Request Quote
(Ships tomorrow)
TLV2471AIP Equivalent & Substitute Parts
Part Overview
The TLV2471AIP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device features rail-to-rail output capability and is designed for low-power applications requiring single-circuit amplification. The TLV2471AIP is currently in Last Time Buy status, indicating discontinued production. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this component.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Amplifier Type | General Purpose | — |
| Number of Circuits | 1 | — |
| Output Type | Rail-to-Rail | — |
| Slew Rate | 1.5 | V/µs |
| Gain Bandwidth Product | 2.8 | MHz |
| Current - Input Bias | 2.5 | pA |
| Voltage - Input Offset | 250 | µV |
| Current - Supply | 600 | µA |
| Current - Output / Channel | 35 | mA |
| Voltage - Supply Span (Min) | 2.7 | V |
| Voltage - Supply Span (Max) | 6 | V |
| Operating Temperature | -40 to 125 | °C |
| Mounting Type | Through Hole | — |
| Package / Case | 8-DIP (0.300", 7.62mm) | — |
| RoHS Status | ROHS3 Compliant | — |
Substitute Part Grouping Explanation
Substitution eligibility for the TLV2471AIP is determined by the following critical parameters:
Primary Substitution Criteria:
- Amplifier Type: General Purpose
- Number of Circuits: 1
- Output Type: Rail-to-Rail
- Voltage Supply Range: Minimum 2.7 V, Maximum 6 V
- Operating Temperature Range: -40°C to 125°C
- Package Compatibility: 8-DIP through-hole or equivalent surface-mount variants
Secondary Compatibility Factors:
- Gain Bandwidth Product: 2.8 MHz (nominal reference)
- Slew Rate: 1.5 V/µs or higher
- Current - Supply: 600 µA or lower preferred for power-sensitive applications
- RoHS3 Compliance: Required for regulatory alignment
Substitute parts are grouped into two categories:
Category 1: Package-Compatible Substitutes (Through-Hole 8-DIP) Parts maintaining identical through-hole 8-DIP packaging for direct board-level replacement without layout modification.
Category 2: Functional Equivalents with Packaging Variation Parts providing equivalent electrical performance but in alternative packages (surface-mount 8-SOIC), requiring PCB redesign or adapter solutions.
Parameter Comparison
| Parameter | TLV2471AIP | TLV2471AIDR | MCP601-E/P | MCP601-I/P | MCP603-E/P | MCP6271-E/P |
|---|---|---|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Amplifier Type | General Purpose | General Purpose | General Purpose | General Purpose | General Purpose | General Purpose |
| Number of Circuits | 1 | 1 | 1 | 1 | 1 | 1 |
| Output Type | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail |
| Slew Rate (V/µs) | 1.5 | 1.5 | 2.3 | 2.3 | 2.3 | 0.9 |
| Gain Bandwidth Product (MHz) | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2 |
| Current - Input Bias (pA) | 2.5 | 2.5 | 1 | 1 | 1 | 1 |
| Voltage - Input Offset (µV) | 250 | 250 | 700 | 700 | 700 | 3000 |
| Current - Supply (µA) | 600 | 600 | 230 | 230 | 230 | 170 |
| Current - Output / Channel (mA) | 35 | 35 | 22 | 22 | 22 | 25 |
| Voltage - Supply Span (Min - Max) | 2.7 - 6 | 2.7 - 6 | 2.7 - 6 | 2.7 - 6 | 2.7 - 6 | 2 - 6 |
| Operating Temperature (°C) | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 85 | -40 to 125 | -40 to 125 |
| Mounting Type | Through Hole | Surface Mount | Through Hole | Through Hole | Through Hole | Through Hole |
| Package / Case | 8-DIP (0.300", 7.62mm) | 8-SOIC (0.154", 3.90mm) | 8-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) |
| Product Status | Last Time Buy | Active | Active | Active | Active | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
For Direct Through-Hole Package Replacement:
The MCP601-E/P, MCP601-I/P, and MCP603-E/P are the primary substitutes for the TLV2471AIP when through-hole 8-DIP packaging is required. All three maintain identical package geometry (8-DIP, 0.300", 7.62mm) and are pin-compatible for direct board-level substitution without PCB layout modification.
MCP601-E/P and MCP603-E/P both support the full operating temperature range of -40°C to 125°C, matching the TLV2471AIP specification. MCP601-I/P operates to 85°C maximum and is suitable only for applications not requiring the extended upper temperature limit.
