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TLV2774AIN Equivalent & Substitute Parts
Part Overview
The TLV2774AIN is a CMOS quad operational amplifier manufactured by Texas Instruments, housed in a 14-pin DIP package for through-hole mounting. This device features rail-to-rail output capability and is designed for general-purpose analog signal processing applications requiring low power consumption and precision performance. The TLV2774AIN currently holds Last Time Buy status, indicating discontinued production. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for existing applications and new designs.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | CMOS | — |
| Number of Circuits | 4 | Channels |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 10.5 | V/µs |
| Gain Bandwidth Product | 5.1 | MHz |
| Current - Input Bias | 2 | pA |
| Voltage - Input Offset | 700 | µV |
| Current - Supply (per 4 Channels) | 1 | mA |
| Current - Output / Channel | 50 | mA |
| Voltage - Supply Span (Min) | 2.5 | V |
| Voltage - Supply Span (Max) | 5.5 | V |
| Operating Temperature | -40 to 125 | °C |
| Package / Case | 14-DIP (0.300", 7.62mm) | — |
| Mounting Type | Through Hole | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution eligibility for the TLV2774AIN is determined by the following critical parameters:
Primary Substitution Criteria:
- Number of circuits: 4 channels
- Output type: Rail-to-Rail
- Package compatibility: 14-pin DIP form factor (for direct socket replacement)
- Supply voltage range: Minimum 2.5 V, Maximum 5.5 V
- Operating temperature range: -40°C to 125°C
- RoHS3 compliance
Secondary Performance Criteria:
- Slew rate: 10.5 V/µs or greater
- Gain bandwidth product: 5.1 MHz or greater
- Input bias current: 2 pA or lower
- Output current per channel: 50 mA or greater
The substitute parts listed below meet the primary criteria for functional and mechanical compatibility. Performance variations in secondary criteria are noted in the parameter comparison table.
Parameter Comparison
| Parameter | TLV2774AIN | TLV2774AIDR | MCP6284-E/P | MAX494EPD+ |
|---|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Microchip Technology | Analog Devices Inc./Maxim Integrated |
| Number of Circuits | 4 | 4 | 4 | 4 |
| Amplifier Type | CMOS | CMOS | General Purpose | General Purpose |
| Output Type | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail |
| Slew Rate (V/µs) | 10.5 | 10.5 | 2.5 | 0.2 |
| Gain Bandwidth Product (MHz) | 5.1 | 5.1 | 5 | 0.5 |
| Current - Input Bias (pA) | 2 | 2 | 1 | 25 |
| Voltage - Input Offset (µV) | 700 | 700 | 3000 | 200 |
| Current - Supply per 4 Channels (mA) | 1 | 1 | 0.45 | 0.15 |
| Current - Output / Channel (mA) | 50 | 50 | 25 | 30 |
| Voltage - Supply Span Min (V) | 2.5 | 2.5 | 2.2 | 2.7 |
| Voltage - Supply Span Max (V) | 5.5 | 5.5 | 5.5 | 6 |
| Operating Temperature (°C) | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 85 |
| Package / Case | 14-DIP (0.300", 7.62mm) | 14-SOIC (0.154", 3.90mm) | 14-DIP (0.300", 7.62mm) | 14-DIP (0.300", 7.62mm) |
| Mounting Type | Through Hole | Surface Mount | Through Hole | Through Hole |
| Product Status | Last Time Buy | Active | Active | Obsolete |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
TLV2774AIDR (Texas Instruments)
The TLV2774AIDR is the direct functional equivalent of the TLV2774AIN, manufactured by the same supplier with identical electrical specifications. This part maintains Active product status, ensuring long-term availability and supply chain stability. The primary difference is packaging: TLV2774AIDR uses 14-SOIC surface-mount configuration versus the through-hole 14-DIP of the TLV2774AIN. Selection of this part requires PCB redesign for surface-mount assembly. RoHS3 compliance and REACH unaffected status are maintained.
