TLV2624IDRG4 Equivalent & Substitute Parts

Part Overview

The TLV2624IDRG4 is a CMOS rail-to-rail operational amplifier featuring four independent circuits in a 14-SOIC surface mount package. Manufactured by Texas Instruments, this device is designed for general-purpose amplification applications requiring low power consumption and wide supply voltage compatibility. The part is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives that maintain electrical and mechanical compatibility with existing designs.

Substiute Parts

TLV2624IDRG4

Texas InstrumentsIn Stock: 888TLV2624IDRG4 Datasheet

Current PartRFQ

LMV824IYDT

STMicroelectronicsIn Stock: 97870LMV824IYDT Datasheet

MFR RecommendedRFQ

MCP6024T-E/SL

Microchip TechnologyIn Stock: 14640MCP6024T-E/SL Datasheet

MFR RecommendedRFQ

MCP6294-E/SL

Microchip TechnologyIn Stock: 12964MCP6294-E/SL Datasheet

MFR RecommendedRFQ

MCP6294T-E/SL

Microchip TechnologyIn Stock: 12759MCP6294T-E/SL Datasheet

MFR RecommendedRFQ

MCP6L94T-E/SL

Microchip TechnologyIn Stock: 12407MCP6L94T-E/SL Datasheet

MFR RecommendedRFQ

TSV994AIDT

STMicroelectronicsIn Stock: 55341TSV994AIDT Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2624IDRG4 is determined by strict alignment of the following electrical and mechanical parameters:

Critical Matching Parameters:

• Number of circuits: 4 independent amplifier channels
• Package type: 14-SOIC surface mount form factor (0.154" width, 3.90mm)
• Output configuration: Rail-to-rail output capability
• Supply voltage range: Minimum 2.5V to 2.7V; Maximum 5.5V to 6V
• Operating temperature range: -40°C to 125°C
• Pin-to-pin compatibility: 14-pin SOIC footprint

Performance Parameters Considered:

• Slew rate: 7V/µs baseline
• Gain bandwidth product: 10-11 MHz range
• Input bias current: 1-2 pA (CMOS-level performance)
• Input offset voltage: 250µV to 3mV
• Supply current: 800µA to 1mA per channel set
• Output current per channel: 25-30mA

All identified substitute parts maintain the 14-SOIC package footprint and operate within the specified supply voltage and temperature ranges. Electrical performance parameters fall within acceptable tolerance bands for general-purpose amplification applications.

Parameter Comparison

Engineering Selection Recommendations

Primary Substitutes (Closest Electrical Match):

MCP6024T-E/SL and MCP6294T-E/SL provide the most direct substitution path. Both devices maintain identical slew rate (7V/µs) and gain bandwidth product (10MHz) specifications to the TLV2624IDRG4. The MCP6024T-E/SL operates at lower supply current (1mA total) compared to the original part (800µA), while the MCP6294T-E/SL extends the maximum supply voltage to 6V. Both are manufactured by Microchip Technology and carry active product status with full RoHS3 compliance.

MCP6L94T-E/SL offers superior input offset voltage performance (1mV) and maintains electrical compatibility across all critical parameters. This device is recommended for applications requiring tighter offset voltage specifications.

Secondary Substitutes (Enhanced Performance):

TSV994AIDT (STMicroelectronics) provides enhanced slew rate (10V/µs) and gain bandwidth product (20MHz) with automotive-grade qualification (AEC-Q100). This device is suitable for applications requiring higher bandwidth performance while maintaining the 14-SOIC package footprint and rail-to-rail output capability.

LMV824IYDT (STMicroelectronics) offers the lowest supply current consumption (300µA total) and includes automotive-grade qualification. However, this device exhibits reduced slew rate (1.9V/µs) and lower gain bandwidth product (5.5MHz), making it suitable only for applications where power consumption is the primary design constraint and bandwidth requirements are relaxed.

All substitute parts are currently in active production status with established supply chain availability. Selection should be based on specific application requirements for bandwidth, power consumption, and offset voltage performance within the constraints of the 14-SOIC package footprint.

Frequently Asked Questions (FAQ)

Q: Can the TLV2624IDRG4 be directly replaced with any of these substitute parts without PCB modification?

A: Yes. All substitute parts listed maintain the 14-SOIC (0.154", 3.90mm width) surface mount package with identical pin configuration. Direct footprint compatibility is confirmed. No PCB layout changes are required for mechanical substitution.

Q: What is the primary reason for identifying substitute parts for the TLV2624IDRG4?

A: The TLV2624IDRG4 is discontinued at DiGi Electronics. Substitute parts are identified to maintain design continuity and ensure component availability for production and repair applications.

Q: Which substitute part most closely matches the original TLV2624IDRG4 electrical performance?

A: MCP6024T-E/SL and MCP6294T-E/SL provide the closest electrical match, maintaining the 7V/µs slew rate and 10MHz gain bandwidth product. Both devices operate within the same supply voltage and temperature ranges as the original part.

Q: Are there performance trade-offs when substituting the TLV2624IDRG4?

A: Performance trade-offs depend on the selected substitute. LMV824IYDT reduces supply current but decreases slew rate and bandwidth. TSV994AIDT increases bandwidth and slew rate but operates at higher supply current. MCP6024T-E/SL and MCP6294T-E/SL maintain equivalent performance with minimal trade-offs.

Q: Do all substitute parts meet RoHS3 compliance requirements?

A: Yes. All substitute parts listed carry RoHS3 compliance certification, matching the environmental compliance status of the original TLV2624IDRG4.

Q: What is the difference between MCP6294-E/SL and MCP6294T-E/SL?

A: Both parts are electrically identical. The primary difference is packaging format: MCP6294-E/SL is supplied in Tube packaging, while MCP6294T-E/SL is supplied in Cut Tape (CT) & Digi-Reel® format. Selection depends on procurement and assembly requirements.

Q: Can TSV994AIDT be used in applications where the original TLV2624IDRG4 was specified?

A: TSV994AIDT is electrically compatible and maintains the 14-SOIC package footprint. However, the enhanced bandwidth (20MHz) and slew rate (10V/µs) may introduce different circuit behavior in bandwidth-sensitive applications. Verification of circuit performance is necessary when upgrading to higher-bandwidth devices.

Q: What is the moisture sensitivity level (MSL) for all substitute parts?

A: All substitute parts, including the original TLV2624IDRG4, carry MSL 1 (Unlimited) classification, indicating no moisture sensitivity constraints during storage and handling.

Q: Are automotive-grade versions available among the substitute parts?

A: Yes. LMV824IYDT and TSV994AIDT both carry automotive-grade qualification (AEC-Q100), suitable for automotive and high-reliability applications. Standard industrial-grade versions are available from Microchip Technology (MCP6024T-E/SL, MCP6294-E/SL, MCP6294T-E/SL, MCP6L94T-E/SL).