TLV2471CP Equivalent & Substitute Parts

Part Overview

The TLV2471CP is a general-purpose operational amplifier manufactured by Texas Instruments, packaged in 8-PDIP (through-hole) configuration. This device features rail-to-rail output capability and operates across a 2.7 V to 6 V supply range, making it suitable for low-voltage analog signal processing applications. The TLV2471CP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this component.

Substiute Parts

TLV2471CP

Texas InstrumentsIn Stock: 1208TLV2471CP Datasheet

Current PartRFQ

TLV2471CDR

Texas InstrumentsIn Stock: 971TLV2471CDR Datasheet

MFR RecommendedRFQ

MCP601-E/P

Microchip TechnologyIn Stock: 2791MCP601-E/P Datasheet

MFR RecommendedRFQ

MCP601-I/P

Microchip TechnologyIn Stock: 4916MCP601-I/P Datasheet

MFR RecommendedRFQ

MCP6271-E/P

Microchip TechnologyIn Stock: 2092MCP6271-E/P Datasheet

MFR RecommendedRFQ

MCP6281-E/P

Microchip TechnologyIn Stock: 2069MCP6281-E/P Datasheet

MFR RecommendedRFQ

MCP6283-E/P

Microchip TechnologyIn Stock: 2520MCP6283-E/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2471CP is determined by the following critical parameters:

Primary Substitution Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Package / Case: 8-DIP (0.300", 7.62mm) for through-hole mounting compatibility
• Voltage - Supply Span: Minimum 2.7 V, Maximum 6 V
• RoHS Status: ROHS3 Compliant

Secondary Performance Parameters:

• Gain Bandwidth Product: 2.8 MHz (baseline)
• Slew Rate: 1.5 V/µs (baseline)
• Current - Supply: 600 µA (baseline)

Substitute parts must maintain compatibility with the 8-DIP through-hole package footprint and operate within the specified supply voltage range. Parts meeting these criteria are grouped into two categories: direct equivalents (identical base product number with different packaging) and functional substitutes (alternative manufacturers with equivalent electrical performance within acceptable tolerances).

Parameter Comparison

Engineering Selection Recommendations

Direct Equivalent (Same Base Product):

TLV2471CDR is the direct equivalent of TLV2471CP from Texas Instruments. Both devices share identical electrical specifications and are based on the TLV2471 base product number. The primary difference is packaging: TLV2471CDR uses 8-SOIC surface-mount configuration instead of 8-DIP through-hole. This substitute is applicable only when PCB design accommodates surface-mount technology. TLV2471CDR maintains Active product status, ensuring long-term availability and supply continuity.

Functional Substitutes (Through-Hole 8-DIP Package):

MCP601-E/P and MCP601-I/P (Microchip Technology) are functionally equivalent through-hole substitutes. Both maintain the 8-DIP package footprint and operate within the 2.7 V to 6 V supply range. These devices feature improved slew rate (2.3 V/µs versus 1.5 V/µs) and lower supply current (230 µA versus 600 µA). MCP601-E/P supports extended temperature range (-40°C to 125°C), while MCP601-I/P operates to -40°C to 85°C. Both are Active products with ROHS3 compliance.

MCP6271-E/P (Microchip Technology) is a functional substitute with reduced slew rate (0.9 V/µs) and lower supply current (170 µA). This device is suitable for applications where power consumption is critical and dynamic performance requirements are less stringent. Operating temperature range extends to -40°C to 125°C. Supply voltage minimum is 2 V, providing broader compatibility.

MCP6281-E/P and MCP6283-E/P (Microchip Technology) are functional substitutes with enhanced performance characteristics. Both feature higher gain bandwidth product (5 MHz versus 2.8 MHz) and improved slew rate (2.5 V/µs). These devices support extended temperature range (-40°C to 125°C) and maintain 8-DIP through-hole packaging. Supply voltage minimum is 2.2 V. MCP6281-E/P and MCP6283-E/P are suitable for applications requiring higher bandwidth performance while maintaining through-hole compatibility.

All substitute parts are ROHS3 compliant and REACH unaffected, meeting regulatory requirements equivalent to the original TLV2471CP.

Frequently Asked Questions (FAQ)

Q: Can TLV2471CDR replace TLV2471CP directly on the PCB?

A: TLV2471CDR is electrically equivalent but uses 8-SOIC surface-mount packaging instead of 8-DIP through-hole. Direct PCB replacement is not possible without redesigning the footprint and routing. TLV2471CDR is suitable only for new designs or PCBs with surface-mount capability.

Q: What are the key differences between MCP601-E/P and MCP601-I/P?

A: Both devices are identical in electrical performance and package type (8-DIP through-hole). The primary difference is operating temperature range: MCP601-E/P operates from -40°C to 125°C, while MCP601-I/P operates from -40°C to 85°C. Select MCP601-E/P for applications requiring extended high-temperature operation.

Q: Why does MCP6271-E/P have lower slew rate than the original TLV2471CP?

A: MCP6271-E/P is designed for low-power applications with reduced slew rate (0.9 V/µs) and lower supply current (170 µA). This device is suitable for applications where power consumption is the primary concern and dynamic performance requirements are less demanding. Applications requiring the original 1.5 V/µs slew rate should select MCP601-E/P or MCP6281-E/P instead.

Q: Are MCP6281-E/P and MCP6283-E/P interchangeable?

A: Yes, MCP6281-E/P and MCP6283-E/P are functionally interchangeable. Both devices share identical electrical specifications, including 5 MHz gain bandwidth product, 2.5 V/µs slew rate, and 8-DIP through-hole packaging. Both support -40°C to 125°C operating temperature range and are Active products with equivalent availability.

Q: What is the impact of higher supply current in TLV2471CP compared to MCP601-E/P?

A: TLV2471CP draws 600 µA supply current, while MCP601-E/P draws 230 µA. This 370 µA difference affects power consumption and thermal design. Applications with strict power budgets should consider MCP601-E/P or MCP6271-E/P. Applications with existing power supply capacity can use either device without modification.

Q: Can I use MCP6281-E/P in a design originally specified for TLV2471CP?

A: Yes, MCP6281-E/P is a functional substitute with enhanced performance. It maintains 8-DIP through-hole compatibility, operates within the 2.2 V to 6 V supply range (compatible with 2.7 V to 6 V requirement), and provides higher bandwidth (5 MHz versus 2.8 MHz) and faster slew rate (2.5 V/µs versus 1.5 V/µs). Extended operating temperature (-40°C to 125°C) provides additional margin. No circuit modifications are required.

Q: What is the significance of input bias current differences between substitutes?

A: TLV2471CP has 2.5 pA input bias current, while all Microchip substitutes have 1 pA. Lower input bias current reduces input offset drift and improves precision in high-impedance circuits. For most general-purpose applications, this difference is negligible. High-impedance sensor interfaces may benefit from the lower bias current of Microchip devices.

Q: Are all substitute parts RoHS3 compliant?

A: Yes, all substitute parts listed (TLV2471CDR, MCP601-E/P, MCP601-I/P, MCP6271-E/P, MCP6281-E/P, MCP6283-E/P) are ROHS3 compliant and REACH unaffected, meeting regulatory requirements equivalent to the original TLV2471CP.