TLV2772IP Equivalent & Substitute Parts

Part Overview

The TLV2772IP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This device features rail-to-rail output capability and is designed for general-purpose analog signal processing applications requiring low power consumption and precision performance.

The TLV2772IP carries a Last Time Buy product status, indicating that Texas Instruments has discontinued this part number. Identifying equivalent and substitute components is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this amplifier.

Substiute Parts

TLV2772IP

Texas InstrumentsIn Stock: 1936TLV2772IP Datasheet

Current PartRFQ

TLV2772IDR

Texas InstrumentsIn Stock: 70392TLV2772IDR Datasheet

MFR RecommendedRFQ

MCP602-E/P

Microchip TechnologyIn Stock: 5019MCP602-E/P Datasheet

MFR RecommendedRFQ

MCP602-I/P

Microchip TechnologyIn Stock: 1518MCP602-I/P Datasheet

MFR RecommendedRFQ

MCP6282-E/P

Microchip TechnologyIn Stock: 2277MCP6282-E/P Datasheet

MFR RecommendedRFQ

MCP6285-E/P

Microchip TechnologyIn Stock: 2683MCP6285-E/P Datasheet

MFR RecommendedRFQ

MCP6292-E/P

Microchip TechnologyIn Stock: 2290MCP6292-E/P Datasheet

MFR RecommendedRFQ

MCP6295-E/P

Microchip TechnologyIn Stock: 774MCP6295-E/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2772IP is determined by strict alignment of the following critical parameters:

Primary Substitution Criteria:

• Amplifier Type: CMOS
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Package / Case: 8-DIP (0.300", 7.62mm)
• Mounting Type: Through Hole
• Operating Temperature Range: -40°C to 125°C minimum

Secondary Performance Parameters (must meet or exceed):

• Slew Rate: ≥ 10.5 V/µs
• Gain Bandwidth Product: ≥ 5.1 MHz
• Current - Output per Channel: ≥ 50 mA
• Voltage - Supply Span: 2.5 V to 5.5 V compatible range

Substitute parts are grouped into two categories:

Category 1: Direct Package Equivalent (Surface Mount Alternative)

• TLV2772IDR: Identical electrical specifications, 8-SOIC surface mount package

Category 2: Through-Hole DIP Alternatives (Functional Substitutes)

• MCP602-E/P, MCP602-I/P: CMOS dual amplifiers, 8-DIP package, lower performance specifications
• MCP6282-E/P, MCP6285-E/P: General Purpose dual amplifiers, 8-DIP package, comparable performance
• MCP6292-E/P, MCP6295-E/P: General Purpose dual amplifiers, 8-DIP package, enhanced performance

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement (Identical Electrical Performance):

TLV2772IDR is the manufacturer-recommended equivalent to TLV2772IP. Both devices share identical electrical specifications, operating temperature range, and supply voltage compatibility. The only difference is the package format: TLV2772IDR uses 8-SOIC surface mount technology instead of through-hole DIP. Selection of TLV2772IDR requires PCB redesign to accommodate surface mount footprint. Both parts maintain ROHS3 compliance and Active product status.

For Through-Hole DIP Substitution (When PCB Redesign Is Not Feasible):

When through-hole mounting must be retained, substitute selection depends on application performance requirements:

• MCP602-E/P or MCP602-I/P: Select when power consumption is the primary design constraint. These parts consume significantly less supply current (0.23 mA vs. 1 mA per channel). Trade-offs include reduced slew rate (2.3 V/µs vs. 10.5 V/µs), lower gain-bandwidth product (2.8 MHz vs. 5.1 MHz), and reduced output current capability (22 mA vs. 50 mA). MCP602-I/P is limited to -40°C to 85°C operating range.

• MCP6282-E/P or MCP6285-E/P: Select for applications requiring moderate performance improvement with extended temperature range. These parts offer comparable gain-bandwidth product (5 MHz vs. 5.1 MHz) and full -40°C to 125°C operation. Slew rate remains lower (2.5 V/µs vs. 10.5 V/µs), and output current is reduced (25 mA vs. 50 mA).

• MCP6292-E/P or MCP6295-E/P: Select for applications requiring enhanced performance specifications. These parts exceed TLV2772IP performance in slew rate (7 V/µs vs. 10.5 V/µs is lower but acceptable for many applications) and gain-bandwidth product (10 MHz vs. 5.1 MHz). Supply current matches the original (1 mA per channel). Output current capability is reduced (25 mA vs. 50 mA).

All substitute parts maintain ROHS3 compliance and Active product status, ensuring long-term availability and regulatory compliance.

Frequently Asked Questions (FAQ)

Q1: Can TLV2772IDR be used as a direct replacement for TLV2772IP without circuit modification?

A: TLV2772IDR provides identical electrical performance and is the manufacturer-recommended equivalent. However, it requires PCB redesign because it uses 8-SOIC surface mount packaging instead of 8-DIP through-hole packaging. Circuit schematic connections remain unchanged; only the physical footprint differs.

Q2: What is the primary limitation when substituting MCP602 series for TLV2772IP?

A: The MCP602-E/P and MCP602-I/P have significantly reduced performance specifications. Slew rate is 2.3 V/µs (vs. 10.5 V/µs), gain-bandwidth product is 2.8 MHz (vs. 5.1 MHz), and output current per channel is 22 mA (vs. 50 mA). These parts are suitable only for low-speed, low-current applications. Additionally, MCP602-I/P operates only to 85°C, not 125°C.

Q3: Why do MCP6282-E/P and MCP6285-E/P have identical specifications despite different part numbers?

A: Both parts are functionally equivalent general-purpose amplifiers with identical electrical parameters. The part number difference reflects internal design variants or manufacturing process differences that do not affect electrical performance or pin compatibility.

Q4: Are MCP6292-E/P and MCP6295-E/P interchangeable?

A: MCP6292-E/P and MCP6295-E/P share identical electrical specifications and are functionally interchangeable. Both provide enhanced gain-bandwidth product (10 MHz vs. 5.1 MHz) and slew rate (7 V/µs) compared to TLV2772IP. The part number difference reflects internal design or manufacturing variants.

Q5: What is the key difference between TLV2772IP and all Microchip substitute options?

A: TLV2772IP is a CMOS amplifier, while all Microchip substitutes (MCP602, MCP6282, MCP6285, MCP6292, MCP6295) are classified as either CMOS or General Purpose amplifiers. More significantly, TLV2772IP delivers 50 mA output current per channel, while Microchip alternatives provide 22–25 mA. Applications requiring high output current cannot use Microchip substitutes without external buffering.

Q6: Can I use MCP6292-E/P or MCP6295-E/P in a design originally specified for TLV2772IP?

A: These parts are compatible for applications where output current requirements do not exceed 25 mA per channel. They provide superior gain-bandwidth product (10 MHz vs. 5.1 MHz) and acceptable slew rate (7 V/µs). However, if the original design relies on 50 mA output current capability, these substitutes are not suitable without circuit redesign.

Q7: What compliance certifications apply to all listed substitute parts?

A: All substitute parts listed maintain ROHS3 compliance and REACH Unaffected status, matching the regulatory compliance of TLV2772IP. This ensures compatibility with current environmental and hazardous substance regulations.

Q8: Why is TLV2772IP marked as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued this part number. Existing inventory is available for purchase, but no future production is planned. Designers should transition to active alternatives such as TLV2772IDR (surface mount) or qualified Microchip substitutes (through-hole) to ensure long-term supply chain continuity.