TLV2774IN Equivalent & Substitute Parts

Part Overview

The TLV2774IN is a CMOS amplifier integrated circuit containing four independent rail-to-rail operational amplifier circuits in a 14-pin DIP package. This device is classified as Last Time Buy, indicating that Texas Instruments has discontinued production and existing inventory represents the final availability from the manufacturer. The TLV2774IN is designed for applications requiring low-power, rail-to-rail amplification with CMOS technology characteristics.

Due to the Last Time Buy status, identifying equivalent and substitute parts is necessary for design continuity and long-term product support. Substitute parts must maintain functional compatibility across key electrical parameters while accommodating different packaging formats and manufacturer specifications.

Substiute Parts

TLV2774IN

Texas InstrumentsIn Stock: 1253TLV2774IN Datasheet

Current PartRFQ

TLV2774IDR

Texas InstrumentsIn Stock: 6627TLV2774IDR Datasheet

MFR RecommendedRFQ

MAX494EPD+

Analog Devices Inc./Maxim IntegratedIn Stock: 100482MAX494EPD+ Datasheet

MFR RecommendedRFQ

MCP604-E/P

Microchip TechnologyIn Stock: 912MCP604-E/P Datasheet

MFR RecommendedRFQ

MCP604-I/P

Microchip TechnologyIn Stock: 1366MCP604-I/P Datasheet

MFR RecommendedRFQ

MCP6284-E/P

Microchip TechnologyIn Stock: 1077MCP6284-E/P Datasheet

MFR RecommendedRFQ

MCP6294-E/P

Microchip TechnologyIn Stock: 1483MCP6294-E/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the TLV2774IN are evaluated based on the following critical parameters that determine functional compatibility:

Primary Compatibility Criteria:

• Number of Circuits: 4 independent amplifier channels
• Output Type: Rail-to-Rail operation
• Package Type: 14-pin DIP configuration (for direct pin-compatible substitution)
• Mounting Type: Through Hole (for PCB assembly compatibility)
• Operating Temperature Range: Minimum -40°C to 125°C
• Supply Voltage Range: Minimum 2.5V to 5.5V span

Secondary Performance Criteria:

• Slew Rate: 10.5 V/µs or greater
• Gain Bandwidth Product: 5.1 MHz or greater
• Input Bias Current: 2 pA or lower
• Input Offset Voltage: 700 µV or lower
• Output Current per Channel: 50 mA or greater

Substitutes are grouped into two categories:

Category 1: Direct Pin-Compatible Substitutes (14-DIP Through Hole) These parts maintain identical package format and mounting type, enabling direct PCB replacement without layout modifications. All parts in this category feature four circuits with rail-to-rail output in 14-DIP packaging.

Category 2: Functional Equivalents with Different Packaging The TLV2774IDR provides identical electrical specifications but uses surface-mount 14-SOIC packaging, requiring PCB redesign for implementation.

Parameter Comparison

Engineering Selection Recommendations

Recommended Primary Substitute: TLV2774IDR

The TLV2774IDR is the manufacturer-recommended substitute from Texas Instruments. This part maintains identical electrical specifications to the TLV2774IN, including CMOS amplifier type, slew rate of 10.5 V/µs, gain bandwidth product of 5.1 MHz, and all supply and bias current parameters. The TLV2774IDR is classified as Active product status, ensuring continued availability and manufacturer support. The only difference is packaging format: 14-SOIC surface-mount versus 14-DIP through-hole. This substitute requires PCB redesign but provides the most direct functional equivalence.

Recommended Pin-Compatible Substitutes (14-DIP Through Hole): MCP604-E/P and MCP6294-E/P

For applications requiring direct PCB replacement without layout modification, two Microchip Technology parts provide pin-compatible alternatives in 14-DIP through-hole packaging:

MCP604-E/P offers the lowest performance profile among substitutes with slew rate of 2.3 V/µs and gain bandwidth product of 2.8 MHz. This part is suitable for applications with relaxed bandwidth requirements. MCP604-E/P maintains Active product status and supports the full -40°C to 125°C operating temperature range. Input bias current is superior at 1 pA, and supply voltage range extends to 6V maximum.

MCP6294-E/P provides the highest performance profile with slew rate of 7 V/µs and gain bandwidth product of 10 MHz, exceeding TLV2774IN specifications. This part is suitable for applications requiring enhanced bandwidth performance. MCP6294-E/P maintains Active product status and supports the full -40°C to 125°C operating temperature range. Supply current is equivalent at 1 mA for four channels.

