TLV3012AMDBVREP Equivalent & Substitute Parts

Part Overview

The TLV3012AMDBVREP is an enhanced-product micropower comparator with integrated voltage reference, manufactured by Texas Instruments. This single-element comparator features push-pull, rail-to-rail output in a SOT-23-6 surface mount package. The device operates across a supply voltage range of 1.65V to 5.5V and is designed for low-power applications requiring precision voltage comparison with integrated reference functionality. The part is currently in active production status with 1113 units in stock.

Equivalent and substitute parts are identified based on matching functional characteristics: comparator topology with integrated voltage reference, push-pull output capability, compatible supply voltage ranges, and surface mount packaging suitable for modern PCB assembly processes.

Key Parameters

Parameter	TLV3012AMDBVREP
Manufacturer	Texas Instruments
Category	Linear - Comparator with Voltage Reference
Package / Case	SOT-23-6
Voltage - Supply, Single/Dual (±)	1.65V ~ 5.5V
Output Type	Push-Pull, Rail-to-Rail
Number of Elements	1
Voltage - Input Offset (Max)	6mV @ 5.5V
Current - Quiescent (Max)	3.1µA
Propagation Delay (Max)	4µs
Hysteresis	8mV
Operating Temperature	-55°C ~ 125°C
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Product Status	Active

Substitute Part Grouping Explanation

Substitute parts for the TLV3012AMDBVREP are qualified based on the following critical parameters:

Functional Equivalence: All substitute parts must be single-element comparators with integrated voltage reference and push-pull output capability.

Supply Voltage Compatibility: Substitute parts must operate within or encompass the 1.65V to 5.5V supply range of the main part. Parts with supply ranges of 1.5V to 5.5V or 1V to 5.5V are compatible for applications operating within the overlapping voltage window.

Output Type: Push-pull output is the primary requirement. Parts with open-drain output represent functional alternatives where the application circuit supports pull-up resistor configuration.

Package and Mounting: Surface mount packages including SOT-23-6, SC-70-5, 4-UCSP, and 4-TDFN are all acceptable for modern PCB assembly, though physical footprint differences require board layout verification.

Compliance and Status: All substitute parts must maintain active production status and ROHS3 compliance to ensure long-term availability and regulatory alignment.

Parameter Comparison

Parameter	TLV3012AMDBVREP	MAX9064EBS+TG45	MIC841HYC5-TR	MIC842LYC5-TR	MIC842NYMT-T5	MIC842NYC5-TR
Manufacturer	Texas Instruments	Analog Devices Inc./Maxim Integrated	Microchip Technology	Microchip Technology	Microchip Technology	Microchip Technology
Package / Case	SOT-23-6	4-WFBGA, CSPBGA	5-TSSOP, SC-70-5, SOT-353	5-TSSOP, SC-70-5, SOT-353	4-UFDFN Exposed Pad	5-TSSOP, SC-70-5, SOT-353
Voltage - Supply, Single/Dual (±)	1.65V ~ 5.5V	1V ~ 5.5V	1.5V ~ 5.5V	1.5V ~ 5.5V	1.5V ~ 5.5V	1.5V ~ 5.5V
Output Type	Push-Pull, Rail-to-Rail	Push-Pull	Push-Pull	Push-Pull	Open-Drain	Open-Drain
Number of Elements	1	1	1	1	1	1
Current - Quiescent (Max)	3.1µA	1.1µA	3µA	3µA	3µA	3µA
Propagation Delay (Max)	4µs	15µs	12µs	12µs	12µs	12µs
Hysteresis	8mV	±12mV	20mV	20mV	20mV	20mV
Operating Temperature	-55°C ~ 125°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount	Surface Mount
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Active	Active	Active	Active	Active	Active

Engineering Selection Recommendations

Direct Push-Pull Substitutes: MAX9064EBS+TG45, MIC841HYC5-TR, and MIC842LYC5-TR maintain push-pull output topology compatible with the TLV3012AMDBVREP. These parts are suitable for applications where rail-to-rail output swing is required and the application circuit does not include external pull-up resistors.

Open-Drain Alternatives: MIC842NYMT-T5 and MIC842NYC5-TR feature open-drain output and require external pull-up resistor implementation. These parts are appropriate for applications with multi-supply voltage domains or where open-drain output provides circuit design advantages.

Temperature Range Consideration: The TLV3012AMDBVREP operates across -55°C to 125°C, while all substitute parts operate within -40°C to 85°C. Applications requiring extended low-temperature operation below -40°C must retain the TLV3012AMDBVREP.

Propagation Delay: The TLV3012AMDBVREP provides 4µs maximum propagation delay, faster than all substitute parts (12µs to 15µs). Applications with stringent timing requirements may require the original part.

Package Footprint: All parts maintain surface mount technology. Physical board layout verification is required when transitioning between SOT-23-6, SC-70-5, 4-UCSP, and 4-TDFN packages.

Compliance and Availability: All parts maintain active production status and ROHS3 compliance, ensuring regulatory alignment and long-term supply continuity.

Frequently Asked Questions (FAQ)

Q: Can MIC842NYMT-T5 or MIC842NYC5-TR directly replace the TLV3012AMDBVREP without circuit modification?

A: No. These parts feature open-drain output instead of push-pull output. Direct substitution requires addition of an external pull-up resistor to the output node. The pull-up resistor value and supply voltage must be selected based on the application's output impedance and logic level requirements.

Q: What is the minimum supply voltage overlap for substitution?

A: The TLV3012AMDBVREP operates from 1.65V to 5.5V. Substitute parts with 1.5V to 5.5V supply ranges are compatible for applications operating at 1.65V and above. Applications requiring operation below 1.65V must use the TLV3012AMDBVREP.

Q: Are the different package options (SOT-23-6, SC-70-5, 4-UCSP, 4-TDFN) electrically interchangeable?

A: Yes, the packages are electrically interchangeable when pin assignments are verified. However, physical footprint differences require PCB layout redesign. Pin-to-pin compatibility must be confirmed against the specific datasheet for each part number.

Q: Which substitute part offers the lowest quiescent current?

A: MAX9064EBS+TG45 provides 1.1µA maximum quiescent current, compared to 3.1µA for the TLV3012AMDBVREP and 3µA for Microchip alternatives. This part is preferred for ultra-low-power battery-operated applications.

Q: Can the TLV3012AMDBVREP be used in applications requiring operation below -40°C?

A: Yes. The TLV3012AMDBVREP operates from -55°C to 125°C, making it the only part in this group suitable for extended low-temperature applications. All substitute parts are limited to -40°C minimum operating temperature.

Q: What is the hysteresis difference between the main part and substitutes?

A: The TLV3012AMDBVREP provides 8mV hysteresis. Substitute parts provide higher hysteresis values: MAX9064EBS+TG45 at ±12mV and Microchip parts at 20mV. Applications requiring minimal hysteresis must retain the TLV3012AMDBVREP.

Q: Is the MAX9064EBS+TG45 suitable for applications requiring push-pull output?

A: Yes. MAX9064EBS+TG45 features push-pull output and is compatible with the TLV3012AMDBVREP for push-pull output applications. However, the 4-UCSP package requires verification of PCB assembly capability and rework procedures.

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