TLV320DAC23RHDR Equivalent & Substitute Parts

Part Overview

The TLV320DAC23RHDR is a 24-bit audio digital-to-analog converter (DAC) manufactured by Texas Instruments, designed for audio applications requiring sampling rates from 8 kHz to 96 kHz. The device features dual-channel output with I2S and SPI digital interfaces, operating from 1.5V and 3.3V supply voltages. This part is classified as obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and production continuity.

Substiute Parts

TLV320DAC23RHDR

Texas InstrumentsIn Stock: 1964TLV320DAC23RHDR Datasheet

Current PartRFQ

TLV320DAC3203IRGER

Texas InstrumentsIn Stock: 53431TLV320DAC3203IRGER Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV320DAC23RHDR is based on the following critical parameters that define functional equivalence:

• Base product family alignment (TLV320 series)
• Dual-channel audio output capability
• 24-bit resolution support
• Digital interface compatibility (I2S and/or SPI)
• Supply voltage compatibility (1.5V to 3.3V range)
• Surface mount packaging with exposed pad configuration
• RoHS3 compliance and MSL rating consistency

The TLV320DAC3203IRGER qualifies as a manufacturer-recommended substitute within the TLV320 product family. While this part functions as an integrated amplifier with DAC capability rather than a standalone DAC, it maintains the core audio processing architecture, dual-channel stereo output, 24-bit resolution, and digital interface protocols required for direct functional replacement in audio signal chain applications.

Parameter Comparison

Engineering Selection Recommendations

The TLV320DAC3203IRGER is designated as the manufacturer-recommended substitute for the obsolete TLV320DAC23RHDR. Selection of this alternative is supported by the following engineering factors:

• Both devices maintain ROHS3 compliance and identical MSL ratings, ensuring equivalent environmental and handling requirements
• Active product status of the TLV320DAC3203IRGER provides ongoing manufacturing support and supply chain availability
• Expanded operating temperature range (-40°C to 85°C) of the substitute provides broader application flexibility compared to the main part (-10°C to 70°C)
• Integrated amplifier functionality in the substitute eliminates the need for external headphone amplification stages in audio output applications
• Package footprint reduction from 28-VQFN to 24-VQFN enables board space optimization in redesigned layouts
• Supply voltage range of the substitute (1.5V to 1.95V) is compatible with the lower end of the main part's supply specification (1.5V), with design consideration required for 3.3V applications

Frequently Asked Questions (FAQ)

Q: Can the TLV320DAC3203IRGER directly replace the TLV320DAC23RHDR without circuit modifications?

A: Direct pin-for-pin replacement is not possible due to package differences (28-VQFN versus 24-VQFN) and pin count reduction. PCB layout redesign is required. However, the functional audio signal chain remains compatible through equivalent digital interface support (I2S, SPI) and matching 24-bit resolution.

Q: What is the impact of the supply voltage difference between these parts?

A: The main part operates at 1.5V and 3.3V, while the substitute operates at 1.5V to 1.95V. Designs operating at 3.3V require voltage regulation or redesign to accommodate the substitute's lower maximum supply specification.

Q: Does the integrated amplifier in the substitute affect substitution suitability?

A: The integrated Class AB amplifier in the TLV320DAC3203IRGER provides additional functionality beyond the standalone DAC architecture of the main part. In applications requiring only DAC functionality, the amplifier stage can be configured or bypassed according to the device datasheet. This integration does not prevent functional substitution in audio signal chain applications.

Q: Are the digital interfaces fully compatible between these parts?

A: Both parts support I2S and SPI interfaces. The substitute adds I2C control interface capability. Existing I2S and SPI implementations are compatible without modification.

Q: What are the package considerations for PCB redesign?

A: The substitute uses a smaller 24-VQFN (4x4) package compared to the main part's 28-VQFN (5x5) package. Both feature exposed pad configurations. Redesign requires updated footprint definitions, trace routing, and thermal management evaluation for the smaller package geometry.

Q: Is the expanded operating temperature range of the substitute a design advantage?

A: The substitute's operating range of -40°C to 85°C exceeds the main part's -10°C to 70°C specification. This provides additional margin for applications in extended temperature environments, though it does not affect substitution in designs already qualified to the main part's temperature range.