TLV2772AIP Equivalent & Substitute Parts

Part Overview

The TLV2772AIP is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, housed in an 8-pin DIP package for through-hole mounting. This device features rail-to-rail output capability and is designed for general-purpose analog signal conditioning applications requiring low power consumption and precision performance across industrial temperature ranges.

The TLV2772AIP is designated as Last Time Buy, indicating discontinued production. Identification of equivalent and substitute parts is necessary to support ongoing design requirements, system maintenance, and production continuity for applications currently utilizing this component.

Substiute Parts

TLV2772AIP

Texas InstrumentsIn Stock: 1250TLV2772AIP Datasheet

Current PartRFQ

TLV2772AIDR

Texas InstrumentsIn Stock: 1411TLV2772AIDR Datasheet

MFR RecommendedRFQ

MCP602-E/P

Microchip TechnologyIn Stock: 5019MCP602-E/P Datasheet

MFR RecommendedRFQ

MCP602-I/P

Microchip TechnologyIn Stock: 1518MCP602-I/P Datasheet

MFR RecommendedRFQ

MCP6282-E/P

Microchip TechnologyIn Stock: 2277MCP6282-E/P Datasheet

MFR RecommendedRFQ

MCP6285-E/P

Microchip TechnologyIn Stock: 2683MCP6285-E/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2772AIP is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Dual-channel configuration (2 circuits required)
• Rail-to-rail output capability
• CMOS amplifier topology
• Supply voltage range encompassing 2.5 V to 5.5 V minimum
• Operating temperature range of -40°C to 125°C
• Slew rate and gain-bandwidth product sufficient for signal conditioning applications
• Input bias current and input offset voltage within acceptable limits for precision applications

Mechanical Compatibility Criteria:

• 8-pin DIP package format (0.300", 7.62mm pitch)
• Through-hole mounting technology
• Pin-compatible footprint

Compliance Requirements:

• ROHS3 compliance
• REACH unaffected status
• EAR99 export classification

Substitute parts are grouped into two categories: direct package equivalents (8-DIP through-hole) and alternative package options (8-SOIC surface mount) for applications permitting PCB redesign.

Parameter Comparison

Engineering Selection Recommendations

Direct Package Equivalent (Recommended for Pin-Compatible Replacement):

The TLV2772AIDR is the primary equivalent for the TLV2772AIP. Both devices share identical electrical specifications including slew rate (10.5 V/µs), gain-bandwidth product (5.1 MHz), input bias current (2 pA), and input offset voltage (500 µV). The TLV2772AIDR maintains the same supply voltage range (2.5 V to 5.5 V) and operating temperature range (-40°C to 125°C). The sole difference is packaging: TLV2772AIDR uses 8-SOIC surface-mount format instead of 8-DIP through-hole. This substitution requires PCB redesign but provides active product status and full compliance certification (ROHS3, REACH unaffected, EAR99).

Through-Hole DIP Package Alternatives (No PCB Redesign Required):

The MCP602-E/P and MCP602-I/P are pin-compatible through-hole substitutes in 8-DIP format. Both maintain rail-to-rail output, dual-channel CMOS architecture, and compatible supply voltage ranges (2.7 V to 6 V). These devices exhibit lower slew rate (2.3 V/µs) and gain-bandwidth product (2.8 MHz) compared to the TLV2772AIP, with reduced output current capability (22 mA versus 50 mA per channel). The MCP602-E/P supports the full industrial temperature range (-40°C to 125°C), while MCP602-I/P is limited to -40°C to 85°C. Both are active products with ROHS3 compliance.

The MCP6282-E/P and MCP6285-E/P are general-purpose amplifiers in 8-DIP format with specifications intermediate between the TLV2772AIP and MCP602 series. These devices provide slew rate of 2.5 V/µs and gain-bandwidth product of 5 MHz, with output current of 25 mA per channel. Both support the full industrial temperature range (-40°C to 125°C) and are active products with ROHS3 compliance. The MCP6282-E/P and MCP6285-E/P exhibit higher input offset voltage (3 mV) and higher supply current (450 µA per channel) than the TLV2772AIP.

Selection Criteria by Application Requirements:

For applications requiring maximum slew rate and output current with through-hole mounting, no direct equivalent exists; TLV2772AIDR with PCB redesign to surface-mount is necessary. For applications tolerant of reduced slew rate and output current, MCP602-E/P provides the lowest power consumption (230 µA per channel) with full temperature range support. For applications requiring intermediate performance with full temperature range, MCP6282-E/P or MCP6285-E/P are suitable.

Frequently Asked Questions (FAQ)

Q: Can the TLV2772AIDR directly replace the TLV2772AIP without PCB modification?

A: No. The TLV2772AIDR uses 8-SOIC surface-mount packaging (0.154" width) while the TLV2772AIP uses 8-DIP through-hole packaging (0.300" width). Pin pitch and mounting technology differ. PCB redesign is required for this substitution.

Q: Are the MCP602-E/P and MCP602-I/P electrically identical?

A: The MCP602-E/P and MCP602-I/P share identical electrical specifications except for operating temperature range. The MCP602-E/P operates from -40°C to 125°C (industrial range), while MCP602-I/P operates from -40°C to 85°C. Select based on application temperature requirements.

Q: What is the primary performance difference between the TLV2772AIP and MCP602 series?

A: The TLV2772AIP provides higher slew rate (10.5 V/µs versus 2.3 V/µs) and higher output current per channel (50 mA versus 22 mA). The MCP602 series consumes significantly less supply current (230 µA per channel versus 1 mA per channel). Applications requiring fast transient response or high output current should retain the TLV2772AIP specifications or use TLV2772AIDR.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts (TLV2772AIDR, MCP602-E/P, MCP602-I/P, MCP6282-E/P, MCP6285-E/P) are ROHS3 compliant and REACH unaffected, matching the compliance status of the TLV2772AIP.

Q: Can MCP6282-E/P or MCP6285-E/P replace the TLV2772AIP in all applications?

A: MCP6282-E/P and MCP6285-E/P are functionally compatible in 8-DIP through-hole format with full industrial temperature range support. However, these devices exhibit higher input offset voltage (3 mV versus 500 µV) and higher supply current (450 µA per channel versus 1 mA per channel). Applications sensitive to input offset voltage or requiring minimum power consumption should evaluate performance impact.

Q: What is the inventory status of substitute parts?

A: TLV2772AIDR: 1320 pcs; MCP602-E/P: 4992 pcs; MCP602-I/P: 1500 pcs; MCP6282-E/P: 2180 pcs; MCP6285-E/P: 2600 pcs. All substitutes are in active production with available stock.

Q: Is the TLV2772AIP still in production?

A: No. The TLV2772AIP is designated Last Time Buy, indicating discontinued production. Existing inventory is limited to 1225 pcs. Transition to an active substitute part is recommended for new designs and long-term production support.