TLV2770AIP Equivalent & Substitute Parts

Part Overview

The TLV2770AIP is a general-purpose operational amplifier manufactured by Texas Instruments, featuring rail-to-rail output capability in an 8-DIP through-hole package. This device is classified as Last Time Buy, indicating discontinued production with limited remaining inventory. The TLV2770AIP serves applications requiring single-channel amplification with low input bias current and moderate bandwidth in legacy through-hole designs.

Identification of substitute parts becomes necessary due to the Last Time Buy status of the TLV2770AIP. Alternative components with equivalent electrical performance and compatible functional specifications enable design continuity and long-term supply chain reliability.

Substiute Parts

TLV2770AIP
Texas InstrumentsIn Stock: 1034TLV2770AIP Datasheet
TLV2770AIP
Current Part
TLV9051SIDBVR
Texas InstrumentsIn Stock: 18301TLV9051SIDBVR Datasheet
TLV9051SIDBVR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 1
Output Type Rail-to-Rail
Slew Rate 10.5 V/µs
Gain Bandwidth Product 5.1 MHz
Current - Input Bias 2 pA
Voltage - Input Offset 500 µV
Current - Supply 1 mA
Current - Output / Channel 50 mA
Voltage - Supply Span (Min) 2.5 V
Voltage - Supply Span (Max) 5.5 V
Operating Temperature -40 to 125 °C
Package / Case 8-DIP (0.300", 7.62mm)
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the TLV2770AIP is evaluated based on the following critical parameters that define functional equivalence:

Electrical Performance Criteria:

  • Amplifier Type: General Purpose classification
  • Number of Circuits: Single-channel configuration
  • Output Type: Rail-to-Rail capability
  • Gain Bandwidth Product: Minimum 5 MHz
  • Input Bias Current: Maximum 2 pA
  • Supply Voltage Range: Minimum 2.5 V to 5.5 V maximum
  • Operating Temperature Range: -40°C to 125°C
  • Output Current Capability: Minimum 50 mA per channel

Compliance & Regulatory Criteria:

  • RoHS3 Compliance
  • REACH Unaffected status
  • ECCN classification: EAR99

The TLV9051SIDBVR meets all electrical performance requirements and regulatory compliance standards. While package and mounting type differ (SOT-23-6 surface mount versus 8-DIP through hole), the electrical specifications and functional characteristics enable substitution in applications where package form factor can be accommodated through design modification or board redesign.

Parameter Comparison

Parameter TLV2770AIP TLV9051SIDBVR Unit
Manufacturer Texas Instruments Texas Instruments
Amplifier Type General Purpose General Purpose
Number of Circuits 1 1
Output Type Rail-to-Rail Rail-to-Rail
Slew Rate 10.5 15 V/µs
Gain Bandwidth Product 5.1 5 MHz
Current - Input Bias 2 2 pA
Voltage - Input Offset 500 330 µV
Current - Supply 1 0.33 mA
Current - Output / Channel 50 50 mA
Voltage - Supply Span (Min) 2.5 1.8 V
Voltage - Supply Span (Max) 5.5 5.5 V
Operating Temperature -40 to 125 -40 to 125 °C
Product Status Last Time Buy Active
Package / Case 8-DIP (0.300", 7.62mm) SOT-23-6
Mounting Type Through Hole Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

TLV9051SIDBVR Selection Basis:

The TLV9051SIDBVR is designated as the manufacturer-recommended substitute for the TLV2770AIP based on the following factors:

  1. Product Status Alignment: The TLV9051SIDBVR maintains Active product status, ensuring continued availability and long-term supply chain support, contrasting with the Last Time Buy status of the TLV2770AIP.

  2. Electrical Equivalence: The TLV9051SIDBVR meets or exceeds all critical electrical specifications of the TLV2770AIP, including rail-to-rail output, single-channel configuration, input bias current, and output current capability. The substitute demonstrates improved performance in slew rate (15 V/µs versus 10.5 V/µs) and reduced input offset voltage (330 µV versus 500 µV).

  3. Supply Voltage Compatibility: The TLV9051SIDBVR operates across an extended minimum supply voltage range (1.8 V versus 2.5 V), providing greater flexibility in low-voltage applications while maintaining the 5.5 V maximum specification.

  4. Power Efficiency: The TLV9051SIDBVR exhibits reduced quiescent supply current (0.33 mA versus 1 mA), resulting in lower power consumption in battery-powered or energy-constrained applications.

  5. Regulatory Compliance: Both devices maintain ROHS3 compliance and REACH Unaffected status, ensuring compatibility with current environmental and regulatory requirements.

  6. Packaging Consideration: The transition from 8-DIP through-hole to SOT-23-6 surface-mount packaging requires PCB redesign. This substitution is appropriate for new designs or redesign initiatives but may not be suitable for direct board-level replacement without layout modification.

Frequently Asked Questions (FAQ)

Q: Can the TLV9051SIDBVR be used as a direct pin-for-pin replacement for the TLV2770AIP?

A: No. The TLV2770AIP uses 8-DIP through-hole packaging, while the TLV9051SIDBVR uses SOT-23-6 surface-mount packaging. Pin configurations and physical footprints differ significantly. Direct board-level substitution is not possible without PCB redesign and component placement modification.

Q: What are the key electrical differences between these two devices?

A: The TLV9051SIDBVR provides superior performance in three areas: slew rate (15 V/µs versus 10.5 V/µs), input offset voltage (330 µV versus 500 µV), and quiescent supply current (0.33 mA versus 1 mA). The gain bandwidth product remains comparable (5 MHz versus 5.1 MHz). Both devices maintain identical input bias current (2 pA) and output current capability (50 mA).

Q: Is the TLV9051SIDBVR suitable for applications requiring the 2.5 V minimum supply voltage of the TLV2770AIP?

A: The TLV9051SIDBVR operates at a lower minimum supply voltage (1.8 V), which is compatible with 2.5 V supply systems. Applications designed for 2.5 V operation will function with the TLV9051SIDBVR without modification to power supply specifications.

Q: What is the impact of the reduced supply current in the TLV9051SIDBVR?

A: The TLV9051SIDBVR consumes 0.33 mA quiescent current compared to 1 mA in the TLV2770AIP. This 67% reduction in supply current results in lower power dissipation and reduced thermal load, benefiting battery-powered applications and systems with stringent power budgets.

Q: Are both devices compliant with current environmental regulations?

A: Yes. Both the TLV2770AIP and TLV9051SIDBVR are ROHS3 compliant and REACH Unaffected, meeting current environmental and regulatory requirements for electronic components in most jurisdictions.

Q: What design considerations apply when transitioning from TLV2770AIP to TLV9051SIDBVR?

A: Primary considerations include PCB layout redesign for surface-mount SOT-23-6 packaging, trace routing for reduced parasitic inductance, and thermal management verification. The improved electrical performance of the TLV9051SIDBVR typically simplifies circuit design through reduced input offset voltage and enhanced slew rate, potentially reducing the need for precision trimming or compensation networks.

Q: Is the TLV9051SIDBVR available in higher inventory quantities?

A: Yes. The TLV9051SIDBVR maintains 18,200 pieces in active inventory, compared to 991 pieces for the TLV2770AIP. This inventory differential reflects the active product status of the TLV9051SIDBVR and supports long-term supply chain planning.

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