TLV2760ID Equivalent & Substitute Parts

Part Overview

The TLV2760ID is a general-purpose operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal processing applications. This device integrates a single amplifier circuit in an 8-SOIC surface-mount package with a supply voltage range of 1.8 V to 3.6 V, making it suitable for low-power analog signal conditioning and processing tasks.

The TLV2760ID carries a Last Time Buy product status, indicating that this specific packaging configuration is being discontinued. Identifying equivalent substitute parts ensures design continuity and supply chain reliability for applications currently utilizing this component.

Substiute Parts

TLV2760ID

Texas InstrumentsIn Stock: 999239TLV2760ID Datasheet

Current PartRFQ

TLV2760IDBVR

Texas InstrumentsIn Stock: 1486TLV2760IDBVR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2760ID is determined by electrical and mechanical compatibility across the following critical parameters:

Electrical Compatibility Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.23 V/µs
• Gain Bandwidth Product: 500 kHz
• Current - Input Bias: 3 pA
• Voltage - Input Offset: 550 µV
• Current - Supply: 20 µA
• Current - Output / Channel: 10.2 mA
• Voltage - Supply Span: 1.8 V to 3.6 V
• Operating Temperature Range: -40°C to 85°C

Mechanical Compatibility Criteria:

• Mounting Type: Surface Mount
• Package / Case: 8-SOIC or alternative surface-mount packages

Regulatory Compliance:

• RoHS3 Compliant
• REACH Unaffected
• MSL Level 1 (Unlimited)

The TLV2760IDBVR is identified as a manufacturer-recommended substitute. While this part maintains identical electrical specifications, it differs in packaging configuration (SOT-23-6 versus 8-SOIC) and product status (Active versus Last Time Buy). This substitution is valid for applications where the alternative package footprint can be accommodated in the circuit design.

Parameter Comparison

Engineering Selection Recommendations

For Continued Use of TLV2760ID (8-SOIC Package):

The TLV2760ID remains suitable for applications where the 8-SOIC package footprint is already established in the circuit design. However, given the Last Time Buy status, inventory procurement should be evaluated against long-term supply availability. Current inventory of 999,200 pieces provides near-term supply security.

For Migration to TLV2760IDBVR (SOT-23-6 Package):

The TLV2760IDBVR is the manufacturer-recommended substitute and carries Active product status, ensuring long-term availability and supply continuity. This part maintains all electrical specifications identical to the TLV2760ID. Selection of this substitute requires circuit board redesign to accommodate the SOT-23-6 package footprint, which is smaller than the 8-SOIC package.

Both parts satisfy identical regulatory requirements: ROHS3 compliance, REACH unaffected status, and MSL Level 1 (Unlimited) moisture sensitivity classification. Both are suitable for applications requiring operation across the -40°C to 85°C temperature range with supply voltages between 1.8 V and 3.6 V.

Frequently Asked Questions (FAQ)

Q: What is the primary difference between TLV2760ID and TLV2760IDBVR?

A: The primary difference is the package configuration. The TLV2760ID uses an 8-SOIC package, while the TLV2760IDBVR uses a SOT-23-6 package. All electrical specifications are identical. The TLV2760IDBVR also differs in product status (Active versus Last Time Buy) and packaging format (Tape & Reel versus Tube).

Q: Can I directly replace TLV2760ID with TLV2760IDBVR on my circuit board?

A: Direct replacement requires circuit board redesign. The SOT-23-6 package has a different pin configuration and physical footprint than the 8-SOIC package. Pin-to-pin compatibility must be verified against the respective datasheets, and the PCB layout must be modified to accommodate the new package dimensions.

Q: Are the electrical specifications identical between these two parts?

A: Yes. Both parts share the same base product number (TLV2760) and maintain identical electrical specifications: 0.23 V/µs slew rate, 500 kHz gain bandwidth product, 3 pA input bias current, 550 µV input offset voltage, 20 µA supply current, 10.2 mA output current per channel, and 1.8 V to 3.6 V supply voltage range.

Q: Why is TLV2760ID marked as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments is discontinuing this specific packaging configuration. Customers are advised to transition to alternative packages, such as the SOT-23-6 variant (TLV2760IDBVR), to ensure long-term supply availability.

Q: Do both parts meet the same regulatory compliance standards?

A: Yes. Both TLV2760ID and TLV2760IDBVR are ROHS3 compliant, REACH unaffected, and classified as MSL Level 1 (Unlimited) for moisture sensitivity. Both operate across the -40°C to 85°C temperature range.

Q: What is the difference between Tube and Tape & Reel packaging formats?

A: Tube packaging is used for manual handling and smaller-volume applications, while Tape & Reel (TR) packaging is designed for automated assembly processes and higher-volume production. The TLV2760IDBVR in Tape & Reel format is optimized for high-speed pick-and-place manufacturing equipment.

Q: Can I use TLV2760IDBVR in applications currently designed for TLV2760ID?

A: Electrical compatibility is confirmed. However, mechanical compatibility requires verification of the circuit board layout and pin assignments. The SOT-23-6 package is physically smaller and has a different pin arrangement than the 8-SOIC package, necessitating PCB redesign and validation.