TLV2761IP Equivalent & Substitute Parts

Part Overview

The TLV2761IP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-DIP through-hole package. This device features rail-to-rail output capability and operates across a supply voltage range of 1.8 V to 3.6 V, making it suitable for low-power analog signal processing applications. The TLV2761IP is currently classified as Last Time Buy, indicating discontinued production. Identifying equivalent substitute parts is necessary to maintain design continuity and ensure component availability for new production runs and field replacements.

Substiute Parts

TLV2761IP

Texas InstrumentsIn Stock: 2173TLV2761IP Datasheet

Current PartRFQ

TLV2761IDBVR

Texas InstrumentsIn Stock: 7306TLV2761IDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2761IP is determined by electrical parameter equivalence and functional compatibility. The critical parameters that define substitutability are:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.23 V/µs
• Gain Bandwidth Product: 500 kHz
• Current - Input Bias: 3 pA
• Voltage - Input Offset: 550 µV
• Current - Supply: 20 µA
• Current - Output / Channel: 10.2 mA
• Voltage - Supply Span: 1.8 V to 3.6 V
• Operating Temperature Range: -40°C to 85°C
• RoHS Compliance: ROHS3 Compliant

The TLV2761IDBVR shares identical electrical specifications with the TLV2761IP. The primary difference is the packaging format: the TLV2761IP uses through-hole 8-DIP mounting, while the TLV2761IDBVR uses surface-mount SOT-23-5 packaging. Both parts are derived from the same base product number (TLV2761) and maintain full electrical equivalence.

Parameter Comparison

Engineering Selection Recommendations

The TLV2761IDBVR is the direct electrical equivalent to the TLV2761IP. Selection between these parts depends on circuit board design requirements:

TLV2761IP (8-DIP Through-Hole): Select this package for through-hole PCB designs, breadboard prototyping, or applications requiring manual insertion assembly. This part is Last Time Buy status, indicating limited future availability.

TLV2761IDBVR (SOT-23-5 Surface Mount): Select this package for surface-mount PCB designs and automated assembly processes. This part maintains Active product status, ensuring continued availability and supply chain stability.

Both parts carry ROHS3 compliance and REACH Unaffected status, meeting environmental and regulatory requirements. The choice between these substitutes is driven by PCB assembly methodology and design constraints rather than electrical performance differences.

Frequently Asked Questions (FAQ)

Q: Can TLV2761IDBVR replace TLV2761IP in existing designs?

A: Electrical replacement is complete. The TLV2761IDBVR provides identical electrical performance. However, PCB layout modification is required due to package format differences: TLV2761IP uses through-hole 8-DIP mounting while TLV2761IDBVR uses surface-mount SOT-23-5 packaging.

Q: What are the key electrical parameters that must match for substitution?

A: The critical matching parameters are: amplifier type (General Purpose), number of circuits (1), output type (Rail-to-Rail), slew rate (0.23 V/µs), gain bandwidth product (500 kHz), input bias current (3 pA), input offset voltage (550 µV), supply current (20 µA), output current per channel (10.2 mA), and supply voltage range (1.8 V to 3.6 V).

Q: Why is TLV2761IP classified as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this part number. The TLV2761IDBVR surface-mount variant remains in active production and is the recommended path for new designs.

Q: Are there any compliance differences between these parts?

A: Both parts are ROHS3 compliant and REACH Unaffected. Compliance status is identical between TLV2761IP and TLV2761IDBVR.

Q: What is the operating temperature range for both parts?

A: Both the TLV2761IP and TLV2761IDBVR operate across -40°C to 85°C, providing identical thermal performance specifications.