TLV2452AIP Equivalent & Substitute Parts

Part Overview

The TLV2452AIP is a general-purpose operational amplifier featuring dual circuits with rail-to-rail output capability, designed for low-power applications requiring precision signal conditioning. Manufactured by Texas Instruments, this component operates across a 2.7V to 6V supply range with a gain-bandwidth product of 220 kHz and slew rate of 0.11V/µs. The TLV2452AIP is currently designated as Last Time Buy, indicating discontinued production status. Identifying equivalent substitute parts is essential for design continuity, long-term supply chain planning, and new project implementations where active inventory is required.

Substiute Parts

TLV2452AIP
Texas InstrumentsIn Stock: 1089TLV2452AIP Datasheet
TLV2452AIP
Current Part
TLV2452AIDR
Texas InstrumentsIn Stock: 4011TLV2452AIDR Datasheet
TLV2452AIDR
MFR Recommended

Key Parameters

Parameter Value Unit
Amplifier Type General Purpose
Number of Circuits 2
Output Type Rail-to-Rail
Slew Rate 0.11 V/µs
Gain Bandwidth Product 220 kHz
Current - Input Bias 500 pA
Voltage - Input Offset 300 µV
Current - Supply (per Channel) 23 µA
Current - Output / Channel 10 mA
Voltage - Supply Span (Min) 2.7 V
Voltage - Supply Span (Max) 6 V
Operating Temperature Range -40 to 125 °C

Substitute Part Grouping Explanation

Substitution of the TLV2452AIP is determined by electrical parameter equivalence and functional compatibility. The substitute part must satisfy the following criteria:

Electrical Equivalence Requirements:

  • Dual-circuit general-purpose operational amplifier configuration
  • Rail-to-rail output capability
  • Identical slew rate: 0.11V/µs
  • Identical gain-bandwidth product: 220 kHz
  • Input bias current: 500 pA
  • Input offset voltage: 300 µV
  • Supply current per channel: 23µA
  • Output current per channel: 10 mA
  • Supply voltage range: 2.7V to 6V
  • Operating temperature range: -40°C to 125°C

Functional Compatibility: The substitute part must maintain identical electrical performance across all specified parameters to ensure direct functional replacement in existing circuit designs without circuit modification or re-qualification.

Packaging Consideration: While the TLV2452AIP uses through-hole 8-DIP packaging, substitute parts may employ surface-mount packaging (such as 8-SOIC) provided the electrical specifications remain unchanged. Packaging selection depends on the target application's assembly method and PCB design requirements.

Parameter Comparison

Parameter TLV2452AIP (Main Part) TLV2452AIDR (Substitute) Match Status
Manufacturer Texas Instruments Texas Instruments Identical
Category Linear, Amplifiers Linear, Amplifiers Identical
Amplifier Type General Purpose General Purpose Identical
Number of Circuits 2 2 Identical
Output Type Rail-to-Rail Rail-to-Rail Identical
Slew Rate 0.11 V/µs 0.11 V/µs Identical
Gain Bandwidth Product 220 kHz 220 kHz Identical
Current - Input Bias 500 pA 500 pA Identical
Voltage - Input Offset 300 µV 300 µV Identical
Current - Supply (per Channel) 23 µA 23 µA Identical
Current - Output / Channel 10 mA 10 mA Identical
Voltage - Supply Span (Min) 2.7 V 2.7 V Identical
Voltage - Supply Span (Max) 6 V 6 V Identical
Operating Temperature Range -40°C to 125°C -40°C to 125°C Identical
Base Product Number TLV2452 TLV2452 Identical
RoHS Status ROHS3 Compliant ROHS3 Compliant Identical
REACH Status REACH Unaffected REACH Unaffected Identical
ECCN EAR99 EAR99 Identical
HTSUS Code 8542.33.0001 8542.33.0001 Identical
Mounting Type Through Hole Surface Mount Different
Package / Case 8-DIP (0.300", 7.62mm) 8-SOIC (0.154", 3.90mm Width) Different
Product Status Last Time Buy Active Different
Inventory Status 998 Pcs New Original In Stock 3920 Pcs New Original In Stock Different

Engineering Selection Recommendations

Electrical Compatibility: The TLV2452AIDR provides complete electrical equivalence to the TLV2452AIP across all specified parameters. Both parts share the identical base product number (TLV2452) and deliver identical performance characteristics for dual-channel general-purpose amplification with rail-to-rail output capability.

