TLV2773CDGSG4 Equivalent & Substitute Parts

Part Overview

The TLV2773CDGSG4 is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal processing applications. This device integrates two independent amplifier circuits in a 10-VSSOP surface mount package with a supply voltage range of 2.5V to 5.5V and operating temperature range of 0°C to 70°C.

The TLV2773CDGSG4 carries a Last Time Buy product status, indicating that Texas Instruments has discontinued this part number and will no longer manufacture it after existing inventory is depleted. This status necessitates identification of equivalent substitute parts to ensure design continuity and long-term component availability for new production runs and system maintenance.

Substiute Parts

TLV2773CDGSG4

Texas InstrumentsIn Stock: 750TLV2773CDGSG4 Datasheet

Current PartRFQ

TLV9052SIDGSR

Texas InstrumentsIn Stock: 8886TLV9052SIDGSR Datasheet

MFR RecommendedRFQ

TLV2773CDGS

Texas InstrumentsIn Stock: 2129TLV2773CDGS Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2773CDGSG4 is determined by the following critical parameters:

Functional Equivalence Criteria:

• Amplifier Type: CMOS
• Number of Circuits: 2 independent channels
• Output Type: Rail-to-Rail
• Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
• Mounting Type: Surface Mount

Electrical Compatibility Criteria:

• Voltage - Supply Span (Min): 2.5V or lower
• Voltage - Supply Span (Max): 5.5V or higher
• Current - Output per Channel: 50mA or greater
• Slew Rate: 10.5V/µs or greater
• Gain Bandwidth Product: 5.1MHz or greater

Compliance & Certification Criteria:

• RoHS Status: ROHS3 Compliant
• REACH Status: REACH Unaffected
• ECCN: EAR99
• HTSUS: 8542.33.0001

Substitute parts must satisfy all functional equivalence criteria and maintain electrical compatibility within the specified parameter ranges. Parts meeting these requirements are electrically and mechanically interchangeable in applications designed for the TLV2773CDGSG4.

Parameter Comparison

Engineering Selection Recommendations

TLV9052SIDGSR is the primary recommended substitute for the TLV2773CDGSG4. This part maintains identical functional architecture (dual CMOS rail-to-rail amplifier in 10-VSSOP package) while offering enhanced electrical performance and extended operational capability. The TLV9052SIDGSR features improved slew rate (15V/µs versus 10.5V/µs), lower input offset voltage (330µV versus 700µV), and reduced supply current (330µA versus 1mA per channel). The extended operating temperature range (-40°C to 125°C) and active product status ensure long-term availability and support. The TLV9052SIDGSR is suitable for applications requiring superior dynamic performance and wider temperature operation. Moisture sensitivity level MSL 2 (1 Year) requires standard handling procedures for surface mount assembly.

TLV2773CDGS is an alternative substitute that provides electrical and functional equivalence with identical performance specifications to the TLV2773CDGSG4. This part differs only in packaging format (Tube versus Tube) and maintains the same slew rate, gain bandwidth product, supply current, and operating temperature range. The TLV2773CDGS carries Last Time Buy status, indicating this is a transitional solution with limited future availability. This substitute is appropriate for applications where performance specifications must remain unchanged from the original design.

Both substitute parts satisfy RoHS3 compliance, REACH unaffected status, and EAR99 export classification requirements. Selection between TLV9052SIDGSR and TLV2773CDGS depends on design requirements for performance enhancement and long-term component availability.

Frequently Asked Questions (FAQ)

Q: Can the TLV9052SIDGSR directly replace the TLV2773CDGSG4 in existing circuit designs?

A: Yes. The TLV9052SIDGSR is electrically and mechanically compatible with the TLV2773CDGSG4. Both devices feature identical package geometry (10-VSSOP), pinout configuration, and functional architecture (dual CMOS rail-to-rail amplifier). The TLV9052SIDGSR meets or exceeds all electrical specifications of the TLV2773CDGSG4, including slew rate, gain bandwidth product, output current capability, and supply voltage range. No circuit modifications are required for direct substitution.

Q: What are the key electrical differences between TLV9052SIDGSR and TLV2773CDGSG4?

A: The TLV9052SIDGSR provides superior performance in three areas: (1) Slew Rate: 15V/µs versus 10.5V/µs, enabling faster signal transitions; (2) Input Offset Voltage: 330µV versus 700µV, reducing DC error in precision applications; (3) Supply Current: 330µA per channel versus 1mA per channel, reducing power consumption. The TLV9052SIDGSR also extends the minimum supply voltage to 1.8V and operating temperature range to -40°C to 125°C.

Q: Is the TLV2773CDGS a suitable long-term substitute?

A: The TLV2773CDGS provides functional and electrical equivalence but carries Last Time Buy status, indicating limited future availability. This part is suitable only as a short-term transitional solution. For new designs and long-term production requirements, the TLV9052SIDGSR is the recommended substitute due to its Active product status and assured continued availability.

Q: What is the significance of the different packaging formats (Tube versus Cut Tape)?

A: Packaging format affects component handling and assembly logistics. The TLV2773CDGSG4 and TLV2773CDGS are supplied in Tube packaging, suitable for manual handling and lower-volume assembly. The TLV9052SIDGSR is supplied in Cut Tape (CT) and Digi-Reel format, optimized for automated pick-and-place assembly equipment. Both packaging formats contain identical die and electrical specifications. Selection depends on assembly process requirements and production volume.

Q: How does the Moisture Sensitivity Level (MSL) difference affect component handling?

A: The TLV2773CDGSG4 and TLV2773CDGS have MSL 1 (Unlimited), requiring no special moisture control during storage and handling. The TLV9052SIDGSR has MSL 2 (1 Year), requiring storage in dry conditions and baking before reflow soldering if the component has been exposed to ambient humidity for extended periods. Standard surface mount assembly facilities maintain MSL 2 compliance through controlled storage and handling procedures.

Q: Are all three parts RoHS3 compliant?

A: Yes. The TLV2773CDGSG4, TLV9052SIDGSR, and TLV2773CDGS are all ROHS3 Compliant and REACH Unaffected, meeting environmental and regulatory requirements for commercial and industrial applications.

Q: What is the recommended substitute for new product designs?

A: The TLV9052SIDGSR is the recommended substitute for new product designs. This part offers Active product status, ensuring long-term availability and manufacturing support. The enhanced electrical performance (higher slew rate, lower input offset voltage, reduced supply current) and extended operating temperature range provide design flexibility for current and future applications.