TLV2761CD Equivalent & Substitute Parts

Part Overview

The TLV2761CD is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail applications in low-voltage environments. This device integrates a single amplifier circuit in an 8-SOIC surface-mount package and operates across a supply voltage range of 1.8 V to 3.6 V. The TLV2761CD is classified as Last Time Buy, indicating discontinued production. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for applications utilizing this amplifier topology.

Substiute Parts

TLV2761CD

Texas InstrumentsIn Stock: 2223TLV2761CD Datasheet

Current PartRFQ

TLV2761IDBVR

Texas InstrumentsIn Stock: 7306TLV2761IDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2761CD is determined by electrical and mechanical parameter equivalence within the TLV2761 base product family. The primary substitute identified is the TLV2761IDBVR, which shares identical electrical specifications across all critical performance parameters: slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range. Both devices implement the same general-purpose amplifier topology with rail-to-rail output characteristics.

The key differentiator between the TLV2761CD and TLV2761IDBVR is the package format and operating temperature range. The TLV2761CD utilizes an 8-SOIC package with an operating temperature range of 0°C to 70°C, while the TLV2761IDBVR employs a SOT-23-5 package with an extended operating temperature range of −40°C to 85°C. Both devices maintain identical electrical performance specifications and comply with ROHS3 and REACH requirements.

Substitution is valid when the application requirements align with the following parameters:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.23 V/µs
• Gain Bandwidth Product: 500 kHz
• Supply Voltage Range: 1.8 V to 3.6 V
• Input Bias Current: 3 pA
• Input Offset Voltage: 550 µV

Parameter Comparison

Engineering Selection Recommendations

The TLV2761IDBVR serves as the primary substitute for the TLV2761CD based on electrical parameter equivalence and active product status. The TLV2761CD is designated Last Time Buy, indicating that Texas Instruments has discontinued production and existing inventory will be depleted. The TLV2761IDBVR maintains identical electrical performance specifications and compliance certifications (ROHS3 Compliant, REACH Unaffected, MSL 1).

Selection of the TLV2761IDBVR requires consideration of package compatibility. The substitute employs a SOT-23-5 package format, which differs from the 8-SOIC package of the main part. PCB layout modifications are necessary to accommodate the different package geometry and pin configuration. The TLV2761IDBVR offers an extended operating temperature range (−40°C to 85°C) compared to the TLV2761CD (0°C to 70°C), providing broader environmental operating capability.

Both devices are manufactured by Texas Instruments and share the same base product number (TLV2761), ensuring design continuity and functional compatibility within the TLV2761 product family. The substitute part is currently in Active product status with higher inventory availability (7240 Pcs), supporting long-term supply chain stability.

Frequently Asked Questions (FAQ)

Q: Can the TLV2761IDBVR directly replace the TLV2761CD without circuit modifications?

A: The TLV2761IDBVR provides electrical equivalence to the TLV2761CD across all specified performance parameters. However, direct replacement requires PCB layout modifications due to package format differences. The TLV2761CD uses an 8-SOIC package, while the TLV2761IDBVR uses a SOT-23-5 package. Pin assignments and physical dimensions differ, necessitating schematic and layout redesign.

Q: What are the key electrical differences between these parts?

A: There are no electrical differences between the TLV2761CD and TLV2761IDBVR. Both devices share identical specifications for slew rate (0.23 V/µs), gain bandwidth product (500 kHz), input bias current (3 pA), input offset voltage (550 µV), supply current (20 µA), output current (10.2 mA), and supply voltage range (1.8 V to 3.6 V).

Q: Why is the operating temperature range different?

A: The TLV2761IDBVR features an extended operating temperature range (−40°C to 85°C) compared to the TLV2761CD (0°C to 70°C). This difference reflects the design specifications for each package variant. Applications requiring operation below 0°C or above 70°C must use the TLV2761IDBVR.

Q: Are both parts RoHS compliant?

A: Yes, both the TLV2761CD and TLV2761IDBVR are ROHS3 Compliant and REACH Unaffected. Both devices carry Moisture Sensitivity Level 1 (Unlimited), indicating no moisture sensitivity constraints during storage and handling.

Q: What is the significance of the Last Time Buy status for the TLV2761CD?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of the TLV2761CD. Existing inventory will be depleted, and the part will no longer be available for new orders after current stock is exhausted. The TLV2761IDBVR, with Active product status, represents the recommended path forward for ongoing design requirements.

Q: Can I use the TLV2761IDBVR in applications currently using the TLV2761CD?

A: Electrical substitution is valid for applications where the operating temperature range of −40°C to 85°C is compatible with system requirements. PCB redesign is required to accommodate the SOT-23-5 package format. Once layout modifications are completed and validated, the TLV2761IDBVR provides equivalent performance to the TLV2761CD.

Q: What packaging formats are available for the TLV2761 family?

A: The TLV2761CD is supplied in Tube packaging with 8-SOIC package format. The TLV2761IDBVR is supplied in Cut Tape (CT) and Digi-Reel® packaging with SOT-23-5 package format. Both are surface-mount devices suitable for automated assembly processes.