TLV2774CD Equivalent & Substitute Parts

Part Overview

The TLV2774CD is a CMOS rail-to-rail operational amplifier containing four independent circuits in a 14-SOIC surface mount package. Manufactured by Texas Instruments, this device is designated as Last Time Buy, indicating discontinued production with limited inventory availability. The TLV2774CD operates across a 2.5V to 5.5V supply range and is suitable for low-power analog signal processing applications requiring CMOS technology characteristics.

Substitute parts are necessary due to the Last Time Buy status of the TLV2774CD. Alternative devices with equivalent electrical and mechanical specifications ensure design continuity and long-term supply chain reliability.

Key Parameters

Parameter	Value	Unit
Amplifier Type	CMOS	—
Number of Circuits	4	—
Output Type	Rail-to-Rail	—
Package / Case	14-SOIC (0.154", 3.90mm Width)	—
Mounting Type	Surface Mount	—
Slew Rate	10.5	V/µs
Gain Bandwidth Product	5.1	MHz
Current - Input Bias	2	pA
Voltage - Input Offset	700	µV
Current - Supply	1	mA (x4 Channels)
Current - Output / Channel	50	mA
Voltage - Supply Span (Min)	2.5	V
Voltage - Supply Span (Max)	5.5	V
Operating Temperature	0 to 70	°C
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitution of the TLV2774CD is determined by strict equivalence across the following critical parameters:

Primary Substitution Criteria:

Amplifier Type: CMOS technology
Number of Circuits: 4 independent channels
Output Type: Rail-to-Rail capability
Package / Case: 14-SOIC form factor with 0.154" (3.90mm) width
Mounting Type: Surface Mount
Voltage Supply Range: Minimum 2.5V, Maximum 5.5V overlap required
Current Output per Channel: Minimum 50 mA capability

Secondary Compatibility Parameters:

Slew Rate: 10.5 V/µs or higher preferred for performance equivalence
Gain Bandwidth Product: 5.1 MHz or higher
Input Bias Current: 2 pA or lower
Input Offset Voltage: 700 µV or lower
RoHS3 Compliance and MSL rating for manufacturing compatibility

Substitute parts are grouped into two categories: direct equivalents (identical electrical specifications and packaging) and functional alternatives (meeting all primary criteria with acceptable performance trade-offs).

Parameter Comparison

Part Number	Manufacturer	Amplifier Type	Circuits	Output Type	Slew Rate (V/µs)	GBW (MHz)	Input Bias (pA)	Input Offset (µV)	Supply Current (mA)	Output Current (mA)	Supply Min (V)	Supply Max (V)	Temp Range (°C)	Package	Status
TLV2774CD	Texas Instruments	CMOS	4	Rail-to-Rail	10.5	5.1	2	700	1	50	2.5	5.5	0 to 70	14-SOIC	Last Time Buy
TLV2774CDR	Texas Instruments	CMOS	4	Rail-to-Rail	10.5	5.1	2	700	1	50	2.5	5.5	0 to 70	14-SOIC	Active
AD8604ARZ	Analog Devices Inc.	CMOS	4	Rail-to-Rail	6	8.4	0.2	80	0.75	50	2.7	5.5	-40 to 125	14-SOIC	Active
AD8604ARZ-REEL	Analog Devices Inc.	CMOS	4	Rail-to-Rail	6	8.4	0.2	80	0.75	50	2.7	5.5	-40 to 125	14-SOIC	Active
AD8604ARZ-REEL7	Analog Devices Inc.	CMOS	4	Rail-to-Rail	6	8.4	0.2	80	0.75	50	2.7	5.5	-40 to 125	14-SOIC	Active
LMV824DR2G	onsemi	General Purpose	4	Rail-to-Rail	2	5.6	119000	1000	1	45	2.7	5.5	-40 to 85	14-SOIC	Active
LMV824IDT	STMicroelectronics	General Purpose	4	Rail-to-Rail	1.9	5.5	60000	3500	0.3	70	2.5	5.5	-40 to 125	14-SOIC	Active
LMV824IYDT	STMicroelectronics	General Purpose	4	Rail-to-Rail	1.9	5.5	60000	3500	0.3	70	2.5	5.5	-40 to 125	14-SOIC	Active
MCP604-E/SL	Microchip Technology	CMOS	4	Rail-to-Rail	2.3	2.8	1	700	0.23	22	2.7	6	-40 to 125	14-SOIC	Active
MCP604-I/SL	Microchip Technology	CMOS	4	Rail-to-Rail	2.3	2.8	1	700	0.23	22	2.7	6	-40 to 85	14-SOIC	Active
MCP604T-E/SL	Microchip Technology	CMOS	4	Rail-to-Rail	2.3	2.8	1	700	0.23	22	2.7	6	-40 to 125	14-SOIC	Active

Engineering Selection Recommendations

Direct Equivalent (Recommended Primary Substitute):

The TLV2774CDR from Texas Instruments is the direct equivalent to the TLV2774CD. This part maintains identical electrical specifications, package configuration, and operating temperature range. The TLV2774CDR is in Active product status with 3,638 units in stock, providing immediate availability and design continuity. Both parts are ROHS3 compliant with MSL 1 rating, ensuring manufacturing compatibility without process modifications.