All Microchip substitutes feature improved supply current efficiency (230 µA versus 600 µA) and lower input bias current (1 pA versus 2.5 pA), providing performance advantages in power-constrained and precision applications. The MCP6271-E/P offers the lowest supply current (170 µA) but operates at reduced slew rate (0.9 V/µs) and gain bandwidth product (2 MHz), making it suitable only for applications not requiring the original 1.5 V/µs slew rate performance.
For Surface-Mount Package Conversion:
The TLV2471AIDR provides functional equivalence in 8-SOIC surface-mount packaging. This part maintains identical electrical specifications to the TLV2471AIP and is manufactured by Texas Instruments, ensuring design continuity. Surface-mount conversion requires PCB redesign and is appropriate for new production runs or board revisions.
Compliance and Regulatory Alignment:
All substitute parts are ROHS3 compliant and REACH unaffected, maintaining regulatory alignment with the original TLV2471AIP. All parts carry EAR99 export classification and HTSUS code 8542.33.0001.
Frequently Asked Questions (FAQ)
Q: Can the MCP601-I/P be used in applications requiring operation above 85°C?
A: No. The MCP601-I/P is specified for -40°C to 85°C operation only. Applications requiring the full -40°C to 125°C range must use MCP601-E/P or MCP603-E/P.
Q: What is the difference between MCP601-E/P and MCP603-E/P?
A: Both parts are electrically identical and support -40°C to 125°C operation. The designation difference reflects internal manufacturing or qualification variations. Both are direct substitutes for the TLV2471AIP in through-hole applications.
Q: Is the TLV2471AIDR a direct replacement for the TLV2471AIP?
A: The TLV2471AIDR is electrically equivalent but uses 8-SOIC surface-mount packaging instead of 8-DIP through-hole packaging. Direct board-level substitution is not possible without PCB redesign. This part is suitable for new designs or board revisions requiring surface-mount technology.
Q: Can the MCP6271-E/P be used as a substitute?
A: The MCP6271-E/P is functionally compatible but operates at reduced slew rate (0.9 V/µs versus 1.5 V/µs) and lower gain bandwidth product (2 MHz versus 2.8 MHz). It is suitable only for applications not requiring the original slew rate performance. The lower supply voltage minimum (2 V versus 2.7 V) provides extended low-voltage operation capability.
Q: What are the key advantages of Microchip substitutes over the original TLV2471AIP?
A: Microchip MCP601 and MCP603 series offer reduced supply current (230 µA versus 600 µA), lower input bias current (1 pA versus 2.5 pA), and active product status ensuring long-term availability. These improvements benefit power-sensitive and precision applications.
Q: Are all substitute parts available in the same packaging options?
A: No. The TLV2471AIP and Microchip MCP601/MCP603/MCP6271 series are available in 8-DIP through-hole packaging. The TLV2471AIDR is available only in 8-SOIC surface-mount packaging. Package selection depends on PCB assembly technology and design constraints.
Q: What inventory levels are available for substitute parts?
A: Current inventory includes TLV2471AIDR (938 pcs), MCP601-E/P (2758 pcs), MCP601-I/P (4835 pcs), MCP603-E/P (1430 pcs), and MCP6271-E/P (2047 pcs). Inventory levels are subject to change and should be verified at time of procurement.
Q: Do all substitute parts meet RoHS3 compliance?
A: Yes. All listed substitute parts are ROHS3 compliant and REACH unaffected, maintaining regulatory alignment with the original TLV2471AIP.
Alternative Parts
SJ6012L2TP
Littelfuse Inc.
6 Alternative Parts
JMK107BBJ476MA-RE
Taiyo Yuden
10 Alternative Parts
GMK107BBJ475MA-T
Taiyo Yuden
5 Alternative Parts
SJ6020N2ARP
Littelfuse Inc.
3 Alternative Parts
SJ6025R2ATP
Littelfuse Inc.
4 Alternative Parts
2474-05L
API Delevan Inc.
1 Alternative Parts
4590R-684K
API Delevan Inc.
1 Alternative Parts
CM6560R-334
API Delevan Inc.
1 Alternative Parts
CM6460-104
API Delevan Inc.
1 Alternative Parts
5526-12
API Delevan Inc.
1 Alternative Parts

