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TLV2760IP Equivalent & Substitute Parts
Part Overview
The TLV2760IP is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal processing applications. This device features a single amplifier circuit in an 8-DIP through-hole package with a supply voltage range of 1.8V to 3.6V, making it suitable for low-power analog signal conditioning and processing tasks.
The TLV2760IP is designated as Last Time Buy, indicating that Texas Instruments has discontinued this product line. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure supply chain reliability, and support ongoing production requirements for applications currently utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 1 | — |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 0.23 | V/µs |
| Gain Bandwidth Product | 500 | kHz |
| Current - Input Bias | 3 | pA |
| Voltage - Input Offset | 550 | µV |
| Current - Supply | 20 | µA |
| Current - Output / Channel | 10.2 | mA |
| Voltage - Supply Span (Min) | 1.8 | V |
| Voltage - Supply Span (Max) | 3.6 | V |
| Operating Temperature Range | -40 to 85 | °C |
| Mounting Type | Through Hole | — |
| Package / Case | 8-DIP (0.300", 7.62mm) | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution of the TLV2760IP is determined by electrical and mechanical parameter equivalence within the general-purpose operational amplifier category. The critical parameters that define substitutability are:
Electrical Equivalence Criteria:
- Amplifier Type: General Purpose
- Number of Circuits: 1
- Output Type: Rail-to-Rail
- Slew Rate: 0.23 V/µs
- Gain Bandwidth Product: 500 kHz
- Current - Input Bias: 3 pA
- Voltage - Input Offset: 550 µV
- Current - Supply: 20 µA
- Current - Output / Channel: 10.2 mA
- Voltage - Supply Span: 1.8V to 3.6V
- Operating Temperature Range: -40°C to 85°C
Mechanical Compatibility Criteria:
- Mounting Type: Through Hole or Surface Mount (with PCB design adaptation)
- Package / Case: 8-DIP or equivalent pin-count packages
- Pin configuration must support identical signal routing
The TLV2760IDBVR is identified as the manufacturer-recommended substitute. This part maintains all electrical specifications while offering a surface-mount SOT-23-6 package alternative to the through-hole 8-DIP configuration.
Parameter Comparison
| Parameter | TLV2760IP (8-DIP) | TLV2760IDBVR (SOT-23-6) | Match Status |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Identical |
| Amplifier Type | General Purpose | General Purpose | Identical |
| Number of Circuits | 1 | 1 | Identical |
| Output Type | Rail-to-Rail | Rail-to-Rail | Identical |
| Slew Rate (V/µs) | 0.23 | 0.23 | Identical |
| Gain Bandwidth Product (kHz) | 500 | 500 | Identical |
| Current - Input Bias (pA) | 3 | 3 | Identical |
| Voltage - Input Offset (µV) | 550 | 550 | Identical |
| Current - Supply (µA) | 20 | 20 | Identical |
| Current - Output / Channel (mA) | 10.2 | 10.2 | Identical |
| Voltage - Supply Span Min (V) | 1.8 | 1.8 | Identical |
| Voltage - Supply Span Max (V) | 3.6 | 3.6 | Identical |
| Operating Temperature (°C) | -40 to 85 | -40 to 85 | Identical |
| Mounting Type | Through Hole | Surface Mount | Different |
| Package / Case | 8-DIP (0.300", 7.62mm) | SOT-23-6 | Different |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Product Status | Last Time Buy | Active | Different |
Engineering Selection Recommendations
Primary Substitute: TLV2760IDBVR
The TLV2760IDBVR is the direct electrical equivalent of the TLV2760IP and is the manufacturer-recommended substitute. This part maintains complete electrical specification parity across all operational parameters, including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, output current capability, and supply voltage range.
The key distinction between these parts is packaging and product status:
- TLV2760IP: Through-hole 8-DIP package, Last Time Buy status
- TLV2760IDBVR: Surface-mount SOT-23-6 package, Active product status
Selection between these parts depends on PCB design requirements:
Use TLV2760IDBVR when:
- Designing new PCBs or revising existing designs
- Surface-mount assembly processes are available
- Space constraints favor compact packaging
- Long-term supply continuity is required (Active product status)
Use TLV2760IP when:
- Existing through-hole PCB designs cannot be modified
- Through-hole assembly equipment is the only available manufacturing process
- Inventory of Last Time Buy stock is available and sufficient for production requirements
Both parts carry ROHS3 compliance and REACH Unaffected status, ensuring regulatory alignment for industrial and commercial applications.
Frequently Asked Questions (FAQ)
Q: Can the TLV2760IDBVR directly replace the TLV2760IP in existing designs?
A: Electrical substitution is complete. However, PCB layout modification is required due to package differences. The TLV2760IP uses an 8-DIP through-hole package, while the TLV2760IDBVR uses a SOT-23-6 surface-mount package. Pin-to-pin electrical functionality is identical, but physical footprint and assembly method differ.
Q: What is the significance of the Last Time Buy status for the TLV2760IP?
A: Last Time Buy designation indicates that Texas Instruments has discontinued production of the TLV2760IP. Existing inventory may be available from authorized distributors, but no new manufacturing runs are planned. For applications requiring long-term supply security, migration to the TLV2760IDBVR (Active status) is recommended.
Q: Are the electrical specifications identical between TLV2760IP and TLV2760IDBVR?
A: Yes. All electrical parameters are identical: slew rate (0.23 V/µs), gain bandwidth product (500 kHz), input bias current (3 pA), input offset voltage (550 µV), supply current (20 µA), output current (10.2 mA), and supply voltage range (1.8V to 3.6V). Operating temperature range is also identical (-40°C to 85°C).
Q: What are the package differences between these parts?
A: The TLV2760IP is packaged in an 8-DIP (0.300", 7.62mm) through-hole configuration. The TLV2760IDBVR is packaged in SOT-23-6 surface-mount configuration. Both packages contain the same single-circuit general-purpose amplifier with rail-to-rail output capability.
Q: Are both parts RoHS compliant?
A: Yes. Both the TLV2760IP and TLV2760IDBVR are ROHS3 Compliant and REACH Unaffected, meeting environmental and regulatory requirements for industrial and commercial applications.
Q: What is the moisture sensitivity level for these parts?
A: The TLV2760IP has MSL Not Applicable. The TLV2760IDBVR has MSL 1 (Unlimited), indicating minimal moisture sensitivity and standard handling requirements for surface-mount components.
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