TLV2762IP Equivalent & Substitute Parts

Part Overview

The TLV2762IP is a general-purpose operational amplifier featuring dual circuits with rail-to-rail output capability in an 8-pin DIP package. This device is designed for low-power applications requiring precision amplification across a supply voltage range of 1.8V to 3.6V. The TLV2762IP is classified as obsolete, necessitating identification of functionally equivalent alternatives for new designs and ongoing production requirements. Substitute parts must maintain electrical performance specifications while accommodating modern packaging and availability constraints.

Substiute Parts

TLV2762IP

Texas InstrumentsIn Stock: 1043TLV2762IP Datasheet

Current PartRFQ

TLV2762IDR

Texas InstrumentsIn Stock: 17247TLV2762IDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2762IP is determined by equivalence across the following critical parameters:

• Amplifier Type & Circuit Count: Both main and substitute parts must be general-purpose dual-circuit operational amplifiers
• Output Configuration: Rail-to-rail output capability is required
• Electrical Performance: Slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, and output current must match specified values
• Supply Voltage Range: Operating range of 1.8V to 3.6V must be maintained
• Temperature Range: Operating temperature specification of -40°C to 85°C must be supported
• Compliance & Certifications: RoHS3 compliance and MSL Level 1 rating must be retained

The primary distinction between the main part and its substitute relates to packaging format and product status. The TLV2762IP utilizes through-hole 8-DIP packaging and is obsolete. The substitute part maintains identical electrical specifications while offering surface-mount 8-SOIC packaging and active product status.

Parameter Comparison

Engineering Selection Recommendations

The TLV2762IDR serves as the direct electrical equivalent to the TLV2762IP with identical performance specifications across all functional parameters. Selection between these parts is determined by application requirements and design constraints:

For New Designs: The TLV2762IDR is the appropriate selection. This part carries active product status from Texas Instruments, ensuring long-term availability and supply chain stability. The surface-mount 8-SOIC package aligns with contemporary PCB assembly practices and reduces board footprint requirements.

For Legacy System Maintenance: The TLV2762IP remains available in current inventory (988 units) despite obsolete classification. Through-hole 8-DIP packaging may be necessary for retrofit applications or systems utilizing through-hole assembly methods. However, transition to the TLV2762IDR is recommended for future production runs.

Compliance Considerations: Both parts maintain ROHS3 compliance and MSL Level 1 rating, satisfying environmental and reliability requirements for industrial and commercial applications. No compliance trade-offs exist between the two options.

Supply Chain: The TLV2762IDR demonstrates significantly higher inventory availability (17,225 units) compared to the obsolete TLV2762IP, supporting production scalability and reducing procurement lead times.

Frequently Asked Questions (FAQ)

Q: Can the TLV2762IDR directly replace the TLV2762IP in existing PCB designs?

A: Electrical substitution is complete. However, PCB layout modification is required due to packaging differences. The TLV2762IP uses through-hole 8-DIP mounting, while the TLV2762IDR uses surface-mount 8-SOIC. Pin-to-pin electrical functionality is identical, but physical footprints differ. Existing through-hole designs require PCB redesign for surface-mount implementation.

Q: Are there any performance differences between these parts?

A: No. All electrical specifications are identical: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current, and operating temperature range match exactly. Functional performance in circuit applications is equivalent.

Q: What is the significance of the product status difference?

A: The TLV2762IP is classified as obsolete, indicating Texas Instruments has discontinued active production and support. The TLV2762IDR maintains active status, ensuring continued availability, technical support, and supply chain reliability. For production applications, active-status parts are preferred.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the TLV2762IP and TLV2762IDR are ROHS3 compliant and carry MSL Level 1 (Unlimited) moisture sensitivity rating. No compliance differences exist between the two parts.

Q: Which part should be specified for new product development?

A: The TLV2762IDR should be specified for new designs. Active product status, higher inventory availability, and surface-mount packaging alignment with modern manufacturing practices make this the appropriate choice for ongoing production and future scalability.

Q: Are pin assignments identical between the two packages?

A: Yes. Both parts use 8-pin configurations with identical pin assignments. The difference is physical form factor: 8-DIP (through-hole) versus 8-SOIC (surface-mount). Electrical connectivity and signal routing are equivalent.

Q: What inventory considerations apply to these parts?

A: The TLV2762IP has 988 units in stock but is obsolete. The TLV2762IDR has 17,225 units in stock and active status. For production planning, the TLV2762IDR offers superior supply security and availability.