TLV2470AIP Equivalent & Substitute Parts

Part Overview

The TLV2470AIP is a general-purpose operational amplifier manufactured by Texas Instruments, housed in an 8-PDIP through-hole package. This device features rail-to-rail output capability and is designed for low-power applications requiring single-circuit amplification. The TLV2470AIP is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this component.

Substiute Parts

TLV2470AIP

Texas InstrumentsIn Stock: 711TLV2470AIP Datasheet

Current PartRFQ

TLV2470IDR

Texas InstrumentsIn Stock: 735TLV2470IDR Datasheet

MFR RecommendedRFQ

MCP603-I/P

Microchip TechnologyIn Stock: 15824MCP603-I/P Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the TLV2470AIP is determined by the following critical parameters:

Functional Equivalence Criteria:

• Amplifier Type: General Purpose
• Number of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 2.8 MHz
• Voltage Supply Range: 2.7 V to 6 V

Package Compatibility Criteria:

• Mounting Type: Through Hole (primary requirement for direct PCB replacement)
• Package / Case: 8-DIP form factor

Compliance Requirements:

• RoHS3 Compliant
• REACH Unaffected
• ECCN: EAR99

The substitute parts identified below satisfy the functional and electrical requirements of the TLV2470AIP. Two categories of substitutes are provided: direct package equivalents and functional alternatives with different packaging options.

Parameter Comparison

Engineering Selection Recommendations

TLV2470IDR (Texas Instruments)

The TLV2470IDR is the manufacturer-recommended direct functional equivalent of the TLV2470AIP. Both devices share identical electrical specifications, including slew rate, gain bandwidth product, input bias current, input offset voltage, supply current, and output current. The TLV2470IDR maintains the same operating temperature range (-40°C to 125°C) and supply voltage specifications (2.7 V to 6 V). The primary difference is packaging: the TLV2470IDR uses 8-SOIC surface-mount packaging rather than 8-DIP through-hole packaging. This substitute is suitable for new designs or PCB redesigns that accommodate surface-mount technology. The TLV2470IDR holds Active product status, ensuring continued availability and manufacturer support.

MCP603-I/P (Microchip Technology)

The MCP603-I/P is a functionally compatible general-purpose operational amplifier with identical gain bandwidth product (2.8 MHz) and supply voltage range (2.7 V to 6 V). This device maintains the same 8-DIP through-hole package format as the TLV2470AIP, enabling direct PCB replacement without layout modifications. The MCP603-I/P demonstrates superior performance in specific parameters: higher slew rate (2.3 V/µs versus 1.5 V/µs), lower input bias current (1 pA versus 2.5 pA), and reduced supply current (230 µA versus 600 µA). The MCP603-I/P has a narrower operating temperature range (-40°C to 85°C) compared to the TLV2470AIP (-40°C to 125°C), which may be a limiting factor for high-temperature applications. The MCP603-I/P holds Active product status with substantial inventory availability (15,755 pieces).

Frequently Asked Questions (FAQ)

Q: Can the TLV2470IDR be used as a direct replacement for the TLV2470AIP on existing PCBs?

A: The TLV2470IDR is electrically equivalent but uses 8-SOIC surface-mount packaging instead of 8-DIP through-hole packaging. Direct PCB replacement is not possible without redesigning the footprint and PCB layout. The TLV2470IDR is suitable for new designs or boards that are being redesigned to accommodate surface-mount components.

Q: Is the MCP603-I/P a pin-compatible replacement for the TLV2470AIP?

A: Yes. Both devices use 8-DIP through-hole packaging with identical pin spacing (0.300", 7.62mm). The MCP603-I/P can be used as a direct PCB replacement without layout modifications. Electrical compatibility is confirmed across all critical parameters including supply voltage range, gain bandwidth product, and rail-to-rail output capability.

Q: What are the key differences between the TLV2470AIP and MCP603-I/P?

A: The primary differences are: (1) Slew Rate: MCP603-I/P is faster at 2.3 V/µs versus 1.5 V/µs; (2) Input Bias Current: MCP603-I/P is lower at 1 pA versus 2.5 pA; (3) Supply Current: MCP603-I/P is lower at 230 µA versus 600 µA; (4) Input Offset Voltage: TLV2470AIP is lower at 250 µV versus 700 µV; (5) Output Current: TLV2470AIP is higher at 35 mA versus 22 mA; (6) Operating Temperature: TLV2470AIP extends to 125°C while MCP603-I/P is limited to 85°C.

Q: Why is the TLV2470AIP classified as Last Time Buy?

A: Last Time Buy status indicates that Texas Instruments has discontinued production of this device. Existing inventory is available for purchase, but no future production runs are planned. This classification necessitates identifying and qualifying substitute parts for design continuity.

Q: Which substitute should I select for a high-temperature application requiring operation above 85°C?

A: The TLV2470IDR maintains the same operating temperature range as the TLV2470AIP (-40°C to 125°C). For applications requiring operation above 85°C, the TLV2470IDR is the appropriate choice. The MCP603-I/P is limited to 85°C maximum operating temperature and is not suitable for higher-temperature applications.

Q: Are all three devices RoHS3 compliant?

A: Yes. The TLV2470AIP, TLV2470IDR, and MCP603-I/P are all RoHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Q: What is the inventory status of these substitute parts?

A: The TLV2470AIP has 641 pieces in stock (Last Time Buy status). The TLV2470IDR has 715 pieces in stock (Active status). The MCP603-I/P has 15,755 pieces in stock (Active status), providing the highest availability for immediate procurement.