Product Status Consideration: The TLV2452AIP is designated Last Time Buy, indicating end-of-life status with limited remaining inventory (998 pieces). The TLV2452AIDR maintains Active product status with significantly higher inventory availability (3920 pieces), ensuring long-term supply chain continuity and reduced procurement risk.

Compliance and Regulatory Status: Both parts maintain identical compliance certifications: ROHS3 Compliant, REACH Unaffected, and EAR99 export classification. Both share the same HTSUS code (8542.33.0001), confirming regulatory equivalence for procurement and customs purposes.

Packaging and Assembly Implications: The primary difference between these parts is packaging format. The TLV2452AIP uses through-hole 8-DIP packaging suitable for breadboard prototyping and through-hole PCB assembly. The TLV2452AIDR uses surface-mount 8-SOIC packaging, requiring surface-mount assembly capabilities. Selection between these formats depends on the target application's manufacturing process and PCB design specifications.

Moisture Sensitivity: The TLV2452AIDR carries MSL Level 1 (Unlimited), indicating minimal moisture sensitivity and simplified handling requirements compared to higher MSL ratings.

Frequently Asked Questions (FAQ)

Q: Can the TLV2452AIDR directly replace the TLV2452AIP in existing circuit designs?

A: Electrical replacement is complete. All specified electrical parameters are identical, including slew rate, gain-bandwidth product, supply current, output current, and operating temperature range. However, packaging differs: TLV2452AIP uses through-hole 8-DIP while TLV2452AIDR uses surface-mount 8-SOIC. Direct PCB substitution requires compatible assembly method and footprint design.

Q: What is the significance of the Last Time Buy status for TLV2452AIP?

A: Last Time Buy designation indicates Texas Instruments has discontinued production of the TLV2452AIP. Existing inventory (998 pieces) represents the final available stock. For new designs or long-term production requirements, the active TLV2452AIDR is the recommended selection to ensure supply continuity.

Q: Are there any performance differences between TLV2452AIP and TLV2452AIDR?

A: No performance differences exist. Both parts deliver identical electrical specifications across all measured parameters: 0.11V/µs slew rate, 220 kHz gain-bandwidth product, 500 pA input bias current, 300 µV input offset voltage, 23µA supply current per channel, and 10 mA output current per channel. Both operate across 2.7V to 6V supply range and -40°C to 125°C temperature range.

Q: What packaging considerations apply when selecting between these parts?

A: TLV2452AIP (8-DIP through-hole) suits applications using through-hole assembly, breadboard prototyping, or legacy PCB designs. TLV2452AIDR (8-SOIC surface-mount) suits modern surface-mount assembly processes and compact PCB layouts. Packaging selection depends on manufacturing capability and PCB design requirements, not electrical performance.

Q: Do both parts meet the same regulatory and compliance standards?

A: Yes. Both TLV2452AIP and TLV2452AIDR are ROHS3 Compliant, REACH Unaffected, and classified as EAR99 for export purposes. Both share HTSUS code 8542.33.0001. Regulatory equivalence is complete.

Q: What is the moisture sensitivity level difference, and does it matter?

A: TLV2452AIDR carries MSL Level 1 (Unlimited), indicating minimal moisture sensitivity and simplified handling during storage and assembly. TLV2452AIP lists MSL as Not Applicable. For practical purposes, the TLV2452AIDR's MSL Level 1 rating simplifies supply chain management and reduces moisture-related handling requirements.

Q: Which part should be selected for new design implementations?

A: The TLV2452AIDR is the appropriate selection for new designs. It maintains Active product status, offers higher inventory availability (3920 pieces versus 998 pieces), and ensures long-term supply security. Electrical performance is identical to TLV2452AIP. Packaging selection (8-SOIC surface-mount) aligns with contemporary PCB assembly practices.

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