TLV2772CP Equivalent & Substitute Parts

Part Overview

The TLV2772CP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, packaged in 8-DIP through-hole configuration. This device features rail-to-rail output capability and is designed for general-purpose analog signal processing applications requiring low power consumption and high input impedance.

The TLV2772CP is designated as Last Time Buy, indicating discontinued production status. Equivalent and substitute parts are necessary to maintain design continuity and ensure long-term component availability for new designs and production requirements.

Substiute Parts

TLV2772CP

Texas InstrumentsIn Stock: 981TLV2772CP Datasheet

Current PartRFQ

TLV2772CDR

Texas InstrumentsIn Stock: 6937TLV2772CDR Datasheet

MFR RecommendedRFQ

MCP602-E/P

Microchip TechnologyIn Stock: 5019MCP602-E/P Datasheet

MFR RecommendedRFQ

MCP602-I/P

Microchip TechnologyIn Stock: 1518MCP602-I/P Datasheet

MFR RecommendedRFQ

MCP6282-E/P

Microchip TechnologyIn Stock: 2277MCP6282-E/P Datasheet

MFR RecommendedRFQ

MCP6285-E/P

Microchip TechnologyIn Stock: 2683MCP6285-E/P Datasheet

MFR RecommendedRFQ

MCP6292-E/P

Microchip TechnologyIn Stock: 2290MCP6292-E/P Datasheet

MFR RecommendedRFQ

MCP6295-E/P

Microchip TechnologyIn Stock: 774MCP6295-E/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2772CP is determined by the following critical parameters:

Primary Substitution Criteria:

• Dual-channel configuration (2 circuits)
• Rail-to-rail output capability
• CMOS amplifier technology
• 8-DIP through-hole package (0.300", 7.62mm)
• Supply voltage range compatibility (minimum 2.5V, maximum 5.5V)
• Operating temperature range (0°C to 70°C minimum)

Secondary Compatibility Factors:

• Slew rate ≥ 10.5 V/µs (performance maintenance)
• Gain bandwidth product ≥ 5.1 MHz (frequency response)
• Input bias current ≤ 2 pA (high impedance preservation)
• Output current per channel ≥ 50 mA (load driving capability)

Substitute parts are grouped into two categories:

Category 1: Direct Package Equivalent (8-DIP Through-Hole) Parts maintaining identical through-hole DIP packaging, enabling direct socket replacement without PCB modification.

Category 2: Package Alternative (Surface Mount) Parts offering equivalent electrical performance in alternative surface-mount packages, requiring PCB redesign but providing active product status and extended availability.

Parameter Comparison

Engineering Selection Recommendations

TLV2772CDR (Texas Instruments)

The TLV2772CDR is the manufacturer-recommended equivalent from Texas Instruments, offering identical electrical specifications to the TLV2772CP. This part maintains CMOS amplifier technology, dual-channel configuration, and matching slew rate (10.5 V/µs) and gain bandwidth product (5.1 MHz). The primary difference is packaging: TLV2772CDR uses 8-SOIC surface-mount configuration instead of through-hole DIP. This substitute is appropriate for new PCB designs where surface-mount assembly is standard practice. Product status is Active with extended availability (6875 units in stock). RoHS3 compliance and REACH unaffected status are maintained.

MCP602-E/P and MCP602-I/P (Microchip Technology)

Both MCP602 variants maintain 8-DIP through-hole packaging, enabling direct socket replacement without PCB modification. These parts are CMOS dual-channel amplifiers with rail-to-rail output. Performance trade-offs include reduced slew rate (2.3 V/µs versus 10.5 V/µs) and lower gain bandwidth product (2.8 MHz versus 5.1 MHz). Supply current is significantly lower (230 µA per channel versus 1 mA), and output current per channel is reduced (22 mA versus 50 mA). Operating temperature range extends to -40°C to 125°C (MCP602-E/P) or -40°C to 85°C (MCP602-I/P), exceeding the TLV2772CP specification. Both variants are Active products with high inventory availability. Selection between MCP602-E/P and MCP602-I/P depends on required operating temperature range.

