TLV2770IP Equivalent & Substitute Parts

Part Overview

The TLV2770IP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device features rail-to-rail output capability and is designed for low-power analog signal processing applications. The TLV2770IP is currently in Last Time Buy status, indicating that Texas Instruments has discontinued this product line. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this component.

Substiute Parts

TLV2770IP
Texas InstrumentsIn Stock: 785TLV2770IP Datasheet
TLV2770IP
Current Part
TLV9051SIDBVR
Texas InstrumentsIn Stock: 18301TLV9051SIDBVR Datasheet
TLV9051SIDBVR
MFR Recommended
MCP6283-E/P
Microchip TechnologyIn Stock: 2520MCP6283-E/P Datasheet
MCP6283-E/P
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 10.5 V/µs
Gain Bandwidth Product 5.1 MHz
Current - Input Bias 2 pA
Voltage - Input Offset 500 µV
Current - Supply 1 mA
Current - Output / Channel 50 mA
Voltage - Supply Span (Min) 2.5 V
Voltage - Supply Span (Max) 5.5 V
Operating Temperature -40 to 125 °C
Mounting Type Through Hole
Package / Case 8-DIP (0.300", 7.62mm)

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2770IP is determined by the following critical parameters:

Functional Compatibility Criteria:

  • Amplifier Type: General Purpose
  • Number of Circuits: 1
  • Output Type: Rail-to-Rail
  • Operating Temperature Range: -40°C to 125°C
  • Gain Bandwidth Product: 5 MHz or greater
  • Current - Output / Channel: 50 mA or greater

Electrical Compatibility Criteria:

  • Voltage - Supply Span (Min): 2.5 V or lower
  • Voltage - Supply Span (Max): 5.5 V or higher
  • Slew Rate: 10.5 V/µs or greater
  • Current - Input Bias: 2 pA or lower
  • Voltage - Input Offset: 500 µV or lower

Mechanical Compatibility Criteria:

  • Package / Case: 8-DIP (0.300", 7.62mm) for direct pin-compatible substitution
  • Mounting Type: Through Hole for PCB assembly compatibility

The substitute parts identified below meet the functional and electrical requirements for direct substitution. However, package differences require consideration based on application requirements and PCB layout constraints.

Parameter Comparison

Parameter TLV2770IP TLV9051SIDBVR MCP6283-E/P Unit
Manufacturer Texas Instruments Texas Instruments Microchip Technology
Product Status Last Time Buy Active Active
Amplifier Type General Purpose General Purpose General Purpose
Number of Circuits 1 1 1
Output Type Rail-to-Rail Rail-to-Rail Rail-to-Rail
Slew Rate 10.5 15 2.5 V/µs
Gain Bandwidth Product 5.1 5 5 MHz
Current - Input Bias 2 2 1 pA
Voltage - Input Offset 500 330 3000 µV
Current - Supply 1 0.33 0.45 mA
Current - Output / Channel 50 50 25 mA
Voltage - Supply Span (Min) 2.5 1.8 2.2 V
Voltage - Supply Span (Max) 5.5 5.5 6 V
Operating Temperature -40 to 125 -40 to 125 -40 to 125 °C
Mounting Type Through Hole Surface Mount Through Hole
Package / Case 8-DIP (0.300", 7.62mm) SOT-23-6 8-DIP (0.300", 7.62mm)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

TLV9051SIDBVR (Texas Instruments)

The TLV9051SIDBVR is an active product from Texas Instruments with superior electrical performance characteristics. This device exhibits higher slew rate (15 V/µs versus 10.5 V/µs), lower input offset voltage (330 µV versus 500 µV), and reduced supply current (330 µA versus 1 mA). The TLV9051SIDBVR operates across an extended supply voltage range (1.8 V to 5.5 V minimum), providing greater design flexibility for low-voltage applications.

The primary consideration for TLV9051SIDBVR substitution is the package format. This device is supplied in SOT-23-6 surface-mount packaging, requiring PCB redesign and assembly process modification from the through-hole 8-DIP format of the TLV2770IP. This substitution is suitable for new designs or applications where PCB layout can accommodate surface-mount technology.

MCP6283-E/P (Microchip Technology)

The MCP6283-E/P is an active product from Microchip Technology supplied in 8-DIP through-hole packaging, providing direct mechanical compatibility with the TLV2770IP. This device maintains the same package footprint and mounting type, enabling direct PCB substitution without layout modifications.

The MCP6283-E/P exhibits lower input bias current (1 pA versus 2 pA) and extended supply voltage range (2.2 V to 6 V). However, this device has reduced slew rate (2.5 V/µs versus 10.5 V/µs), lower output current capability (25 mA versus 50 mA), and significantly higher input offset voltage (3 mV versus 500 µV). The MCP6283-E/P is suitable for applications where slew rate and output current requirements are not critical and where through-hole package compatibility is essential.

Both substitute parts maintain compliance with ROHS3 and REACH regulatory requirements, matching the environmental standards of the TLV2770IP.

Frequently Asked Questions (FAQ)

Q: Can the TLV9051SIDBVR directly replace the TLV2770IP on existing PCBs?

A: No. The TLV9051SIDBVR uses SOT-23-6 surface-mount packaging, while the TLV2770IP uses 8-DIP through-hole packaging. Direct PCB substitution is not possible without redesigning the circuit board layout and modifying assembly processes. The TLV9051SIDBVR is suitable for new designs or applications undergoing PCB revision.

Q: Can the MCP6283-E/P directly replace the TLV2770IP on existing PCBs?

A: Yes. The MCP6283-E/P uses 8-DIP through-hole packaging identical to the TLV2770IP, enabling direct pin-compatible substitution on existing PCBs without layout modifications. However, verify that the reduced slew rate (2.5 V/µs) and lower output current (25 mA) meet application requirements.

Q: What are the key electrical differences between these substitute parts?

A: The TLV9051SIDBVR offers superior slew rate (15 V/µs) and lower input offset voltage (330 µV) compared to the TLV2770IP. The MCP6283-E/P provides lower input bias current (1 pA) but reduced slew rate (2.5 V/µs) and output current (25 mA). Selection depends on whether the application prioritizes slew rate, output current, or input offset voltage performance.

Q: Are all three devices compatible with the same supply voltage range?

A: The TLV2770IP operates from 2.5 V to 5.5 V. The TLV9051SIDBVR operates from 1.8 V to 5.5 V, supporting lower supply voltages. The MCP6283-E/P operates from 2.2 V to 6 V, supporting higher supply voltages. Verify that the substitute part's supply range encompasses the application's voltage requirements.

Q: Which substitute part is recommended for high-speed applications?

A: The TLV9051SIDBVR is recommended for applications requiring high slew rate performance, with 15 V/µs capability. The MCP6283-E/P, with 2.5 V/µs slew rate, is not suitable for high-speed signal processing. The TLV2770IP's 10.5 V/µs slew rate falls between these two options.

Q: Are there supply chain considerations for these substitute parts?

A: The TLV2770IP is in Last Time Buy status with 768 units in stock. The TLV9051SIDBVR is an active product with 18,200 units in stock, providing superior long-term availability. The MCP6283-E/P is an active product with 2,480 units in stock. For new designs, the TLV9051SIDBVR offers the most reliable long-term supply chain position.

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