TLV3701IDBVRG4 Equivalent & Substitute Parts

Part Overview

The TLV3701IDBVRG4 is a general-purpose CMOS comparator with push-pull, rail-to-rail output configuration in SOT-23-5 surface mount packaging. This device is classified as obsolete, which necessitates identification of active equivalent alternatives for new designs and ongoing production requirements. The comparator is designed for applications requiring low-power operation across a wide supply voltage range with minimal input offset voltage and bias current characteristics.

Substiute Parts

TLV3701IDBVRG4

Texas InstrumentsIn Stock: 61967TLV3701IDBVRG4 Datasheet

Current PartRFQ

TLV3701IDBVR

Texas InstrumentsIn Stock: 36920TLV3701IDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV3701IDBVRG4 is determined by strict equivalence across the following critical parameters:

Output configuration: CMOS, push-pull, rail-to-rail topology Supply voltage range: 2.7V ~ 16V single supply or ±1.35V ~ 8V dual supply Input offset voltage: Maximum 5mV @ 15V Input bias current: Maximum 250pA @ 15V Output current capability: Typical 10mA Quiescent current: Maximum 1µA Common-mode rejection ratio: 88dB typical Power supply rejection ratio: 105dB typical Operating temperature range: -40°C ~ 125°C Package format: SOT-23-5 surface mount Compliance certifications: ROHS3, REACH Unaffected

The TLV3701IDBVR meets all specified electrical and mechanical parameters and is classified as an active product, making it a direct functional equivalent for the obsolete TLV3701IDBVRG4.

Parameter Comparison

Engineering Selection Recommendations

The TLV3701IDBVR is the direct active equivalent for the obsolete TLV3701IDBVRG4. Both devices are manufactured by Texas Instruments and maintain identical electrical specifications and physical packaging. The primary distinction is product status: the TLV3701IDBVRG4 is obsolete, while the TLV3701IDBVR is actively produced and supported.

For new designs and production continuity, the TLV3701IDBVR should be selected. Both parts carry ROHS3 compliance and REACH Unaffected status, ensuring regulatory alignment. The packaging format remains SOT-23-5 surface mount, maintaining PCB layout compatibility. No design modifications are required when transitioning from the obsolete to the active part number.

Frequently Asked Questions (FAQ)

Q: Can the TLV3701IDBVR directly replace the TLV3701IDBVRG4 without circuit modifications?

A: Yes. The TLV3701IDBVR is electrically and mechanically identical to the TLV3701IDBVRG4. All electrical parameters, supply voltage ranges, output characteristics, and operating temperature specifications are equivalent. The SOT-23-5 package footprint is identical, requiring no PCB layout changes.

Q: What is the primary reason for substitution?

A: The TLV3701IDBVRG4 is classified as obsolete. The TLV3701IDBVR is the active production equivalent from Texas Instruments, ensuring continued availability and manufacturer support.

Q: Are there packaging differences between these parts?

A: Both parts use SOT-23-5 surface mount packaging (SC-74A, SOT-753 case designation). Packaging format, pin configuration, and mechanical dimensions are identical.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the TLV3701IDBVRG4 and TLV3701IDBVR are ROHS3 compliant and REACH Unaffected, meeting current regulatory requirements for electronic components.

Q: What are the critical electrical parameters that define substitution eligibility?

A: Substitution is based on matching output type (CMOS push-pull rail-to-rail), supply voltage range (2.7V ~ 16V single or ±1.35V ~ 8V dual), input offset voltage (5mV maximum), input bias current (250pA maximum), output current (10mA typical), quiescent current (1µA maximum), and common-mode and power supply rejection ratios (88dB CMRR, 105dB PSRR).

Q: Is the TLV3701IDBVR available in the same packaging options?

A: The TLV3701IDBVR is supplied in Cut Tape (CT) and Digi-Reel packaging formats, both in SOT-23-5 configuration. This maintains compatibility with standard component handling and assembly processes.