Linear Devices trademark indicating an exposed thermal pad in the package design. This feature improves heat dissipation compared to standard packages. ALD2332APAL and ALD2332ASAL incorporate this thermal enhancement, which may be beneficial in applications with elevated ambient temperatures or high output current demands.

Q: Can ALD2302APAL (8-DIP through-hole package) be used as a substitute for TLV3702CD (8-SOIC surface-mount)?

A: ALD2302APAL is functionally equivalent but requires significant PCB redesign due to package type change (through-hole DIP versus surface-mount SOIC). This substitute is suitable only for applications undergoing board redesign or where through-hole mounting is preferred. Direct socket replacement is not possible.

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