CMOS Technology Alternatives (Performance Enhancement):

The AD8604ARZ, AD8604ARZ-REEL, and AD8604ARZ-REEL7 from Analog Devices Inc. are CMOS amplifiers meeting all primary substitution criteria. These devices offer enhanced performance characteristics: higher gain bandwidth product (8.4 MHz versus 5.1 MHz), lower input bias current (0.2 pA versus 2 pA), and reduced input offset voltage (80 µV versus 700 µV). The extended operating temperature range (-40°C to 125°C) provides broader application flexibility. All three variants are in Active status with substantial inventory (2,081 to 12,500 units). The AD8604ARZ-REEL7 variant offers the highest stock availability at 12,500 units.

General Purpose Amplifier Alternatives (Performance Trade-offs):

The LMV824IDT and LMV824IYDT from STMicroelectronics are general purpose amplifiers with four circuits in 14-SOIC packaging. These devices maintain supply voltage compatibility (2.5V to 5.5V) and rail-to-rail output capability. However, they exhibit reduced slew rate (1.9 V/µs versus 10.5 V/µs) and significantly higher input bias current (60 nA versus 2 pA). The LMV824IYDT provides automotive qualification (AEC-Q100) with 97,800 units in stock, suitable for automotive applications requiring extended temperature operation (-40°C to 125°C).

The LMV824DR2G from onsemi is a general purpose alternative with reduced performance specifications (2 V/µs slew rate, 5.6 MHz GBW) and higher input bias current (119 nA). This device is suitable for applications where CMOS precision is not critical.

Microchip Technology Alternatives (Low-Power Applications):

The MCP604-E/SL, MCP604-I/SL, and MCP604T-E/SL are CMOS amplifiers with reduced power consumption (230 µA per two channels versus 1 mA per four channels). These devices have lower output current capability (22 mA versus 50 mA) and reduced gain bandwidth product (2.8 MHz versus 5.1 MHz). The MCP604T-E/SL variant supports extended temperature operation (-40°C to 125°C) and is suitable for low-power, low-frequency signal processing applications.

Frequently Asked Questions (FAQ)

Q: Can the TLV2774CDR directly replace the TLV2774CD without circuit modifications?

A: Yes. The TLV2774CDR is electrically and mechanically identical to the TLV2774CD. Both devices have identical slew rate (10.5 V/µs), gain bandwidth product (5.1 MHz), input bias current (2 pA), input offset voltage (700 µV), supply current (1 mA per four channels), and output current (50 mA per channel). The 14-SOIC package dimensions and pinout are identical. No circuit modifications are required.

Q: What are the key differences between CMOS and general purpose amplifier substitutes?

A: CMOS amplifiers (TLV2774CD, AD8604ARZ, MCP604 series) feature extremely low input bias current (typically 1-2 pA) and are optimized for high-impedance signal sources. General purpose amplifiers (LMV824 series) have significantly higher input bias current (60-119 nA) and are suitable for lower-impedance applications. CMOS devices consume less power and provide superior input impedance characteristics. Selection depends on application requirements for input impedance and power consumption.

Q: Are the AD8604ARZ variants (AD8604ARZ, AD8604ARZ-REEL, AD8604ARZ-REEL7) electrically identical?

A: Yes. All three AD8604ARZ variants are electrically identical. The differences are packaging configurations: AD8604ARZ is supplied in Tube packaging, while AD8604ARZ-REEL and AD8604ARZ-REEL7 are supplied in Cut Tape and Digi-Reel formats. Selection depends on manufacturing process requirements and inventory management preferences. The AD8604ARZ-REEL7 variant has the highest stock availability (12,500 units).

Q: Can MCP604 series devices replace the TLV2774CD in high-speed applications?

A: No. The MCP604 series has significantly reduced slew rate (2.3 V/µs versus 10.5 V/µs) and lower gain bandwidth product (2.8 MHz versus 5.1 MHz). These devices are unsuitable for applications requiring fast signal transients or high-frequency operation. The MCP604 series is recommended only for low-frequency, low-power applications where reduced performance specifications are acceptable.

Q: What is the significance of the Last Time Buy status for the TLV2774CD?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of the TLV2774CD. Current inventory (74,770 units) represents the final available stock. Once depleted, the device will no longer be available from the manufacturer. Designers should transition to the TLV2774CDR or alternative substitutes to ensure long-term supply chain continuity and avoid future component obsolescence.

Q: Which substitute offers the best performance improvement over the TLV2774CD?

A: The AD8604ARZ series offers the most significant performance enhancement. Compared to the TLV2774CD, the AD8604ARZ provides higher gain bandwidth product (8.4 MHz versus 5.1 MHz), lower input bias current (0.2 pA versus 2 pA), and reduced input offset voltage (80 µV versus 700 µV). The extended operating temperature range (-40°C to 125°C) provides additional application flexibility. These improvements make the AD8604ARZ suitable for precision analog signal processing applications.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed (TLV2774CDR, AD8604ARZ variants, LMV824 series, MCP604 series) are ROHS3 compliant. All devices have MSL 1 rating (unlimited moisture sensitivity) except LMV824DR2G, which has MSL 3 (168 hours). This ensures compatibility with standard manufacturing processes and environmental regulations.

Q: What packaging options are available for the substitute parts?

A: All substitute parts are available in 14-SOIC surface mount packages with 0.154" (3.90mm) width, maintaining mechanical compatibility with the TLV2774CD. Packaging format variations include Tube (standard), Cut Tape (CT), and Digi-Reel (TR) options. Selection depends on manufacturing process requirements and inventory management preferences. Tube packaging is suitable for small-volume applications, while Cut Tape and Digi-Reel formats are optimized for automated assembly processes.

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