TLV2764IN Equivalent & Substitute Parts

Part Overview

The TLV2764IN is a general-purpose operational amplifier featuring four independent circuits in a 14-pin DIP package. This rail-to-rail output device is designed for low-power applications requiring minimal supply voltage (1.8V to 3.6V). The TLV2764IN is classified as Last Time Buy, indicating discontinued production. Identifying equivalent substitute parts is essential for design continuity, inventory management, and long-term product support.

Substiute Parts

TLV2764IN
Texas InstrumentsIn Stock: 4475TLV2764IN Datasheet
TLV2764IN
Current Part
TLV2764IDR
Texas InstrumentsIn Stock: 1501TLV2764IDR Datasheet
TLV2764IDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 4
Output Type Rail-to-Rail
Slew Rate 0.23 V/µs
Gain Bandwidth Product 500 kHz
Current - Input Bias 3 pA
Voltage - Input Offset 550 µV
Current - Supply (per 4 Channels) 20 µA
Current - Output / Channel 10.2 mA
Voltage - Supply Span (Min) 1.8 V
Voltage - Supply Span (Max) 3.6 V
Operating Temperature Range -40 to 85 °C
Package / Case 14-DIP (0.300", 7.62mm)
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the TLV2764IN is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

  • Amplifier Type: General Purpose
  • Number of Circuits: 4 independent channels
  • Output Type: Rail-to-Rail
  • Slew Rate: 0.23 V/µs
  • Gain Bandwidth Product: 500 kHz
  • Input Bias Current: 3 pA
  • Input Offset Voltage: 550 µV
  • Supply Current: 20 µA (x4 Channels)
  • Output Current per Channel: 10.2 mA
  • Supply Voltage Range: 1.8V to 3.6V
  • Operating Temperature: -40°C to 85°C

Mechanical Compatibility Criteria:

  • Pin count and pinout configuration
  • Package type (DIP vs. SOIC surface mount variants)
  • Physical dimensions and mounting method

The TLV2764IDR is the direct manufacturer-recommended substitute, maintaining identical electrical specifications while offering an alternative surface-mount package (14-SOIC) for modern PCB assembly processes.

Parameter Comparison

Parameter TLV2764IN (Main) TLV2764IDR (Substitute) Unit
Manufacturer Texas Instruments Texas Instruments
Base Product Number TLV2764 TLV2764
Amplifier Type General Purpose General Purpose
Number of Circuits 4 4
Output Type Rail-to-Rail Rail-to-Rail
Slew Rate 0.23 0.23 V/µs
Gain Bandwidth Product 500 500 kHz
Current - Input Bias 3 3 pA
Voltage - Input Offset 550 550 µV
Current - Supply (x4 Channels) 20 20 µA
Current - Output / Channel 10.2 10.2 mA
Voltage - Supply Span (Min) 1.8 1.8 V
Voltage - Supply Span (Max) 3.6 3.6 V
Operating Temperature -40 to 85 -40 to 85 °C
Package / Case 14-DIP (0.300", 7.62mm) 14-SOIC (0.154", 3.90mm Width)
Mounting Type Through Hole Surface Mount
Product Status Last Time Buy Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

Primary Substitute: TLV2764IDR

The TLV2764IDR is the manufacturer-recommended direct substitute for the TLV2764IN. Both devices share identical electrical specifications and are manufactured by Texas Instruments under the same base product number (TLV2764). The key distinction is packaging and mounting technology:

  • TLV2764IN: Through-hole 14-DIP package for traditional PCB assembly
  • TLV2764IDR: Surface-mount 14-SOIC package for modern automated assembly

The TLV2764IDR carries Active product status, ensuring continued availability and manufacturer support, whereas the TLV2764IN is Last Time Buy. Selection between these variants depends on PCB assembly capability and design requirements. Both devices maintain ROHS3 compliance and REACH unaffected status, meeting current environmental and regulatory standards.

Frequently Asked Questions (FAQ)

Q: Can the TLV2764IDR directly replace the TLV2764IN in existing designs?

A: Electrical substitution is complete. The TLV2764IDR maintains all electrical specifications of the TLV2764IN. However, physical replacement requires PCB redesign due to package differences: TLV2764IN uses through-hole 14-DIP mounting, while TLV2764IDR uses surface-mount 14-SOIC. Pinout configuration is identical, allowing schematic-level substitution with appropriate PCB layout modifications.

Q: What is the significance of the Last Time Buy status for TLV2764IN?

A: Last Time Buy indicates Texas Instruments has discontinued production of the TLV2764IN. Existing inventory will be depleted without replenishment. For new designs or long-term product support, the TLV2764IDR (Active status) is the recommended alternative.

Q: Are there any compliance differences between TLV2764IN and TLV2764IDR?

A: Both devices are ROHS3 compliant and REACH unaffected. Compliance certifications are equivalent. The TLV2764IDR includes MSL (Moisture Sensitivity Level) rating of 1 (Unlimited), indicating no moisture sensitivity restrictions for storage and handling.

Q: What are the key electrical parameters that define substitution compatibility?

A: Substitution is valid when the following parameters match: Amplifier Type (General Purpose), Number of Circuits (4), Output Type (Rail-to-Rail), Slew Rate (0.23 V/µs), Gain Bandwidth Product (500 kHz), Input Bias Current (3 pA), Input Offset Voltage (550 µV), Supply Current (20 µA for 4 channels), Output Current per Channel (10.2 mA), and Supply Voltage Range (1.8V to 3.6V). Operating temperature range (-40°C to 85°C) must also be maintained.

Q: Can the TLV2764IN be used in new product designs?

A: No. The Last Time Buy status indicates production discontinuation. New designs should specify the TLV2764IDR to ensure long-term component availability and manufacturer support.

Request Quote (Ships tomorrow)