MCP6284-E/P (Microchip Technology)
The MCP6284-E/P is a through-hole 14-DIP packaged quad amplifier with Active product status, providing direct socket compatibility with the TLV2774AIN. Electrical performance is comparable across most parameters. Slew rate is reduced to 2.5 V/µs (versus 10.5 V/µs), and input offset voltage is elevated to 3 mV (versus 700 µV). Supply current is lower at 0.45 mA per 4 channels. Output current per channel is reduced to 25 mA (versus 50 mA). Operating temperature range extends to -40°C to 125°C. This part is suitable for applications where reduced slew rate and higher input offset voltage are acceptable trade-offs for lower power consumption. RoHS3 compliance is maintained.
MAX494EPD+ (Analog Devices Inc./Maxim Integrated)
The MAX494EPD+ is a through-hole 14-DIP packaged quad amplifier with Obsolete product status. While mechanically compatible with the TLV2774AIN, this part exhibits significant performance degradation: slew rate of 0.2 V/µs, gain bandwidth product of 0.5 MHz, and input bias current of 25 nA. Operating temperature range is limited to -40°C to 85°C. Selection of this part is not recommended due to obsolete status and substantial performance reduction.
Frequently Asked Questions (FAQ)
Q: Can the TLV2774AIDR be used as a direct replacement for the TLV2774AIN?
A: The TLV2774AIDR is electrically identical to the TLV2774AIN and shares the same base product number. However, it uses 14-SOIC surface-mount packaging instead of 14-DIP through-hole packaging. Direct socket replacement is not possible without PCB redesign. If your application uses through-hole assembly, the TLV2774AIDR requires adapter circuitry or PCB modification.
Q: What are the key performance differences between the TLV2774AIN and MCP6284-E/P?
A: Both devices are quad rail-to-rail amplifiers in 14-DIP through-hole packages. The TLV2774AIN offers higher slew rate (10.5 V/µs versus 2.5 V/µs), higher gain bandwidth product (5.1 MHz versus 5 MHz), lower input offset voltage (700 µV versus 3 mV), and higher output current per channel (50 mA versus 25 mA). The MCP6284-E/P consumes less supply current (0.45 mA versus 1 mA per 4 channels). Selection depends on whether your application requires the higher performance specifications of the TLV2774AIN.
Q: Is the MAX494EPD+ suitable as a substitute for the TLV2774AIN?
A: The MAX494EPD+ is mechanically compatible (14-DIP through-hole package) but exhibits significantly reduced performance across multiple parameters and carries Obsolete product status. Slew rate is reduced by 52.5 times, and gain bandwidth product is reduced by 10.2 times. Operating temperature range is limited to -40°C to 85°C. This part is not recommended for new designs or as a substitute for the TLV2774AIN.
Q: What is the supply voltage compatibility range for substitute parts?
A: The TLV2774AIN operates from 2.5 V to 5.5 V. The TLV2774AIDR maintains this range. The MCP6284-E/P extends the minimum to 2.2 V and maintains 5.5 V maximum. The MAX494EPD+ operates from 2.7 V to 6 V. Verify your application's supply voltage requirements against each substitute part's specifications before selection.
Q: Are all substitute parts RoHS3 compliant?
A: Yes. The TLV2774AIN, TLV2774AIDR, MCP6284-E/P, and MAX494EPD+ are all ROHS3 compliant. All parts are REACH unaffected. Regulatory compliance is maintained across all listed substitutes.
Q: What is the operating temperature range difference between the TLV2774AIN and MAX494EPD+?
A: The TLV2774AIN operates from -40°C to 125°C. The MAX494EPD+ is limited to -40°C to 85°C. Applications requiring operation above 85°C cannot use the MAX494EPD+. The TLV2774AIDR and MCP6284-E/P both support the full -40°C to 125°C range.
Q: Can I use the MCP6284-E/P in a high-speed signal processing application?
A: The MCP6284-E/P has a slew rate of 2.5 V/µs and gain bandwidth product of 5 MHz, compared to the TLV2774AIN's 10.5 V/µs and 5.1 MHz respectively. For applications requiring fast transient response or high-frequency signal processing, the reduced slew rate of the MCP6284-E/P may introduce signal distortion. Evaluate your application's bandwidth and slew rate requirements before substitution.
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