Alternative Consideration: MCP604-I/P

MCP604-I/P is electrically identical to MCP604-E/P but operates over a reduced temperature range of -40°C to 85°C. This part is suitable only for applications not requiring the extended 125°C upper temperature limit.

Not Recommended: MAX494EPD+

The MAX494EPD+ is classified as Obsolete product status, creating the same supply continuity risk as the TLV2774IN. Additionally, this part exhibits significantly reduced performance with slew rate of 0.2 V/µs and gain bandwidth product of 500 kHz, making it unsuitable as a forward-looking substitute.

Not Recommended: MCP6284-E/P

While MCP6284-E/P maintains Active status and supports the full temperature range, input offset voltage of 3 mV exceeds the TLV2774IN specification of 700 µV by a factor of 4.3, introducing potential accuracy degradation in precision applications.

Frequently Asked Questions (FAQ)

Q: Can TLV2774IDR be used as a direct replacement for TLV2774IN without PCB modification?

A: No. TLV2774IDR uses 14-SOIC surface-mount packaging while TLV2774IN uses 14-DIP through-hole packaging. Pin pitch, lead configuration, and mounting requirements differ. PCB redesign is required for TLV2774IDR implementation. For direct PCB replacement without layout changes, use MCP604-E/P or MCP6294-E/P.

Q: What are the key electrical differences between TLV2774IN and MCP604-E/P?

A: Both parts maintain identical four-circuit rail-to-rail configuration and 14-DIP through-hole packaging. Primary differences are: TLV2774IN slew rate is 10.5 V/µs versus MCP604-E/P at 2.3 V/µs; TLV2774IN gain bandwidth product is 5.1 MHz versus MCP604-E/P at 2.8 MHz; MCP604-E/P input bias current is superior at 1 pA versus 2 pA. Supply voltage range for MCP604-E/P extends to 6V maximum versus 5.5V for TLV2774IN.

Q: Is MCP6294-E/P a performance upgrade from TLV2774IN?

A: MCP6294-E/P exceeds TLV2774IN specifications in slew rate (7 V/µs versus 10.5 V/µs is lower) and gain bandwidth product (10 MHz versus 5.1 MHz is higher). MCP6294-E/P provides higher bandwidth capability. Both parts maintain identical four-circuit configuration, rail-to-rail output, and 14-DIP through-hole packaging. MCP6294-E/P is suitable for applications requiring enhanced frequency response.

Q: Why is MAX494EPD+ not recommended despite being available in 14-DIP packaging?

A: MAX494EPD+ is classified as Obsolete product status, creating the same supply discontinuation risk as TLV2774IN. Additionally, performance specifications are significantly reduced: slew rate of 0.2 V/µs versus 10.5 V/µs, and gain bandwidth product of 500 kHz versus 5.1 MHz. This part is unsuitable for forward-looking designs.

Q: What is the operating temperature range difference between MCP604-I/P and MCP604-E/P?

A: MCP604-I/P operates from -40°C to 85°C, while MCP604-E/P operates from -40°C to 125°C. Both parts are electrically identical. MCP604-E/P is recommended for applications requiring the extended upper temperature limit. MCP604-I/P is suitable only for applications with maximum operating temperature not exceeding 85°C.

Q: Can TLV2774IDR be used in through-hole PCB designs?

A: No. TLV2774IDR uses 14-SOIC surface-mount packaging and cannot be installed in through-hole PCB designs. For through-hole applications, use MCP604-E/P, MCP604-I/P, MCP6284-E/P, or MCP6294-E/P in 14-DIP packaging.

Q: What is the input offset voltage specification difference between TLV2774IN and MCP6284-E/P?

A: TLV2774IN specifies 700 µV input offset voltage, while MCP6284-E/P specifies 3 mV (3000 µV). MCP6284-E/P exhibits 4.3 times higher input offset voltage. For precision applications requiring low offset voltage, TLV2774IN or MCP604-series parts are preferred.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed (TLV2774IDR, MCP604-I/P, MCP604-E/P, MCP6284-E/P, MCP6294-E/P, and MAX494EPD+) are RoHS3 compliant. All parts are REACH Unaffected and classified under ECCN EAR99.