TLV2548IDWR Equivalent & Substitute Parts

Part Overview

The TLV2548IDWR is a 12-bit Analog to Digital Converter (ADC) manufactured by Texas Instruments, designed for data acquisition applications requiring 8 single-ended inputs with a 200 kSPS sampling rate. The device features a Successive Approximation Register (SAR) architecture with integrated multiplexer and sample-and-hold functionality, housed in a 20-SOIC surface mount package.

This part has reached Last Time Buy status, making identification of functionally equivalent alternatives essential for ongoing design support and production continuity. The TLV2548IDWR operates across a wide supply voltage range of 2.7V to 5.5V for both analog and digital domains, with an extended operating temperature range of -40°C to 85°C.

Substiute Parts

TLV2548IDWR
Texas InstrumentsIn Stock: 2404TLV2548IDWR Datasheet
TLV2548IDWR
Current Part
ADS7038IRTER
Texas InstrumentsIn Stock: 12251ADS7038IRTER Datasheet
ADS7038IRTER
MFR Recommended

Key Parameters

Parameter Value
Resolution 12 Bits
Number of Inputs 8
Input Type Single Ended
Sampling Rate 200 kSPS
Architecture SAR
Data Interface SPI, DSP
Configuration MUX-S/H-ADC
Analog Supply Voltage 2.7V ~ 5.5V
Digital Supply Voltage 2.7V ~ 5.5V
Operating Temperature -40°C ~ 85°C
Package 20-SOIC
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the TLV2548IDWR is determined by the following critical parameters:

  • Resolution and Input Count: Both the main part and substitute must maintain 12-bit resolution with 8 single-ended inputs to preserve signal acquisition capability.
  • Architecture: SAR architecture is required to maintain conversion methodology and timing characteristics.
  • Data Interface Compatibility: The substitute must support SPI protocol as a minimum to ensure digital communication compatibility.
  • Supply Voltage Compatibility: The substitute must operate within overlapping voltage ranges to function in existing power distribution designs.
  • Operating Temperature Range: The substitute must support the required temperature envelope for the application.
  • Compliance and Certification: RoHS3 compliance and REACH unaffected status ensure regulatory alignment.

The ADS7038IRTER qualifies as a manufacturer-recommended substitute based on these criteria, despite differences in package type, sampling rate, and additional integrated features.

Parameter Comparison

Parameter TLV2548IDWR ADS7038IRTER
Manufacturer Texas Instruments Texas Instruments
Resolution 12 Bits 12 Bits
Number of Inputs 8 8
Input Type Single Ended Single Ended
Sampling Rate 200 kSPS 1 MSPS
Architecture SAR SAR
Data Interface SPI, DSP SPI
Number of A/D Converters 1 1
Analog Supply Voltage 2.7V ~ 5.5V 2.35V ~ 5.5V
Digital Supply Voltage 2.7V ~ 5.5V 1.65V ~ 5.5V
Operating Temperature -40°C ~ 85°C -40°C ~ 125°C
Package / Case 20-SOIC 16-WQFN (3x3)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
Product Status Last Time Buy Active

Engineering Selection Recommendations

The ADS7038IRTER is designated as the manufacturer-recommended substitute for the TLV2548IDWR. Both devices maintain identical 12-bit resolution, 8-channel single-ended input configuration, and SAR architecture, ensuring functional equivalence for core data acquisition requirements.

The ADS7038IRTER offers extended product lifecycle status as an Active component, providing long-term availability and supply chain stability compared to the Last Time Buy status of the TLV2548IDWR. Both parts maintain ROHS3 compliance and REACH unaffected certification, satisfying regulatory requirements.

The substitute device supports an extended operating temperature range (-40°C to 125°C versus -40°C to 85°C), providing additional thermal margin for demanding applications. The ADS7038IRTER features a higher sampling rate of 1 MSPS compared to the 200 kSPS of the original part, enabling faster conversion cycles when required by system architecture.

Package transition from 20-SOIC to 16-WQFN requires PCB layout modification and updated footprint design. The ADS7038IRTER incorporates additional integrated features including digital window comparator, GPIO, and oscillator functionality not present in the TLV2548IDWR.

Frequently Asked Questions (FAQ)

Q: Can the ADS7038IRTER directly replace the TLV2548IDWR without design changes?

A: The ADS7038IRTER maintains functional equivalence in resolution, input count, and SAR architecture. However, the package change from 20-SOIC to 16-WQFN requires PCB footprint redesign and layout modification. Signal integrity considerations and power distribution routing must be re-evaluated for the new package geometry.

Q: What are the key differences in supply voltage requirements?

A: The TLV2548IDWR requires 2.7V to 5.5V for both analog and digital supplies. The ADS7038IRTER supports 2.35V to 5.5V for analog supply and 1.65V to 5.5V for digital supply, offering greater flexibility in low-voltage applications. Existing power distribution designs operating at 2.7V or above remain compatible with the substitute.

Q: How does the sampling rate difference affect system performance?

A: The ADS7038IRTER operates at 1 MSPS compared to the TLV2548IDWR's 200 kSPS, providing five times faster conversion capability. Applications limited by the original sampling rate may benefit from improved temporal resolution. Systems designed for 200 kSPS operation remain fully functional with the faster substitute through software-controlled conversion rate management.

Q: Are there compatibility considerations for the SPI interface?

A: Both devices support SPI protocol. The TLV2548IDWR additionally supports DSP interface, which is not available on the ADS7038IRTER. Applications utilizing only SPI communication experience no interface compatibility issues. Designs dependent on DSP interface functionality require alternative solutions.

Q: What packaging considerations apply to the substitution?

A: The transition from 20-SOIC (0.295" width, 7.50mm) to 16-WQFN (3x3mm) represents a significant package size reduction. PCB layout must accommodate the new footprint dimensions, via placement, and thermal management requirements. The WQFN package includes an exposed pad for enhanced thermal performance.

Request Quote (Ships tomorrow)