MCP6282-E/P and MCP6285-E/P (Microchip Technology)

These General Purpose amplifiers maintain 8-DIP through-hole packaging and dual-channel configuration. Electrical specifications include slew rate of 2.5 V/µs and gain bandwidth product of 5 MHz, closely matching TLV2772CP performance. Supply current is 450 µA per channel, and output current per channel is 25 mA. Supply voltage range extends to 2.2 V minimum and 5.5 V maximum. Operating temperature range is -40°C to 125°C. Both parts are Active products with good inventory availability (2180 and 2600 units respectively). These substitutes are suitable for applications where the reduced slew rate and output current are acceptable.

MCP6292-E/P and MCP6295-E/P (Microchip Technology)

These General Purpose amplifiers provide enhanced performance characteristics with 8-DIP through-hole packaging. Slew rate is 7 V/µs and gain bandwidth product is 10 MHz, exceeding TLV2772CP specifications. Supply current is 1 mA per channel, matching the original part. Output current per channel is 25 mA. Supply voltage range is 2.4 V to 6 V. Operating temperature range is -40°C to 125°C. Both parts are Active products. MCP6292-E/P has 2250 units in stock; MCP6295-E/P has 689 units. These substitutes are appropriate for applications requiring higher frequency response and slew rate performance.

All substitute parts maintain RoHS3 compliance and REACH unaffected status, ensuring regulatory compatibility with the original TLV2772CP.

Frequently Asked Questions (FAQ)

Q: Can TLV2772CDR be used as a direct replacement for TLV2772CP?

A: TLV2772CDR provides identical electrical performance and is the manufacturer-recommended equivalent. However, it uses 8-SOIC surface-mount packaging instead of 8-DIP through-hole. Direct socket replacement is not possible without PCB redesign. For new designs, TLV2772CDR is the preferred choice due to Active product status.

Q: What are the key performance differences between TLV2772CP and MCP602 variants?

A: MCP602-E/P and MCP602-I/P maintain through-hole DIP packaging for direct socket replacement. Performance differences include: slew rate reduced from 10.5 V/µs to 2.3 V/µs, gain bandwidth product reduced from 5.1 MHz to 2.8 MHz, supply current reduced from 1 mA to 230 µA per channel, and output current reduced from 50 mA to 22 mA per channel. These trade-offs result in lower power consumption but reduced high-frequency performance.

Q: Which substitute part offers the best performance match to TLV2772CP?

A: MCP6292-E/P and MCP6295-E/P provide the closest performance match with gain bandwidth product of 10 MHz (exceeding the original 5.1 MHz) and slew rate of 7 V/µs (compared to 10.5 V/µs). Both maintain 8-DIP through-hole packaging and 1 mA supply current per channel. These parts are suitable for applications requiring high-frequency performance.

Q: Are all substitute parts RoHS3 compliant?

A: Yes, all listed substitute parts are RoHS3 compliant and REACH unaffected, matching the regulatory status of the TLV2772CP.

Q: What is the difference between MCP602-E/P and MCP602-I/P?

A: Both parts are CMOS dual-channel amplifiers in 8-DIP packaging with identical electrical specifications. The primary difference is operating temperature range: MCP602-E/P operates from -40°C to 125°C, while MCP602-I/P operates from -40°C to 85°C. Select MCP602-E/P for applications requiring the extended upper temperature limit.

Q: Can MCP6282-E/P or MCP6285-E/P be used in high-speed applications?

A: MCP6282-E/P and MCP6285-E/P have slew rate of 2.5 V/µs and gain bandwidth product of 5 MHz. These specifications are lower than TLV2772CP (10.5 V/µs slew rate, 5.1 MHz bandwidth). These parts are suitable for general-purpose applications but not recommended for high-speed signal processing requiring slew rates above 5 V/µs.

Q: What is the inventory status of substitute parts?

A: TLV2772CDR has 6875 units in stock. MCP602-E/P has 4992 units. MCP602-I/P has 1500 units. MCP6282-E/P has 2180 units. MCP6285-E/P has 2600 units. MCP6292-E/P has 2250 units. MCP6295-E/P has 689 units. All substitute parts are in active production with available inventory.

Q: Is socket compatibility maintained with all substitute parts?

A: Socket compatibility is maintained only with substitute parts using 8-DIP through-hole packaging: MCP602-E/P, MCP602-I/P, MCP6282-E/P, MCP6285-E/P, MCP6292-E/P, and MCP6295-E/P. TLV2772CDR uses 8-SOIC surface-mount packaging and requires PCB redesign.