TLV2775ID Equivalent & Substitute Parts

Part Overview

The TLV2775ID is a CMOS operational amplifier IC featuring four independent circuits in a 16-SOIC surface mount package. This device is classified as a Last Time Buy product, indicating discontinued production with limited remaining inventory. The TLV2775ID operates as a rail-to-rail amplifier with low input bias current and is suitable for applications requiring low-power, precision signal conditioning across a 2.5V to 5.5V supply range.

Due to Last Time Buy status, identifying functionally equivalent substitute parts is essential for design continuity and long-term component availability. Substitute parts maintain identical electrical specifications while offering alternative packaging formats or active production status.

Substiute Parts

TLV2775ID

Texas InstrumentsIn Stock: 1157TLV2775ID Datasheet

Current PartRFQ

TLV2775IPWR

Texas InstrumentsIn Stock: 5370TLV2775IPWR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2775ID is determined by strict equivalence of electrical and mechanical parameters. The following criteria establish valid substitution:

Electrical Equivalence Requirements:

• Amplifier Type: CMOS
• Number of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 10.5 V/µs
• Gain Bandwidth Product: 5.1 MHz
• Current - Input Bias: 2 pA
• Voltage - Input Offset: 700 µV
• Current - Supply: 1 mA (x4 Channels)
• Current - Output / Channel: 50 mA
• Voltage - Supply Span: 2.5V to 5.5V
• Operating Temperature: -40°C to 125°C

Mechanical Compatibility:

• Mounting Type: Surface Mount
• Base Product Number: TLV2775 (same die)
• RoHS3 Compliance required
• MSL Level 1 (Unlimited)

The TLV2775IPWR is the manufacturer-recommended substitute, sharing identical electrical specifications and base product number while differing only in package format and production status.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitute: TLV2775IPWR

The TLV2775IPWR is the direct electrical equivalent of the TLV2775ID. Both parts share identical die specifications and electrical performance across all measured parameters. The substitute is manufactured by Texas Instruments and maintains full ROHS3 compliance and MSL Level 1 rating.

Differentiation Factors:

1. Package Format: The TLV2775ID uses 16-SOIC packaging (0.154" width), while the TLV2775IPWR uses 16-TSSOP packaging (0.173" width). Both are surface mount packages with different footprints. PCB layout modifications are required when transitioning between these packages.

2. Production Status: The TLV2775ID is Last Time Buy with 1094 units in stock. The TLV2775IPWR is Active production with 5300 units available. For new designs or long-term production requirements, the TLV2775IPWR is the recommended selection.

3. Supply Format: The TLV2775ID is supplied in Tube packaging, while the TLV2775IPWR is supplied in Tape & Reel format, which is standard for automated assembly processes.

Compliance Verification:

Both parts meet ROHS3 compliance requirements and carry MSL Level 1 (Unlimited) moisture sensitivity ratings, suitable for standard storage and handling conditions without special precautions.

Frequently Asked Questions (FAQ)

Q1: Can I use TLV2775IPWR as a direct replacement for TLV2775ID in existing designs?

A: Electrical substitution is complete. However, the package footprint differs between 16-SOIC and 16-TSSOP formats. PCB layout modifications are required. Pin-to-pin functionality is identical, but physical placement and trace routing must be adjusted to accommodate the different package dimensions.

Q2: What are the key differences between 16-SOIC and 16-TSSOP packages?

A: The 16-SOIC package has a width of 0.154" (3.90mm), while the 16-TSSOP package has a width of 0.173" (4.40mm). Both are surface mount packages with 16 pins. The TSSOP format is more compact in height and is commonly used in high-volume automated assembly. Pin spacing and lead geometry differ between the two packages.

Q3: Are there any electrical performance differences between TLV2775ID and TLV2775IPWR?

A: No. Both parts are manufactured from the same die and share identical electrical specifications. Slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and operating temperature range are all equivalent.

Q4: Why is TLV2775ID marked as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part number. Existing inventory will be depleted, and no future production is planned. The TLV2775IPWR remains in active production and is the recommended long-term alternative.

Q5: What is the difference between Tube and Tape & Reel packaging?

A: Tube packaging is used for manual handling and lower-volume applications, with components placed in a plastic tube. Tape & Reel packaging is designed for automated pick-and-place assembly, with components wound on a continuous tape. Tape & Reel is standard for high-volume manufacturing.

Q6: Are both parts RoHS3 compliant?

A: Yes. Both TLV2775ID and TLV2775IPWR are ROHS3 compliant and carry MSL Level 1 (Unlimited) moisture sensitivity ratings, indicating no special storage or handling requirements.

Q7: Can I stock TLV2775IPWR as a replacement for TLV2775ID in my inventory?

A: Yes, provided your PCB design accommodates the 16-TSSOP package footprint. For new designs, TLV2775IPWR is the recommended selection due to active production status and higher availability. For existing designs using 16-SOIC, a PCB redesign is necessary to use the TSSOP variant.