TLV2473AIN Equivalent & Substitute Parts

Part Overview

The TLV2473AIN is a CMOS dual-channel operational amplifier manufactured by Texas Instruments, designed for rail-to-rail signal processing applications. This device integrates two independent amplifier circuits in a 14-pin DIP package with through-hole mounting configuration. The TLV2473AIN is designated as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is necessary to ensure design continuity and maintain component availability for new production runs and field replacements.

Substiute Parts

TLV2473AIN

Texas InstrumentsIn Stock: 1056TLV2473AIN Datasheet

Current PartRFQ

TLV2473AIDR

Texas InstrumentsIn Stock: 753TLV2473AIDR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the TLV2473AIN is determined by strict equivalence across all electrical and mechanical parameters. The substitute part must satisfy the following criteria:

Electrical Parameter Equivalence:

• Amplifier Type: CMOS
• Number of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 1.5 V/µs
• Gain Bandwidth Product: 2.8 MHz
• Current - Input Bias: 2.5 pA
• Voltage - Input Offset: 250 µV
• Current - Supply: 600 µA (per channel)
• Current - Output per Channel: 35 mA
• Voltage - Supply Span: 2.7 V to 6 V
• Operating Temperature Range: -40°C to 125°C

Mechanical and Packaging Considerations:

• Base Product Number: TLV2473 (same silicon die)
• Regulatory Compliance: ROHS3 Compliant, REACH Unaffected

The TLV2473AIDR is identified as the manufacturer-recommended substitute. This part shares identical electrical specifications and the same base product number, differing only in packaging format and mounting technology.

Parameter Comparison

Engineering Selection Recommendations

The TLV2473AIDR is the direct electrical equivalent of the TLV2473AIN. Both parts contain identical silicon die and deliver equivalent electrical performance across all specified parameters. The primary distinction lies in physical packaging and product lifecycle status.

For Through-Hole PCB Designs: The TLV2473AIN remains the appropriate choice if existing PCB layouts utilize 14-DIP footprints. However, given Last Time Buy status, inventory depletion is anticipated. Design migration to surface-mount technology should be evaluated for long-term production sustainability.

For New Designs or PCB Redesigns: The TLV2473AIDR is the recommended selection. This part is in Active product status, ensuring continued availability and supply chain stability. The 14-SOIC package enables smaller board footprints and is compatible with modern automated assembly processes. Tape & Reel packaging supports high-volume production workflows.

Regulatory and Compliance Alignment: Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying current environmental and regulatory requirements for electronic component manufacturing and distribution.

Frequently Asked Questions (FAQ)

Q: Can the TLV2473AIDR be used as a direct replacement for the TLV2473AIN in existing designs?

A: Electrical substitution is complete. The TLV2473AIDR delivers identical amplifier performance. However, physical substitution requires PCB redesign due to package differences. The TLV2473AIN uses 14-DIP through-hole mounting, while the TLV2473AIDR uses 14-SOIC surface-mount technology. Footprint conversion is necessary.

Q: What are the key differences between these two parts?

A: The differences are packaging-related only. The TLV2473AIN is supplied in tube format with through-hole DIP packaging. The TLV2473AIDR is supplied in Tape & Reel format with surface-mount SOIC packaging. All electrical specifications, performance characteristics, and regulatory compliance are identical.

Q: Why is the TLV2473AIN designated as Last Time Buy?

A: Last Time Buy status indicates Texas Instruments has discontinued production of this part number. This designation allows customers a final purchasing window before inventory depletion. The TLV2473AIDR remains in Active production status and represents the current manufacturing standard for this amplifier circuit.

Q: Are there any thermal or reliability differences between the two packages?

A: Both packages operate across the identical temperature range of -40°C to 125°C. Package selection affects thermal dissipation characteristics and board-level thermal management strategies, but electrical performance and rated specifications remain equivalent.

Q: What is the moisture sensitivity level difference?

A: The TLV2473AIN lists Moisture Sensitivity Level as Not Applicable. The TLV2473AIDR specifies MSL 1 (Unlimited), indicating the surface-mount package has minimal moisture absorption risk and requires no special storage or handling precautions.

Q: Can I use the TLV2473AIDR in a through-hole socket designed for the TLV2473AIN?

A: No. The TLV2473AIDR is a surface-mount component with a different pin configuration and footprint. Direct physical substitution into through-hole sockets is not possible. PCB redesign and component placement modification are required.

Q: Which part should I specify for new production designs?

A: Specify the TLV2473AIDR for new designs. This part is in Active production status, ensuring long-term availability and supply chain reliability. Surface-mount technology also aligns with current manufacturing standards and enables design optimization for modern PCB assembly processes.